【発明の詳細な説明】 本発明はIC等の回路を内蔵したカードに係り、
特に内蔵したICと基板上の導体との接合手法の
改良に関する。[Detailed Description of the Invention] The present invention relates to a card with a built-in circuit such as an IC,
In particular, it concerns improvements in bonding methods between built-in ICs and conductors on substrates.
金融機関等におけるコンピユータ端末機に利用
されるクレジツトカードは近年著しく普及し利用
度が高まつているが、現在普及しているクレジツ
トカードは磁気テープが貼着されていて、加入者
を証明する情報を磁気記憶させてある。このカー
ドをキヤツシユデイスペンサのカード挿入口に差
し込んで装置内の磁気ヘツドによつてカードの記
憶情報を読みとり、加入者との取り引きが行なわ
れるようになつている。しかしながら、取引の増
大と多様化に対応するコンピユータ側の容量とプ
ログラムの簡略化のために、最近、クレジツトカ
ードに磁気テープを貼着する他にICを組込んで、
記憶容量の増加と共に、演算機能も持たせるよう
にしたICメモリカードと称するものが提案され
ている。このような従来方法によるICメモリカ
ードの例を第１図〜第３図を参照して説明する
と、第１図は従来のICメモリカードを例示する
平面図、第２図は端子導体面での断面図、第３図
は第１図のａ−a′面に沿つた断面図、第４図は第
３図を拡大し、一部を破断して示した断面図であ
る。図中、１はICメモリカード、２はIC挿入部、
３は磁気テープ、４は端子部、５は端子導体、６
ａは導線、７はICチツプ、８ａ，８ｂは保護層、
９はベース、１０ａは基板、１１ａ，１１ｂは接
着部、１２はセラミツクを示す。第１図〜第３図
に示すように、ICメモリは、硬質合成樹脂材よ
りなるベース９を２枚の保護層８ａ，８ｂで挟ん
で張り合わせたもので、表面にIC挿入部２のエ
ンボス及び端子導体５の露出部である端子４が配
置され、裏面長手方向に磁気テープ３が貼着され
ている。端子４の部分は露出しており保護層８ｂ
の厚さだけ薄くなつている。IC挿入部２は第４
図に示すように、保護層８ａの上にベース９を、
その上に一部分に端子導体５をプリントした基板
１０を配置し、他の部分にセラミツク１２を接着
剤１１ａで接着し、セラミツク１２の上に電気回
路素子（ICチツプ）７を固定し、このICチツプ
７と端子導体５を導線６ａでワイヤボンデイング
している。この上を保護層８ｂで覆つて張り合わ
せてある。従つてIC挿入部２はエンボスを形成
している。 Credit cards used in computer terminals at financial institutions, etc. have become extremely popular and used more and more in recent years, but the currently popular credit cards have magnetic tape attached to them, and cannot contain information that proves the subscriber's identity. is stored magnetically. This card is inserted into the card slot of the cash dispenser, and the information stored on the card is read by a magnetic head within the device, allowing transactions with the subscriber to be carried out. However, in order to simplify computer capacity and programming in response to the increase and diversification of transactions, recently, in addition to attaching magnetic tape to credit cards, ICs have been incorporated into credit cards.
In addition to increasing storage capacity, a so-called IC memory card has been proposed that is also equipped with arithmetic functions. An example of an IC memory card made by such a conventional method will be explained with reference to FIGS. 1 to 3. FIG. 1 is a plan view illustrating a conventional IC memory card, and FIG. 3 is a sectional view taken along the a-a' plane of FIG. 1, and FIG. 4 is an enlarged sectional view of FIG. 3 with a part cut away. In the figure, 1 is an IC memory card, 2 is an IC insertion part,
3 is a magnetic tape, 4 is a terminal portion, 5 is a terminal conductor, 6
a is a conductor, 7 is an IC chip, 8a and 8b are protective layers,
9 is a base, 10a is a substrate, 11a and 11b are adhesive parts, and 12 is a ceramic. As shown in FIGS. 1 to 3, the IC memory is made by laminating a base 9 made of a hard synthetic resin material between two protective layers 8a and 8b, and has an embossed IC insertion portion 2 on the surface. A terminal 4, which is an exposed portion of the terminal conductor 5, is arranged, and a magnetic tape 3 is attached to the back surface in the longitudinal direction. The terminal 4 part is exposed and the protective layer 8b
It is thinner by the thickness of . IC insertion part 2 is the fourth
As shown in the figure, a base 9 is placed on the protective layer 8a,
A board 10 with terminal conductors 5 printed on one part is placed on top of it, a ceramic 12 is adhered to the other part with adhesive 11a, an electric circuit element (IC chip) 7 is fixed on top of the ceramic 12, and this IC The chip 7 and the terminal conductor 5 are wire-bonded using a conducting wire 6a. This is covered with a protective layer 8b and bonded together. Therefore, the IC insertion portion 2 forms an emboss.
