【発明の詳細な説明】（産業上の利用分野）本発明は角柱状エレメントが所定の間隔で配列される２
次元アレイトランスデユーサの製造り法に関する。DETAILED DESCRIPTION OF THE INVENTION (Industrial Field of Application) The present invention provides a two-dimensional structure in which prismatic elements are arranged at predetermined intervals.
This invention relates to a method for manufacturing a dimensional array transducer.
（従来の技術）従来から、角柱状−エレメントが基盤口状に配列される
２次元アレイ［〜ランスデューりを製造する方法が種々
知られている。例えば、ｌ［Ｆ、［ＴＩＩＡＮＳ−ＡＣ
ＴＩＯＮＳ ＯＮ ＳＯＮ［Ｃ３ＡＮＤ ＵＬＴ
ＲＡＳＯＮＩＣ３，ＶＯＬ、５Ｕ−１９゜ＮＯ，４，０
ＣＴＯＢ［Ｉｔ １９７２にその一例が開示されている
。(Prior Art) Various methods have been known for manufacturing two-dimensional arrays in which prismatic elements are arranged in the shape of a base. For example, l[F, [TIIANS-AC
TIONS ON SON [C3AND ULT
RASONIC3, VOL, 5U-19°NO, 4,0
An example is disclosed in CTOB [It 1972.
上記開示によれば、２次元アレイトランスデユーサは第
７図（ａ）７５至（ｅ）に示す工程で作られる。According to the above disclosure, a two-dimensional array transducer is manufactured through the steps shown in FIGS. 7(a) to 75(e).
即ち、（１）薄い圧電板１の−・方の面を基盤口状にダイシン
グする（切込みは厚さ方向の約９３％）。これによりｔ
＋Ｓ目状に配列された角柱状エレメント２が構成される
（第７図（ａ））。That is, (1) the negative side of the thin piezoelectric plate 1 is diced in the shape of a base opening (the cut is about 93% in the thickness direction). This allows t
The prismatic elements 2 are arranged in a +S pattern (FIG. 7(a)).
（２）ダイシングし／、ｉ′い側から角柱状エレメント
２のコーナに貫通穴３を設ける（第７図（ｂ））。(2) Dicing/provide through holes 3 in the corners of the prismatic element 2 from the i′ side (FIG. 7(b)).
（３）圧電板１に対向する面が導体膜で被覆されている
バッキング材４に支持される絶縁被覆された導線５をｎ
通穴３に種通し、バッキング材４を圧電板３に接合して
一体化する（第７図（Ｃ））。(3) An insulated conductor 5 supported by a backing material 4 whose surface facing the piezoelectric plate 1 is covered with a conductive film is
A seed is passed through the through hole 3, and the backing material 4 is joined to the piezoelectric plate 3 to integrate it (FIG. 7(C)).
（４）角柱状エレメント２側に導かれた導線５を各エレ
メント２の頭に半Ｈ１付１プする（第７図（ｄ）及び（
ｅ）。（ｄ）図ではＩＯＸ １０個の角打状エレメント
が）１′田付りされてＪ３す、（Ｃ１図はその半ｌｆｌ
付は部の拡大図である）。半田（＝Ｉけされるエレメン
トの頭が個別電極となり、ダイシングされない圧電体１
の面に接合ケる導体膜が共通電極となる。(4) Connect the conductive wire 5 led to the prismatic element 2 side to the head of each element 2 with a half H1 (Fig. 7 (d) and (
e). (d) In the figure, IOX 10 square elements are attached to J3, (C1 is half of it)
The attached figure is an enlarged view of the section). Solder (= piezoelectric body 1 where the head of the element to be soldered becomes an individual electrode and is not diced)
The conductive film bonded to the surface becomes the common electrode.
ところＣ１上記の方法による２次元アレイ］・ランスデ
ユーりにおいで、各ニレメン１〜は完全に切離されてい
ないので、各エレメント間に８責的結合が存在する。こ
のよ゛うな結合があると＆饗特性が低下づる。従って、
昌費特性上から苦えば２次丸７レイ１〜ランスｆユーサ
の各エレメントｔま完全に切離されていた方が望ましい
。However, in the two-dimensional array C1 according to the above-described method], each element 1~ is not completely separated in the two-dimensional array according to the above method, so there are 8 reciprocal bonds between each element. If such a bond exists, the performance characteristics will deteriorate. Therefore,
From the viewpoint of cost characteristics, it is desirable that each element t of the secondary round 7 ray 1 to the lance f user be completely separated.
