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JPS6272047U - - Google Patents

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Publication number
JPS6272047U
JPS6272047UJP1985162495UJP16249585UJPS6272047UJP S6272047 UJPS6272047 UJP S6272047UJP 1985162495 UJP1985162495 UJP 1985162495UJP 16249585 UJP16249585 UJP 16249585UJP S6272047 UJPS6272047 UJP S6272047U
Authority
JP
Japan
Prior art keywords
carrier plate
workpiece
double
head surface
surface grinder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1985162495U
Other languages
Japanese (ja)
Other versions
JPH0226608Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filedfiledCritical
Priority to JP1985162495UpriorityCriticalpatent/JPH0226608Y2/ja
Publication of JPS6272047UpublicationCriticalpatent/JPS6272047U/ja
Application grantedgrantedCritical
Publication of JPH0226608Y2publicationCriticalpatent/JPH0226608Y2/ja
Expiredlegal-statusCriticalCurrent

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Description

Translated fromJapanese
【図面の簡単な説明】[Brief explanation of the drawing]

第1図はこの考案の一実施例を示す図面、第2
図はこの考案に用いられるキヤリヤプレートの平
面図、第3図は第2図のA―A線に於ける拡大断
面図、第4図は従来例を示す図面である。 1…フレーム、2,3…クイル、8,9…回転
主軸、12,13…砥石、14…キヤリヤプレー
ト、17,18…ドレツサー砥石。
Figure 1 is a drawing showing an embodiment of this invention;
The figure is a plan view of a carrier plate used in this invention, FIG. 3 is an enlarged sectional view taken along the line AA in FIG. 2, and FIG. 4 is a drawing showing a conventional example. DESCRIPTION OF SYMBOLS 1... Frame, 2, 3... Quill, 8, 9... Rotating main shaft, 12, 13... Grindstone, 14... Carrier plate, 17, 18... Dresser grindstone.

Claims (1)

Translated fromJapanese
【実用新案登録請求の範囲】[Scope of utility model registration request] 砥石をその研削面を互いに対向させて配置し、
この両砥石間にキヤリヤプレートによりワークを
搬入して該ワークの両面を同時に上記両砥石で研
削加工する両頭平面研削盤に於いて、上記キヤリ
ヤプレートの上下面外周縁に所定の幅寸法でダイ
ヤモンド砥粒等を電着させて当該部分にドレツサ
ー砥石を形成したことを特徴とする両頭平面研削
盤。
Arrange the grindstones with their grinding surfaces facing each other,
In a double-head surface grinder that carries a workpiece between the two grinding wheels using a carrier plate and simultaneously grinds both sides of the workpiece with the two grinding wheels, a predetermined width dimension is formed on the outer periphery of the upper and lower surfaces of the carrier plate. A double-head surface grinder characterized in that a dresser grindstone is formed on the part by electrodepositing diamond abrasive grains or the like.
JP1985162495U1985-10-231985-10-23ExpiredJPH0226608Y2 (en)

Priority Applications (1)

Application NumberPriority DateFiling DateTitle
JP1985162495UJPH0226608Y2 (en)1985-10-231985-10-23

Applications Claiming Priority (1)

Application NumberPriority DateFiling DateTitle
JP1985162495UJPH0226608Y2 (en)1985-10-231985-10-23

Publications (2)

Publication NumberPublication Date
JPS6272047Utrue JPS6272047U (en)1987-05-08
JPH0226608Y2 JPH0226608Y2 (en)1990-07-19

Family

ID=31089808

Family Applications (1)

Application NumberTitlePriority DateFiling Date
JP1985162495UExpiredJPH0226608Y2 (en)1985-10-231985-10-23

Country Status (1)

CountryLink
JP (1)JPH0226608Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
JP2010283371A (en)*2001-08-302010-12-16Siltronic AgMethod for producing semiconductor wafer, and semiconductor wafer

Citations (2)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
JPS49137188U (en)*1973-03-081974-11-26
JPS60103654U (en)*1983-12-211985-07-15光洋機械工業株式会社 Shaping and sharpening device for grinding wheel in double-head surface grinder

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
JPS49137188U (en)*1973-03-081974-11-26
JPS60103654U (en)*1983-12-211985-07-15光洋機械工業株式会社 Shaping and sharpening device for grinding wheel in double-head surface grinder

Cited By (1)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
JP2010283371A (en)*2001-08-302010-12-16Siltronic AgMethod for producing semiconductor wafer, and semiconductor wafer

Also Published As

Publication numberPublication date
JPH0226608Y2 (en)1990-07-19

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