また、磁気テープ３にはカード個有の番号のよ
うな書き替え不可能な情報が記憶されており、
ICには加入者暗証番号のような書き替え可能な
情報が記憶されている。 In addition, the magnetic tape 3 stores information that cannot be rewritten, such as the unique number of the card.
The IC stores rewritable information such as a subscriber's PIN number.
このような構成を有するので自動化装置等のカ
ード読取装置にカードを挿入することにより、情
報が読み取られセンターのコンピユータと交信し
て、加入者が装置の押釦を押して入れた暗証番号
との照合等が行なわれる。この間に数値変換を行
なう演算機能が利用される。 With this configuration, when the card is inserted into a card reading device such as an automated device, the information is read and communicated with a computer at the center, and the information is verified against the PIN number entered by the subscriber by pressing a button on the device. will be carried out. During this time, an arithmetic function that performs numerical conversion is used.
このような情報量を大きくすることに有利であ
るICカードは、書き替え可能な情報が故意に改
竄され易い欠点があつた。 Although IC cards are advantageous in increasing the amount of information, they have the disadvantage that rewritable information is easily tampered with.
本発明の目的は上述の欠点を解決するためのも
ので、信用度の高いICメモリカードを提供する
にある。 An object of the present invention is to solve the above-mentioned drawbacks, and to provide an IC memory card with high reliability.
ベース９上の基板１０ａの一部に、外部に信号
を取出すための端子導体５を有し、他部に該端子
導体５に接続された電気回路素子（ICチツプ）
７を固定したセラミツク基板１２を接着し、該素
子７と接続して回路構成される導体１３を有する
基板１０ｂを、前記素子７に対向して配置し、該
基板１０ｂの導体面１３と該素子７間を弱接着部
１２ａで接着し、該基板１０ｂの導体面の反対側
を保護層８ｂで覆うと共に、該基板１０ｂを該保
護層８ｂに強く接着したことを特徴としたカード
である。 A part of the board 10a on the base 9 has a terminal conductor 5 for taking out signals to the outside, and another part has an electric circuit element (IC chip) connected to the terminal conductor 5.
A ceramic substrate 12 on which the element 7 is fixed is bonded, and a substrate 10b having a conductor 13 connected to the element 7 to form a circuit is placed opposite the element 7, and the conductor surface 13 of the substrate 10b and the element 7 is bonded with a weak adhesive portion 12a, the opposite side of the conductive surface of the substrate 10b is covered with a protective layer 8b, and the substrate 10b is strongly bonded to the protective layer 8b.
以下本発明の一実施例を第５図を参照して説明
する。第５図は本発明によるICメモリカードを
拡大し一部を破断して示した断面図である。図
中、６ｂは導線、１０ｂは基板、１１ｃは接着
部、１２は弱接着部、１３は導体を示す。また第
１図〜第４図と同一個所は同符号で示している。
第５図に示すように、第４図の構成に加えてIC
チツプ７の上に、基板１０ｂに形成された導体１
３をICチツプ７に対向するように配置してICチ
ツプ７と導体１３を導線６ｂでワイヤボンデイン
グ（線強度100〜300ｇ／１本）すると共に接着力
の弱い接着剤で接着し（結合力70〜300ｇ）、弱接
着部１２ａとしている。更に基板１０ｂの上から
保護層８ｂを接着部１１ｃで固着（結合力３〜20
Kg）して保護している。こゝで基板１０ｂ上の導
体１３は、ICチツプ７と接続し回路構成してお
り、改竄のための改造外力（保護層を剥がしIC
チツプを露出する）により、ICチツプ７と基板
１０ｂを接続している導線６ｂが切断され、回路
動作が損なわれる。 An embodiment of the present invention will be described below with reference to FIG. FIG. 5 is an enlarged and partially cutaway sectional view of the IC memory card according to the present invention. In the figure, 6b is a conducting wire, 10b is a substrate, 11c is an adhesive part, 12 is a weak adhesive part, and 13 is a conductor. In addition, the same parts as in FIGS. 1 to 4 are indicated by the same reference numerals.
As shown in Figure 5, in addition to the configuration shown in Figure 4, an IC
A conductor 1 formed on the substrate 10b is placed on the chip 7.
