【発明の詳細な説明】〔産業上の利用分野〕本発明はリードフレームに関する。[Detailed description of the invention][Industrial application field]The present invention relates to lead frames.
従来、エンチング加工リートフレームにおいては、第４
図示のように、モールド樹脂をロック効果をあげるため
に、サイドエッチ部分を太き（残し、厚み方向の中央部
に突起部６を有する断面形状にエツジ５が形成された。Conventionally, in an etched reed frame, the fourth
As shown in the figure, in order to improve the locking effect of the mold resin, the side etched portions were left thick (left), and an edge 5 was formed in a cross-sectional shape having a protrusion 6 at the center in the thickness direction.
しかしながら、サイドエツジ量は、板厚、エンチング条
件、或いは設計された絵柄寸法のバランスにより、大き
くなったり、或いは小さくなったりし、安定したサイド
エツジ量をリードフレームの全ての個所で確保すること
は極めて困難である。そのため、モールド樹脂の剥がれ
を、完全に防止することは出来なかった。However, the side edge amount increases or decreases depending on the board thickness, etching conditions, or the balance of designed pattern dimensions, and it is extremely difficult to ensure a stable side edge amount at all locations on the lead frame. It is. Therefore, peeling of the mold resin could not be completely prevented.
そこで、本発明が解決しようとする問題点は、優れたモ
ールド樹脂のロック効果を奏し、モールド樹脂の剥がれ
を防止したリードフレームを徒供することにある。Therefore, the problem to be solved by the present invention is to provide a lead frame that exhibits an excellent mold resin locking effect and prevents the mold resin from peeling off.
本発明者は上記の問題点を解決すべく研究の結果、リー
ドフレームの各部分のエッチを、リードフレームの表側
に向いた傾斜面を有する断面形状に形成する事により、
優れたロック効果を得ることが出来ることを見出し、か
かる知見に基づき、本発明を完成したものである。As a result of research to solve the above problems, the inventor of the present invention found that by forming the etch of each part of the lead frame into a cross-sectional shape having an inclined surface facing the front side of the lead frame,
We have discovered that an excellent locking effect can be obtained, and based on this knowledge, we have completed the present invention.
即ち、本発明は、「リードフレームのマウント部、及び
リード部のエツジが、リードフレームの表側に向いた傾
斜面を有する断面形状に形成されていることを特徴とす
るリートフレー１、。ｊを要旨とするものである。That is, the present invention provides a lead frame 1 characterized in that the mount part of the lead frame and the edge of the lead part are formed in a cross-sectional shape having an inclined surface facing the front side of the lead frame. That is.
第１図ａ及びｂは本発明に係るリードフレームを示す。Figures 1a and 1b show a lead frame according to the invention.
マウント部１、及びリード部２のエツジ３が、リードフ
レームの表側に向いた、即ちリードフレームの裏側より
表側に向かって傾斜した傾斜面４を有する断面形状に形
成されている。The mount part 1 and the edge 3 of the lead part 2 are formed in a cross-sectional shape having an inclined surface 4 facing toward the front side of the lead frame, that is, inclined from the back side toward the front side of the lead frame.
そして、マウント部ｌ、及びリード部２のマウント部寄
りの部分が、ＩＣ搭載部５として構成さている。The mount portion 1 and the portion of the lead portion 2 closer to the mount portion are configured as an IC mounting portion 5.
而して、本発明において、上記傾斜面を有するエツジは
、従来のサイドエンチ部を有するエツジよりもリードフ
レーム全域にわたって、安定して形成することが出来る
ので、リードフレーム全域にわたって、優れたロック効
果が奏せられるものである。According to the present invention, the edge having the above-mentioned inclined surface can be formed more stably over the entire area of the lead frame than the edge having the conventional side etch portion, so that an excellent locking effect can be achieved over the entire area of the lead frame. It is something that can be played.
リードフレームの表側に向いた傾斜面を有する断面形状
のエツジ部分は、リードフレームの裏側から表側に向か
う程開口部分が広くなっている開口部を形成し、また、
モールド樹脂との接触面積が大きいことから、リードフ
レームの開口部に充填されたモールド樹脂をしっかりと
固定し、優れたロック効果を奏するものである。The edge portion of the cross-sectional shape having the inclined surface facing the front side of the lead frame forms an opening that becomes wider from the back side toward the front side of the lead frame, and
Since the contact area with the mold resin is large, the mold resin filled in the opening of the lead frame is firmly fixed, and an excellent locking effect is achieved.
