第1図はこの考案の一実施例を示す図面、第2
図はこの考案に用いられるキヤリヤプレートの平
面図、第3図は第2図のA―A線に於ける拡大断
面図、第4図は従来例を示す図面である。 1…フレーム、2,3…クイル、8,9…回転
主軸、12,13…砥石、14…キヤリヤプレー
ト、17,18…ドレツサー砥石。 Figure 1 is a drawing showing an embodiment of this invention;
The figure is a plan view of a carrier plate used in this invention, FIG. 3 is an enlarged sectional view taken along the line AA in FIG. 2, and FIG. 4 is a drawing showing a conventional example. DESCRIPTION OF SYMBOLS 1... Frame, 2, 3... Quill, 8, 9... Rotating main shaft, 12, 13... Grindstone, 14... Carrier plate, 17, 18... Dresser grindstone.
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985162495UJPH0226608Y2 (en) | 1985-10-23 | 1985-10-23 |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985162495UJPH0226608Y2 (en) | 1985-10-23 | 1985-10-23 |
| Publication Number | Publication Date |
|---|---|
| JPS6272047Utrue JPS6272047U (en) | 1987-05-08 |
| JPH0226608Y2 JPH0226608Y2 (en) | 1990-07-19 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985162495UExpiredJPH0226608Y2 (en) | 1985-10-23 | 1985-10-23 |
| Country | Link |
|---|---|
| JP (1) | JPH0226608Y2 (en) |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010283371A (en)* | 2001-08-30 | 2010-12-16 | Siltronic Ag | Method for producing semiconductor wafer, and semiconductor wafer |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49137188U (en)* | 1973-03-08 | 1974-11-26 | ||
| JPS60103654U (en)* | 1983-12-21 | 1985-07-15 | 光洋機械工業株式会社 | Shaping and sharpening device for grinding wheel in double-head surface grinder |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49137188U (en)* | 1973-03-08 | 1974-11-26 | ||
| JPS60103654U (en)* | 1983-12-21 | 1985-07-15 | 光洋機械工業株式会社 | Shaping and sharpening device for grinding wheel in double-head surface grinder |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010283371A (en)* | 2001-08-30 | 2010-12-16 | Siltronic Ag | Method for producing semiconductor wafer, and semiconductor wafer |
| Publication number | Publication date |
|---|---|
| JPH0226608Y2 (en) | 1990-07-19 |
| Publication | Publication Date | Title |
|---|---|---|
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