3 is placed to face the IC chip 7, and the IC chip 7 and the conductor 13 are wire bonded with the conductor wire 6b (wire strength 100 to 300 g/piece) and bonded with a weak adhesive (bonding force 70). ~300g), which is the weakly bonded part 12a. Furthermore, the protective layer 8b is fixed from above the substrate 10b with the adhesive part 11c (bonding strength 3 to 20
Kg) and protected. Here, the conductor 13 on the board 10b is connected to the IC chip 7 to form a circuit, and external force for modification (by peeling off the protective layer and removing the IC chip) for tampering is required.
(exposing the chip), the conductive wire 6b connecting the IC chip 7 and the substrate 10b is cut, impairing circuit operation.
以上述べたように本発明によれば書き替え不可
能な情報の記憶容量を拡大でき、また故意にIC
メモリカードの記憶内容を改竄するための改造外
力が加わつた時は、弱接着部１２ａが破壊し易く
なつているので接着がはがれ、つれて導線６ｂが
切断して修復不可能な状態となり、このように手
を加えたカードは使用できなくなるので、改竄す
ることを極めて困難にするという効果がある。従
つてクレジツトカードの信用度を高めることがで
きる。 As described above, according to the present invention, it is possible to expand the storage capacity of information that cannot be rewritten, and it is also possible to intentionally
When an external force is applied to the modification to alter the memory contents of the memory card, the weak adhesive part 12a is easily destroyed, so the adhesive peels off and the conductive wire 6b is cut, resulting in an irreparable state. Cards that have been modified in this way become unusable, which has the effect of making it extremely difficult to tamper with them. Therefore, the credibility of the credit card can be improved.
第１図は従来のICメモリカードを例示する平
面図、第２図は端子導体面での断面図、第３図は
第１図のａ−a′面に沿つた断面図、第４図は第３
図を拡大し、一部を破断して示した断面図、第５
図は本発明によるカードを拡大し、一部を破断し
て示した断面図である。 図において、１はICメモリ、２はIC挿入部、
３は磁気テープ、４は端子部、５は端子導体、６
ａ，６ｂは導線、７はICチツプ、１２は弱接着
部、１３は導体である。 Fig. 1 is a plan view illustrating a conventional IC memory card, Fig. 2 is a cross-sectional view on the terminal conductor plane, Fig. 3 is a cross-sectional view along the a-a' plane of Fig. 1, and Fig. 4 is a cross-sectional view of the conventional IC memory card. Third
5th cross-sectional view showing an enlarged and partially broken view of the figure.
The figure is an enlarged, partially cutaway sectional view of a card according to the present invention. In the figure, 1 is IC memory, 2 is IC insertion part,
3 is a magnetic tape, 4 is a terminal portion, 5 is a terminal conductor, 6
A and 6b are conductive wires, 7 is an IC chip, 12 is a weakly bonded portion, and 13 is a conductor.
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9481481AJPS57209578A (en) | 1981-06-19 | 1981-06-19 | Card |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9481481AJPS57209578A (en) | 1981-06-19 | 1981-06-19 | Card |
| Publication Number | Publication Date |
|---|---|
| JPS57209578A JPS57209578A (en) | 1982-12-22 |
| JPS6337429B2true JPS6337429B2 (en) | 1988-07-25 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9481481AGrantedJPS57209578A (en) | 1981-06-19 | 1981-06-19 | Card |
| Country | Link |
|---|---|
| JP (1) | JPS57209578A (en) |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6142666U (en)* | 1984-08-15 | 1986-03-19 | カシオ計算機株式会社 | Card type electronic equipment |
| FR2599165A1 (en)* | 1986-05-21 | 1987-11-27 | Michot Gerard | OBJECT ASSOCIATED WITH ELECTRONIC ELEMENT AND METHOD OF OBTAINING |
| ATE176345T1 (en)* | 1993-04-14 | 1999-02-15 | Ake Gustafson | ELECTRONIC MARKING DEVICE |
| JP3687459B2 (en)* | 1999-06-29 | 2005-08-24 | ソニーケミカル株式会社 | IC card |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2337381A1 (en)* | 1975-12-31 | 1977-07-29 | Honeywell Bull Soc Ind | PORTABLE CARD FOR ELECTRICAL SIGNAL PROCESSING SYSTEM AND PROCESS FOR MANUFACTURING THIS CARD |
| Publication number | Publication date |
|---|---|
| JPS57209578A (en) | 1982-12-22 |
| Publication | Publication Date | Title |
|---|---|---|
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