厚さ０．２７ｎ＋ｍの４２合金を用意し、この金属表面
の油、汚れ等の付着物を脱脂液を用いて取り除き、しか
るのち、金属板の両面にネガタイプの感光液、例えば（
ＭＲ−３）、諸星インキ■製を塗布し、８０〜１００°
Ｃを温度で加熱乾燥後、両面より第２図ａ１及びｂ図示
のように、表パターン１１、及び裏パターン１２をあて
がい、露光する。尚、第２図ａ、及びｂはリードフレー
ムのリード部に対応するパターン部分を部分的に示すも
のである。42 alloy with a thickness of 0.27n+m is prepared, oil, dirt, and other deposits on the metal surface are removed using a degreasing liquid, and then a negative type photosensitive liquid, for example (
MR-3), applied with Moroboshi Ink ■, 80-100°
After C is heated and dried at a high temperature, a front pattern 11 and a back pattern 12 are applied from both sides as shown in FIG. 2 a1 and b, and exposed. Incidentally, FIGS. 2a and 2b partially show the pattern portion corresponding to the lead portion of the lead frame.
両パターン１１．１２を真空密着させ、両面同時に高圧
水銀灯の紫外線に富んだ光にて露光し、次に３０〜４５
゛Ｃの温水にて現像し、レジストパターンを形成させる
。次いで両面より腐食液（３５〜４６’ Ｂ ｅ’ 、
５０〜６５°ＣのＦ ｅ Ｃｌ ｓ液）をノズルか
ら吹き掛け、不要部分をエツチングしてリードフレーム
を形成した。Both patterns 11 and 12 are vacuum-adhered and both sides are simultaneously exposed to light rich in ultraviolet rays from a high-pressure mercury lamp.
Developed with hot water (C) to form a resist pattern. Next, a corrosive liquid (35 to 46' B e',
A lead frame was formed by spraying F e Cl s solution at 50 to 65° C. from a nozzle and etching unnecessary portions.
その後、レジスト剥離液を用いて、レジストを除去し、
次いでメンキを施す。メッキは必要な前処理（酸、アル
カリ、水洗処理等）を行い、下地メッキを施した後、金
メッキを行う。この時、リードフレームのＩｃチップが
搭載される側には軟質の金メッキを、また反対面側は硬
質の金メッキを施す。表裏で異なるメッキを施すため、
どちらか片面をマスキングする治具を用意し、片面ずつ
メッキ作業を行う。After that, remove the resist using a resist stripping solution,
Next, menki is applied. For plating, perform the necessary pretreatment (acid, alkali, water washing, etc.), apply base plating, and then perform gold plating. At this time, soft gold plating is applied to the side of the lead frame on which the Ic chip is mounted, and hard gold plating is applied to the opposite side. In order to apply different plating on the front and back,
Prepare a jig to mask one side and perform plating on one side at a time.
上記の様にして形成したリードフレーム７を用い、第３
図示の如く、リードフレーム７の上に、第１図（ａ）図
示のＩｃ搭載部５に、補強用絶縁体２１として、熱硬化
型接着材が片面に塗布されている厚さ８０μのポリイミ
ドシート（商品名；リードフレーム固定用ポリイミドテ
ープＪＲ−２２５０，日東電工ａ勾製）を、温度１５０
°Ｃで加熱接着して、補強用絶縁体２１をリードフレー
ムに形成した。Using the lead frame 7 formed as described above, the third
As shown, a polyimide sheet with a thickness of 80 μm is coated on one side with a thermosetting adhesive as a reinforcing insulator 21 on the lead frame 7 and on the IC mounting portion 5 shown in FIG. 1(a). (Product name: Polyimide tape JR-2250 for lead frame fixing, manufactured by Nitto Denko A-G) at a temperature of 150
The reinforcing insulator 21 was formed on the lead frame by heat bonding at °C.
