第1図は本考案自動水替花瓶の要部破断側面図
。第2図は固定脚の側断面図、縦断面図。第3図
は水溜部の側断面図。第4図は本考案の流出管を
内蔵した一例としての要部破断側面図。第5図は
本考案の他の実施例の斜視図。 1は流入口、2は流出口、3,4は管、5は水
溜部、6は手洗水穴。 FIG. 1 is a cutaway side view of the main parts of the automatic water changing vase of the present invention. Figure 2 is a side sectional view and a longitudinal sectional view of the fixed leg. FIG. 3 is a side sectional view of the water reservoir. FIG. 4 is a cutaway side view of essential parts as an example of a built-in outflow pipe of the present invention. FIG. 5 is a perspective view of another embodiment of the present invention. 1 is an inlet, 2 is an outlet, 3 and 4 are pipes, 5 is a water reservoir, and 6 is a hand wash hole.
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5248186UJPS62164875U (en) | 1986-04-07 | 1986-04-07 |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5248186UJPS62164875U (en) | 1986-04-07 | 1986-04-07 |
| Publication Number | Publication Date |
|---|---|
| JPS62164875Utrue JPS62164875U (en) | 1987-10-20 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5248186UPendingJPS62164875U (en) | 1986-04-07 | 1986-04-07 |
| Country | Link |
|---|---|
| JP (1) | JPS62164875U (en) |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7253109B2 (en) | 1997-11-26 | 2007-08-07 | Applied Materials, Inc. | Method of depositing a tantalum nitride/tantalum diffusion barrier layer system |
| US9390970B2 (en) | 1997-11-26 | 2016-07-12 | Applied Materials, Inc. | Method for depositing a diffusion barrier layer and a metal conductive layer |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7253109B2 (en) | 1997-11-26 | 2007-08-07 | Applied Materials, Inc. | Method of depositing a tantalum nitride/tantalum diffusion barrier layer system |
| US9390970B2 (en) | 1997-11-26 | 2016-07-12 | Applied Materials, Inc. | Method for depositing a diffusion barrier layer and a metal conductive layer |