（発明が解決しようとする問題点）しかし、従来の製造１ノ法にあって（、（、Ｙ［電板を
完全にダイシング、即ら上記工程（１）における切込み
を１００％にすると、各エレメントがばらばらになるた
め、共通電極の引出し線の接続処理が難しくなる〈アー
ス電極の引出し方が難しくなる）。(Problem to be solved by the invention) However, in the conventional manufacturing method 1, (, Because the elements come apart, it becomes difficult to connect the common electrode lead wire (making it difficult to draw out the ground electrode).
又、従来の’ＦＪ造方法に４３ける個別電極の引出し方
法は、各電極位胃に対応させて圧電板に設ける貫通穴に
引出し線を挿通して（１うようになっているため、その
作業はＪ１常に煩わしいと言う問題がある。即ら、従来
の製造方法は、音響特性の改善が難しい上に、Ｒ産に適
していないと言える。In addition, the method for drawing out the individual electrodes in the conventional 'FJ manufacturing method is to insert the lead wire into a through hole provided in the piezoelectric plate corresponding to each electrode position. There is a problem in that the work is always troublesome.That is, conventional manufacturing methods are difficult to improve acoustic characteristics and are not suitable for R production.
本発明は、かかる点に鑑みてなされたムのであり、その
目的は、音饗的結合が少ない２次元アレイトランスデユ
ー量すを９産する製造１）仏を実現ザるにある。The present invention has been made in view of these points, and its purpose is to manufacture a two-dimensional array transducer with less acoustic coupling.
（問題点を解決づるための手段）上記目的を達成する本発明の２次元アレイ１−ランスデ
ューリ゛の装造方法は、複数の信号用ｓｒＡをバッキン
グ材に埋め込むようにして一体化するとさ、該導線の一
端をバッキング材の面に所定の間隔で配列し、他端を前
記以外の面から引出して一体化し、導線の配列面に両面
が導体化された圧電板を接着した後、圧電板を非接着側
から導線の配列に合せて所定の間隔でダイシングし、導
線と個々に接続されるエレメント群を作り、該ニレメン
１〜市の頭に金属箔を接合一体化して共通電極を構成す
るようになっている。(Means for Solving the Problems) A method for assembling a two-dimensional array 1-transducer according to the present invention that achieves the above object includes integrating a plurality of signal SRAs by embedding them in a backing material. One end of the conductor wires is arranged at a predetermined interval on the surface of the backing material, the other end is pulled out from a surface other than the above and integrated, a piezoelectric plate whose both sides are conductive is adhered to the surface where the conductor wires are arranged, and then the piezoelectric plate is Dice the pieces at predetermined intervals from the non-adhesive side according to the arrangement of the conductive wires to create a group of elements that are individually connected to the conductive wires, and integrate metal foil onto the top of the niremen 1 to 1 to form a common electrode. It has become.
（実施例）以下、本発明について図面を参照して詳細に説明する。(Example)Hereinafter, the present invention will be explained in detail with reference to the drawings.
第１図乃子０′！４図は本発明の一実施例による製造方
法の工程の説明図である。以下、各工程について説明づ
る、１（１）フレ）シＩル１リントボード１１に固定される信
日用′Ｑ線１２をバッキング材１３に埋め込むようにし
て一体化しブロック１４を作る（第１図（ａ））。ブロ
ックの面１４．において、信号用導線の一端１２ はバ
ッキング材の而１３ａとほぼ同一面をなすと」ξに、所
定の間隔で配列され、信号用導線の他端１２．は＋ｉｆ
ｆ記以外の面（而１４ａの反対側）から引出される。信
号用導線１２は第１図（ｂｌに示すように７し１シブル
プリントボード１１にストライブ状に銅箔を配列して形
成される。上記一体化は、第１図（Ｃ）に示すようにフ
レキシブルプリントボード１１とバッキング材１３とを
交互に配列し接着剤を用いて固定される。フレキシブル
プリントボード１１及びバッキング材１３に設けられて
いる貫通穴１５は一体化のときの位置決めに使われる。Figure 1 Noko 0′! FIG. 4 is an explanatory diagram of the steps of a manufacturing method according to an embodiment of the present invention. Each process will be explained below. Figure (a)). Block face 14. , one end 12 of the signal conducting wire is arranged at a predetermined interval on the same plane as the backing material 13a, and the other end 12. is +if
It is pulled out from the side other than f (the side opposite to 14a). The signal conductor 12 is formed by arranging copper foil in stripes on the printed board 11 as shown in FIG. 1(C). The flexible printed board 11 and the backing material 13 are arranged alternately and fixed using an adhesive.The through holes 15 provided in the flexible printed board 11 and the backing material 13 are used for positioning during integration. .
一体化後、必藍に応じてブロックの而１４８が研磨され
平坦の度合がａ）められる。又、フレキシブルプリント
ボード１１の引出し導線側は第１図（ａｌの矢印Ａのｈ
向に間隔をつめて束ねられる。After integration, the blocks 148 are polished according to the requirements and the degree of flatness is a) determined. In addition, the lead wire side of the flexible printed board 11 is shown in FIG.
