【考案の詳細な説明】〔技術分野〕 本考案はリレーの機能アツプを図る上で、トラ
ンジスタ等よりなる電子回路をIC化し、これを
リレー本体内に内蔵したリレーに関する。[Detailed Description of the Invention] [Technical Field] The present invention relates to a relay in which an electronic circuit made of transistors and the like is integrated into an integrated circuit (IC) built into the relay body in order to increase the functionality of the relay.
近年の電子技術の発達に伴ない各種の半導体素
子（トランジスタ、サイリスタ）等の電子回路部
品をIC化してチツプとし、これをリレーに組み
込んで従来にない新しいより高度な機能を持たせ
た所謂メカトロリレー（電子回路とリレーを組み
合せたリレー）が造出されて来た。 With the development of electronic technology in recent years, so-called mechatronics has created chips by converting various semiconductor elements (transistors, thyristors) and other electronic circuit parts into IC chips, which are then incorporated into relays to provide new and more advanced functions than ever before. Relays (relays that combine electronic circuits and relays) have been created.
而して、そのICチツプはセラミツク等の無機
質板にゲート接続された状態で表面側を耐熱性樹
脂にて被覆して貼着され、且つ更に無機質板はプ
リント板と配線接続された状態で同様に樹脂にて
貼着されるのである。 The IC chip is gate-connected to an inorganic board such as ceramic, and the surface side is coated with heat-resistant resin, and then the inorganic board is connected to a printed circuit board with wiring. It is attached with resin.
さて、このICチツプには50〜100mmＡの制御電
流を流すが、例えば実験によると93mmＡを流した
場合、そのプリント板の下面側（ICチツプと反
対側）の温度は120℃（但し周囲温度26℃下で）
になつた。 Now, a control current of 50 to 100 mmA is passed through this IC chip. For example, according to an experiment, when 93 mmA is passed through the IC chip, the temperature on the bottom side of the printed board (the side opposite to the IC chip) is 120°C (however, the ambient temperature is 26°C). below ℃)
It became.
従つて、ICチツプが耐熱樹脂にて被覆された
内部、即ちICチツプの表面はそれ以上の温度に
なつていることが予想され、ICチツプの破壊温
度が130℃であるから極めて危険な状態ともいえ
る。 Therefore, it is expected that the inside of the IC chip coated with heat-resistant resin, that is, the surface of the IC chip, will reach a temperature higher than that, and since the breakdown temperature of an IC chip is 130°C, this is an extremely dangerous situation. I can say that.
本考案は上記の点に鑑みてなしたものであつ
て、即ちICチツプが貼着される無機質板の周囲
に放熱用切欠部を形成したものであつて、これに
よりその無機質板の熱放散を良好にし、もつて
ICチツプの温度上昇による破壊を阻止すること
を目的としたものである。 The present invention was developed in view of the above points, namely, a heat dissipation notch is formed around an inorganic plate to which an IC chip is attached, thereby increasing the heat dissipation of the inorganic plate. Make it good and keep it
The purpose is to prevent IC chips from being destroyed due to temperature rise.
（実施例） 以下本考案の一実施例として掲げた図面に基ず
い説明すると、１はリレー本体で、カバー２とベ
ース３とで構成されている。４はこのリレー本体
１内に収納された接触部、コイル、ヨーク、アマ
チユア等の機械的駆動部で、本体１の機械室１ａ
に位置する。５はリレードライブ回路をIC化し
たICチツプ、６はこのICチツプ５から出たゲー
ト線、７はこのICチツプ５が耐熱性樹脂にて貼
着されるセラミツク等の無機質板で、該板７には
ICチツプ５のゲート線６が挿通する貫通孔８が
穿つている。又、下面には該ゲート線６がハンダ
付けされる電極部９が設けられている。更にこの
板７にはICチツプ５の外側位置となるよう放熱
用切欠部１０が形成されている。この切欠部１０
を第２図では溝状に形成し、第４図では丸孔とし
ており、何れでもよい。１１はICチツプ５を無
機質板７に被覆して貼着する耐熱性樹脂層でゲー
ト線６及び貫通孔８おも被覆する。１２はプリン
ト板で、表面に配線路１３を形成しており、前記
無機質板７が載置してその電極部９と配線路１３
とがハンダ付けされて貼着する。尚、このプリン
ト板１２はガラス、エポキシ樹脂等で成型して可
撓性（フレキシブプリント板ともいう）を付与
し、第１図の本体１のIC室１ｂにカールして収
納している。１４はプリント板１２の配線路１３
の末端に接続し、且つベース３から垂下した外部
用端子板である。(Example) An explanation will be given below based on the drawings presented as an example of the present invention. Reference numeral 1 denotes a relay body, which is composed of a cover 2 and a base 3. Reference numeral 4 denotes a mechanical drive unit such as a contact part, a coil, a yoke, and an armature, which are housed in the relay body 1, and are housed in the machine room 1a of the body 1.
