JPS62160171A - Method for coating resin - Google Patents

Abstract

PURPOSE:To prevent the creeping of a resin to a coating back surface side, in coating a resist by spin coating, by blowing air to the peripheral edge part of the specimen on a rotary disc from below. CONSTITUTION:After a proper amount of a resin 3 is dripped at the almost central position of the resin coating surface 21 of the specimen R sucked to the suction surface of a support stand 1, the support stand 1 is rotated at about 500 rpm and a predetermined amount of air is sent from a pipe 5. The resin 3 is spread to the outer peripheral side of the specimen 2 on the resin coating surface 2' thereof by the action of centrifugal force due to the rotation of the support stand 1 and reaches the peripheral edge part 22 of the specimen 2 to be ready to creep to the side of the black surface 23 of the specimen 2. However, because air is blown to the peripheral edge part 22 of the specimen 2 from below toward an obliquely upward direction, the resin 3 ready to creep is interrupted by the peripheral edge part 22 on the surface of the specimen 2 and not adhered to the back surface 23.

Description

Translated fromJapanese

【発明の詳細な説明】産業上意Ｅｌ豆団本発明は、例えば半導体装置の製造過程におけるレジス
トプロセスに関係し、試料の樹脂塗布面の背面側に樹脂
を廻り込ませないように改良した樹脂の塗布方法に関す
る。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a resist process in the manufacturing process of semiconductor devices, for example, and relates to an improved resin that prevents resin from going around to the back side of the resin-coated surface of a sample. The present invention relates to a method of applying.

■来二伎亙レジストプロセスにおいて、レジストを塗布するには、
スピンコード、スプレーコートおよびディップコート等
の方法がある。ところで、塗布した膜の安定性および均
一性という点においては、前記スピンコードつまり試料
としてのウェハを真空でチャックして高速回転させなが
ら行う方法が優れているので、この方法が従来では主に
用いられている。■To apply the resist in the Raijiki resist process,
Methods include spin cording, spray coating, and dip coating. By the way, in terms of the stability and uniformity of the coated film, the spin cord, that is, the method of chuckling the wafer as a sample in a vacuum and rotating it at high speed, is superior, so this method has been mainly used in the past. It is being

、■が７２しよ゛とするい　占とごろで、上述したスピンコードにおいては、試料を回
転させている際に、当該試料の樹脂塗布面の背面側にレ
ジストが廻り込んでしまうことがある。廻り込んだレジ
ストは、後工程により硬化することとなり、結局廻り込
んだレジストを作業者がカッター等で除去しなければな
らず、煩わしいと共に後工程への進行を妨げてしまうと
いう問題点を生じる。, ■ is about 72. By the way, in the above-mentioned spin code, when the sample is rotated, the resist may get wrapped around the back side of the resin-coated surface of the sample. . The resist that has gone around will be hardened in the subsequent process, and the operator will have to remove the resist that has gone around with a cutter or the like, which is troublesome and will hinder the process from proceeding to the next process.

本発明は上記問題点を解決するために創案されたもので
、その目的は、試料の樹脂塗布面の背面側に樹脂を廻り
込ませない樹脂の塗布方法を提供することにある。The present invention was devised to solve the above-mentioned problems, and its purpose is to provide a resin coating method that does not allow resin to go around to the back side of the resin-coated surface of a sample.

ｒ１１占をｔＬ゛るための一交本発明にかかる樹脂の塗布方法は、試料の樹脂塗布面に
樹脂を滴下してから、該試料を回転させると共に、当該
試料の周縁部に対して下方から試料の周縁部に向かう風
を吹きつけるようにしている。The resin coating method according to the present invention for increasing the r11 ratio is to drop the resin onto the resin-coated surface of the sample, rotate the sample, and apply the resin to the periphery of the sample from below. The wind is directed towards the periphery of the sample.

作用−回転によって試料の周縁部に樹脂が広がるが、試料の周
縁部に対して吹きつける下方から上方向きの風により、
前記樹脂が試料の樹脂塗布面の背面側に廻り込みにくく
なる。Effect - The resin spreads around the periphery of the sample due to rotation, but due to the wind blowing from the bottom to the top against the periphery of the sample,
The resin is less likely to go around to the back side of the resin-coated surface of the sample.

災胤医以下、図面を参照して本発明の一実施例を詳細に説明す
る。DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described in detail below with reference to the drawings.

第１図ｆａ）において、符号ｌは縦断面略Ｔ字状の試料
支持台を示しており、真空チャックとしての機能を有し
ている。この支持台１の吸着面１１には、例えば半導体
ウェハなどの試料２が吸着保持されている。この試料２
の上方には、例えばレジストなどの樹脂３を滴下させる
樹脂供給器（図示省略）のノズル４が配置されている。In FIG. 1 fa), the reference numeral 1 indicates a sample support stand having a substantially T-shaped longitudinal section, and has a function as a vacuum chuck. A sample 2 such as a semiconductor wafer, for example, is held by suction on the suction surface 11 of the support base 1 . This sample 2
A nozzle 4 of a resin supply device (not shown) for dropping a resin 3 such as resist, for example, is arranged above the nozzle 4 .