They are bundled with closer spacing in the direction.
（２）両面が導体化されたＰ７丁からなる圧電板１６を
ブロックの面１４ａに接着する（第２図）。接着はブロ
ックの而１４ に半田シートを介（［シて圧電板１６を
設置し、該半［１シートを加熱する／ｊ法でもよいし、
導電性接着剤で接合面を接着させるようにしてもよい。(2) A piezoelectric plate 16 consisting of seven pieces of P, both sides of which are conductive, is adhered to the surface 14a of the block (FIG. 2). The bonding may be done by placing the piezoelectric plate 16 on the block 14 through a solder sheet and heating the half sheet.
The joining surfaces may be bonded using a conductive adhesive.
（３）圧電板１６を非接着側から信号用導線１の配列に
合せてダイシングする（第３図）。ダイシングの第１工
程は第３図のＸ方向で、又、第２工程は’Ｊ ＺＪ向で
夫々バッキング月１３に達する深さで行う。これによつ
−Ｃｌ盤目状に配列される角柱状エレメント８丁１７が
形成され、各エレメント１７は信号用導線の一端１２ａ
と個々に接続される。(3) Dice the piezoelectric plate 16 from the non-adhesive side in accordance with the arrangement of the signal conducting wires 1 (FIG. 3). The first step of dicing is carried out in the X direction in FIG. 3, and the second step is carried out in the 'J, Z, and J directions to a depth that reaches the backing moon 13, respectively. As a result, eight prismatic elements 17 arranged in a -Cl grid pattern are formed, and each element 17 is connected to one end 12a of the signal conductor.
and are individually connected.
（４）各エレメント群７の頭に金属箔１８を接合一体化
して共通電極を作る（第４図）。(4) Metal foil 18 is bonded and integrated to the head of each element group 7 to form a common electrode (FIG. 4).
上記の各工程によって作られる２次元アレイトランスデ
ユーサにおいて、角柱状エレメント群１７を形成するピ
ッチは、Ｘ方向及びｙ方向の双方とも完全なダイシング
によって作られので、各エレメント１７間におりる音”
ｔＲ的結合が小さくなる。In the two-dimensional array transducer made by each of the above steps, the pitch forming the prismatic element group 17 is made by perfect dicing in both the X direction and the Y direction, so the sound that falls between each element 17 ”
The tR-like bond becomes smaller.
又、各角柱状ニレメン１へ１７と信号用導線１２との接
続はブロックの面１４ａに配列される一端１２ で行わ
れる。即ち、ブロックの面１４８に接合する圧電数１６
を信号用導線の一端１２８の配列に合せてダイシングす
ることによって実現されるので、個別電極と信号用導線
との接続作業を別途に行う必要がない。更に、共通電極
は角柱状エレメント１７の頭に金属箔１８を被覆すると
いう単純な作業によって行われる。Further, the connection between each prismatic double member 1 17 and the signal conducting wire 12 is made at one end 12 arranged on the face 14a of the block. That is, the piezoelectric number 16 bonded to the face 148 of the block
This is achieved by dicing according to the arrangement of one end 128 of the signal conducting wire, so there is no need to perform a separate connection work between the individual electrodes and the signal conducting wire. Furthermore, the common electrode is formed by simply covering the top of the prismatic element 17 with a metal foil 18.
尚、発明は上記実施例に限定するものではない。Note that the invention is not limited to the above embodiments.
例えば、信号用導線は通常の硬性のプリント基板やマル
チワイへ７ボードを用いて構成するようにしＣしよい。For example, the signal conductor may be constructed using an ordinary rigid printed circuit board or a multi-wire board.
又、バラ４ング拐等からなるブロックを第５図又は第６
図のように構成してもよい。第５図のブロック２０にお
いて、電線の素線（信号用導線）２１はエボ１シ、フエ
ライ１ヘゴム雪の中に整然と並べられ一体化されている
。又、第〔３図のブロック２２は、信号用導線２３が形
成されたフレ４シブルブリン１−ボード２４とフェライ
トゴムシート２５とを小ねで渦状に巻いて一体化されて
いる。ブ１コック２２の場合、ブロックの而２２、にお
ける信号用導線の一端２３．の配列は正方格子分布にな
らないので、該−’１７Ａ ２３ ａの配列に合せて行
う圧電板のダイシングの方向は極座標で定義した方がＪ
、い。In addition, the block consisting of four pieces of roses, etc. is shown in Figure 5 or 6.