次に、上記補強用絶縁体２１上のチップダイパット部に
、熱硬化型エポキシダイ接着剤を塗布厚み２０μに形成
して、その接着剤層を介して、ＩＣチンプ２２をリード
フレーム７に設置した。Next, a thermosetting epoxy die adhesive is applied to the chip die pad portion on the reinforcing insulator 21 to a thickness of 20μ, and the IC chimp 22 is installed on the lead frame 7 via the adhesive layer. did.
次に、ワイヤーボンディング機により、ＩＣチップボン
ディング部と軟質金メッキされたリードフレームの端子
部とを、２５μ系の金ワイヤ−２３で結線した。Next, using a wire bonding machine, the IC chip bonding portion and the soft gold-plated terminal portion of the lead frame were connected with a 25 μ gold wire 23.
次に、結線が終了したＩＣチップとリードフレームをト
ランスファーモールド法により、エポキシ系のトランス
ファーモールド用樹脂（商品名、ＭＰ−１０，日東電工
■製）で片面樹脂封止した後、パンケージ単位に断裁し
、且つ必要とあれば、樹脂面を研磨して厚さ０．６５＋
ｎｍのＩＣモジニールを形成する。なお、第３図におい
て、７ａはリードフレームの母材、７ｂは銅メッキ層、
７ｃはＮｉメッキ層、７ｄは軟質金メッキ層、７ｅは硬
質金メッキ層を示す。Next, the IC chip and lead frame with the wiring completed are encapsulated on one side with epoxy transfer molding resin (product name: MP-10, manufactured by Nitto Denko ■) using the transfer molding method, and then cut into pancage units. And if necessary, polish the resin surface to a thickness of 0.65+
Form a nm IC module. In addition, in FIG. 3, 7a is the base material of the lead frame, 7b is the copper plating layer,
7c is a Ni plating layer, 7d is a soft gold plating layer, and 7e is a hard gold plating layer.
上記のようにして作成したＩｃモジュールをＩｃカード
基材に装着してＩＣカードを構成し上記のＩＣモジュー
ルの作成過程、及びＩＣカードの作成過程において、モ
ールド樹脂のリードフレームからの剥がれはみられなか
った。The IC module created as described above is attached to an IC card base material to construct an IC card, and no peeling of the mold resin from the lead frame was observed in the process of creating the IC module and the process of creating the IC card. There wasn't.
以上詳記したとおり、本発明によれば、モールド樹脂の
ロック効果に優れたリードフレームを提供することが出
来る。As detailed above, according to the present invention, it is possible to provide a lead frame with excellent locking effect of mold resin.
第１図ａ及びｂは本発明のリードフレームを示し、第１
図ａは部分的平面図、第１図すは背面図、第２図ａ及び
ｂはリードフレーム母材にパターンをあてがった状態を
示し、第２図ａは平面図、第２図すは断面図、第３図は
本発明のリードフレームを用いて形成したＩｃモジュー
ルの断面図、第４図は従来のリードフレームの、特にサ
イドエンチの状態を示す部分断面図である。４・・・・傾斜面第１図（ａ）第１図（ｂ）第２図（ａ）第２図（ｂ）第３図Figures 1a and b show the lead frame of the present invention;
Figure a is a partial plan view, Figure 1 is a rear view, Figures 2 a and b show the pattern applied to the lead frame base material, Figure 2 a is a plan view, and Figure 2 is a cross section. 3 are sectional views of an Ic module formed using the lead frame of the present invention, and FIG. 4 is a partial sectional view of a conventional lead frame, particularly showing the state of the side etch. 4...Slope Figure 1 (a) Figure 1 (b) Figure 2 (a) Figure 2 (b) Figure 3
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62125089AJP2548939B2 (en) | 1987-05-22 | 1987-05-22 | Lead frame for IC card |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62125089AJP2548939B2 (en) | 1987-05-22 | 1987-05-22 | Lead frame for IC card |
| Publication Number | Publication Date |
|---|---|
| JPS63289951Atrue JPS63289951A (en) | 1988-11-28 |
| JP2548939B2 JP2548939B2 (en) | 1996-10-30 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62125089AExpired - LifetimeJP2548939B2 (en) | 1987-05-22 | 1987-05-22 | Lead frame for IC card |
| Country | Link |
|---|---|
| JP (1) | JP2548939B2 (en) |
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| Date | Code | Title | Description |
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