そして、支持台１の外周には４本の風供給用のパイプ５
が等角度でもって配設されている。パイプ５の各先端は
、支持台１の吸着面１１よりも僅かに低くなるように位
置されている。パイプ５からは、第１図（ｂ）に示すよ
うに、試料２の中央から外方向にかつ下方から斜め上方
に向かう風を送出させるようになっている。There are four wind supply pipes 5 on the outer periphery of the support base 1.
are arranged at equal angles. Each tip of the pipe 5 is positioned slightly lower than the suction surface 11 of the support base 1. As shown in FIG. 1(b), the pipe 5 sends out air outward from the center of the sample 2 and from below to diagonally upward.

このような構成のスピンコード装置を用いて、試料２の
樹脂塗布面２１に樹脂膜を形成する方法について説明す
る。A method of forming a resin film on the resin-coated surface 21 of the sample 2 using the spin cord apparatus having such a configuration will be described.

まず、支持台ｌの吸着面１１上に吸着された試料２の樹
脂塗布面２１の略中央位置に、適量の樹脂３を滴下して
から、支持台１を約５０Ｏｒｐｍで回転させると共に、
パイプ５から所定量の風を送る。さて、支持台１の回転
により樹脂３は遠心力に起因して試料２の樹脂塗布面２
１を外周側に向かって広がっていく。試料２の周縁部２
２に樹脂３が到達して試料２の背面２３側に廻り込もう
とするが、試料２の周縁部２２に対して風を下方から斜
め上方に向かって吹きつけているので、廻り込もうとす
る樹脂３は試料２表面の周縁部２２にせきどめされる。First, an appropriate amount of resin 3 is dropped onto the approximately central position of the resin-coated surface 21 of the sample 2 adsorbed on the suction surface 11 of the support 1, and then the support 1 is rotated at about 50 rpm.
A predetermined amount of air is sent from the pipe 5. Now, due to the rotation of the support base 1, the resin 3 is applied to the resin-coated surface of the sample 2 due to centrifugal force.
1 is expanded toward the outer periphery. Peripheral part 2 of sample 2
The resin 3 reaches the sample 2 and tries to go around the back side 23 of the sample 2, but since the wind is blowing diagonally upward from below against the peripheral edge 22 of the sample 2, the resin 3 tries to go around the back side 23 of the sample 2. The resin 3 is held back at the peripheral edge 22 of the surface of the sample 2.

なお、上記実施例において、樹脂３の硬化温度に基づい
て吹きつけるべき風の温度を設定すると、樹脂３を試料
２の周縁部２２で硬化させることができるので、樹脂３
のせきどめがより一層効果的になる。In the above example, if the temperature of the air to be blown is set based on the curing temperature of the resin 3, the resin 3 can be cured at the peripheral edge 22 of the sample 2.
Cough-stopping becomes even more effective.

溌」■と１果本発明によれば、試料の樹脂塗布面の背面側に樹脂が廻
り込もうとするのを有効に防止できるので、従来のよう
に廻り込んだ樹脂の除去といった人手による煩わしい作
業が不要となり、結局工程の進行をスムーズにさせるこ
とができる。According to the present invention, it is possible to effectively prevent the resin from going around to the back side of the resin-coated surface of the sample. This eliminates the need for additional work and allows the process to proceed smoothly.

【図面の簡単な説明】[Brief explanation of drawings]

第１図（ａ）は本発明の一実施例に用いるスピンコード
装置の構成概略図、第１図（ｂ）は試料に対して吹きつ
ける風の向きを示す説明図である。２・・・試料２１・・・樹脂塗布面２２・・・周縁部２３・・・背面３・・・樹脂。全壱トへ（ａ）（ｂ）第１図FIG. 1(a) is a schematic diagram of the configuration of a spin code apparatus used in an embodiment of the present invention, and FIG. 1(b) is an explanatory diagram showing the direction of wind blowing against a sample. 2...Sample 21...Resin coated surface 22...Peripheral portion 23...Back surface 3...Resin. To all parts (a) (b) Figure 1

Claims (1)

Translated fromJapanese

【特許請求の範囲】[Claims]（１）試料の樹脂塗布面に樹脂を滴下してから、該試料
を回転させると共に、当該試料の周縁部に対して下方か
ら試料の周縁部に向かう風を吹きつけることを特徴とす
る樹脂の塗布方法。(1) After dropping resin onto the resin-coated surface of a sample, the sample is rotated and wind is blown from below toward the periphery of the sample. Application method.