It may be configured as shown in the figure. In block 20 of FIG. 5, electric wire strands (signal conducting wires) 21 are neatly arranged and integrated in the rubber snow. In addition, the block 22 in FIG. 3 is formed by winding a flexible 1-board 24 on which a signal conducting wire 23 is formed and a ferrite rubber sheet 25 in a spiral shape with a small screw so as to be integrated. In the case of block 1 cock 22, one end 23 of the signal conductor in block 22. Since the arrangement of is not a square lattice distribution, it is better to define the direction of dicing of the piezoelectric plate according to the arrangement of -'17A 23 a using polar coordinates.
,stomach.
（発明の効末）以上説明の通り、本発明の２次元アレイトランスデユー
サの製造方法よれば、廂数の信号用導線をバッキング材
に埋め込むようにして一体化するとき、該導線の一端を
バッキング材の面に所定の間隔で配列し、他端を前記以
外の面から引出して一体化し、導線の配列面に両面が導
体化された圧電数を接着した後、ｒ′ｆ電板を非接着側
から導線の配列に合Ｖて所定の間隔でダイシングし、導
線と叫々に接続されるエレメント群を作り、該エレメン
トｆｌＴの頭に金属箔を接合一体化して共通電極として
いるため、角柱状エレメント同土間のｉｆｆ的結合が小
さくなる。又、個別電極と信号用導線との１＆続作業を
別途に行う必要がない。更に、共通電極と各角柱状エレ
メントとの接続は単純な操作で行うことができる。従っ
て、本発明の製造り法によればＲＮ的結合を小さくした
２次元アレイトランスデユーサを８産することができる
。(End of the invention) As explained above, according to the method of manufacturing a two-dimensional array transducer of the present invention, when a different number of signal conducting wires are embedded and integrated in a backing material, one end of the conducting wires is Arrange the piezoelectric wires on the surface of the backing material at predetermined intervals, pull out the other end from the surface other than the above to integrate them, and glue the piezoelectric wires with conductors on both sides on the surface where the conductors are arranged, and then attach the r'f electric plate to the Dicing is performed from the adhesion side at predetermined intervals according to the arrangement of the conductor wires to create a group of elements that are connected to the conductor wires, and a metal foil is integrally bonded to the head of the element flT to form a common electrode. The IF coupling between the columnar elements and the same soil becomes smaller. In addition, there is no need to separately perform one-and-connection work between the individual electrodes and the signal conducting wire. Furthermore, the connection between the common electrode and each prismatic element can be made by a simple operation. Therefore, according to the manufacturing method of the present invention, eight two-dimensional array transducers with reduced RN coupling can be produced.
第１図（ａ）乃至（Ｃ）、第２図、第３図及び第４図は
本発明の一実施例によるの％ＡｊΔ■程の説明図、第５
図は及び第６図は本発明の他の実施例によるブロックを
示す構成図、第７図は従来の２次元アレイトランスデユ
ーサの製造工程の説明図である。１１及び２／１・・・フレキシブルプリントボード、１
２及び２３・・・信号用導線、１２８及び１２ｂ・・・
導線の端、１３・・・バッキング材、１４．２０及び２
２・・・ブロック、１４ａ・・・ブロックの面、１５・
・・０通穴、１６・・・圧電板、１７・・・角柱状エレ
メント１８・・・共通型ＫＡ（金属ｆｆ１）、２１・・
・電線の東線、２５・・・フェライトゴムシート。FIGS. 1(a) to (C), FIGS. 2, 3, and 4 are explanatory diagrams of %AjΔ■ according to an embodiment of the present invention, and FIG.
6 and 6 are block diagrams showing blocks according to another embodiment of the present invention, and FIG. 7 is an explanatory diagram of the manufacturing process of a conventional two-dimensional array transducer. 11 and 2/1...Flexible printed board, 1
2 and 23...signal conductor wires, 128 and 12b...
End of conductor, 13...Backing material, 14.20 and 2
2...Block, 14a...Block surface, 15.
...0 through hole, 16...piezoelectric plate, 17...prismatic element 18...common type KA (metal ff1), 21...
・East wire of electric wire, 25...ferrite rubber sheet.
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61293898AJPS63146699A (en) | 1986-12-10 | 1986-12-10 | Manufacture of two-dimension array transducer |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61293898AJPS63146699A (en) | 1986-12-10 | 1986-12-10 | Manufacture of two-dimension array transducer |
| Publication Number | Publication Date |
|---|---|
| JPS63146699Atrue JPS63146699A (en) | 1988-06-18 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61293898APendingJPS63146699A (en) | 1986-12-10 | 1986-12-10 | Manufacture of two-dimension array transducer |
| Country | Link |
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| US7757389B2 (en) | 2006-06-28 | 2010-07-20 | Ge Medical Systems Global Technology Company, Llc | Method of manufacturing an ultrasonic probe |
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