Located in Reference numeral 5 denotes an IC chip in which a relay drive circuit is integrated, 6 a gate line coming out from this IC chip 5, 7 an inorganic plate such as ceramic to which this IC chip 5 is adhered with heat-resistant resin; for
A through hole 8 is bored through which the gate line 6 of the IC chip 5 is inserted. Further, an electrode portion 9 to which the gate line 6 is soldered is provided on the lower surface. Furthermore, a heat dissipation notch 10 is formed in this plate 7 so as to be located outside the IC chip 5. This notch 10
In FIG. 2, it is formed into a groove shape, and in FIG. 4, it is formed into a round hole, but either one is acceptable. Reference numeral 11 covers the gate line 6 and the through hole 8 with a heat-resistant resin layer that covers and adheres the IC chip 5 to the inorganic plate 7. Reference numeral 12 denotes a printed board, on the surface of which a wiring path 13 is formed, on which the inorganic board 7 is placed and the electrode portion 9 and the wiring path 13 are formed.
are soldered and attached. The printed board 12 is molded with glass, epoxy resin, etc. to give it flexibility (also referred to as a flexible printed board), and is stored in the IC chamber 1b of the main body 1 in FIG. 1 in a curled manner. 14 is the wiring path 13 of the printed board 12
This is an external terminal board connected to the end of the base 3 and hanging down from the base 3.
本考案は上記の如く、リレードライブ回路を
IC化してリレー本体１内に収納されるICチツプ
５と、このICチツプ５のゲート線６と接続する
電極部９を設け、且つ耐熱性樹脂にてそのICチ
ツプ５をゲート線６と共に被覆して貼着すると共
に、而もそのICチツプ５の外側位置に多数の放
熱用切欠部１０を有する無機質板１２と、この無
機質板１２を貼着すると共に、而も前記無機質板
１２の電極部９と表面の配線回路１３とを接続す
るプリント板１２とでなしたから、無機質板１２
の放熱面積が大きくなつてICチツプ５の熱が無
機質板１２を介して放熱し、もつて電子回路内蔵
型リレーの最も難問とされたICチツプの温度上
昇からの破壊を阻止でき、而もその分ICチツプ
の電力量をアツプできるから、大きな制御電流に
も対応できる効果がある。 As mentioned above, this invention uses a relay drive circuit.
An IC chip 5 that is converted into an IC and stored in the relay body 1, and an electrode section 9 that connects to the gate wire 6 of this IC chip 5 are provided, and the IC chip 5 and the gate wire 6 are covered with heat-resistant resin. At the same time, an inorganic plate 12 having a large number of heat dissipation notches 10 is attached to the outside of the IC chip 5, and an inorganic plate 12 is attached to the electrode section 9 of the inorganic plate 12. and the printed board 12 that connects the wiring circuit 13 on the surface, the inorganic board 12
The heat dissipation area of the IC chip 5 is increased, and the heat of the IC chip 5 is dissipated through the inorganic plate 12, thereby preventing the IC chip from being destroyed due to temperature rise, which was considered the most difficult problem with relays with built-in electronic circuits. Since the power amount of the IC chip can be increased by a minute, it has the effect of being able to handle large control currents.
図面は本考案電子回路内蔵型リレーの一実施例
を示し、第１図は一部切欠正面図、第２図は斜視
図、第３図は断面図、第４図は他の実施例であ
る。 １……リレー本体、２……カバー、３……ベー
ス、４……機械的駆動部、５……ICチツプ、６
……ゲート線、７……無機質板、９……電極部、
１０……切欠部、１１……耐熱樹脂層、１２……
プリント板、１３……配線路。 The drawings show one embodiment of the relay with a built-in electronic circuit according to the present invention, in which Fig. 1 is a partially cutaway front view, Fig. 2 is a perspective view, Fig. 3 is a sectional view, and Fig. 4 is another embodiment. . 1...Relay body, 2...Cover, 3...Base, 4...Mechanical drive section, 5...IC chip, 6
... Gate line, 7 ... Inorganic plate, 9 ... Electrode part,
10...Notch portion, 11...Heat-resistant resin layer, 12...
Printed board, 13...Wiring path.
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1293383UJPS59119542U (en) | 1983-01-31 | 1983-01-31 | Relay with built-in electronic circuit |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1293383UJPS59119542U (en) | 1983-01-31 | 1983-01-31 | Relay with built-in electronic circuit |
| Publication Number | Publication Date |
|---|---|
| JPS59119542U JPS59119542U (en) | 1984-08-11 |
| JPS6245412Y2true JPS6245412Y2 (en) | 1987-12-04 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1293383UGrantedJPS59119542U (en) | 1983-01-31 | 1983-01-31 | Relay with built-in electronic circuit |
| Country | Link |
|---|---|
| JP (1) | JPS59119542U (en) |
| Publication number | Publication date |
|---|---|
| JPS59119542U (en) | 1984-08-11 |
| Publication | Publication Date | Title |
|---|---|---|
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