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JPS62133079A - Surface hardening treatment of soft magnetic precision parts - Google Patents

Surface hardening treatment of soft magnetic precision parts

Info

Publication number
JPS62133079A
JPS62133079AJP27199085AJP27199085AJPS62133079AJP S62133079 AJPS62133079 AJP S62133079AJP 27199085 AJP27199085 AJP 27199085AJP 27199085 AJP27199085 AJP 27199085AJP S62133079 AJPS62133079 AJP S62133079A
Authority
JP
Japan
Prior art keywords
plating
soft magnetic
precision parts
degreasing
treatment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP27199085A
Other languages
Japanese (ja)
Other versions
JPH0244902B2 (en
Inventor
Hitoshi Ito
均 伊藤
Kiyomitsu Suga
須賀 清光
Keiichi Yonezawa
米沢 恵一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seikosha KK
Original Assignee
Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seikosha KKfiledCriticalSeikosha KK
Priority to JP27199085ApriorityCriticalpatent/JPH0244902B2/en
Publication of JPS62133079ApublicationCriticalpatent/JPS62133079A/en
Publication of JPH0244902B2publicationCriticalpatent/JPH0244902B2/en
Anticipated expirationlegal-statusCritical
Expired - Lifetimelegal-statusCriticalCurrent

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Abstract

PURPOSE:To improve the wear resistance of a material to be treated without losing the magnetic characteristics by subjecting the material to annealing in vacuum, specified pretreatment for plating and electroless chemical Co-P plating. CONSTITUTION:Precision parts made of soft magnetic silicon steel are annealed in vacuum so as to obtain desired magnetic characteristics and to prevent the formation of oxide films on the surfaces. The parts are pretreated by degreasing with an org. solvent, degreasing with alkali, pickling and treatment for removing silicon oxide with a mixed acid-inhibitor soln. The parts are then subjected to electroless chemical Co-P plating.

Description

Translated fromJapanese

【発明の詳細な説明】[産業上の利用分野]この発明は、プリンターの印字駆動部に使用されるアー
マチアやヨークのように、磁気回路を構成するとともに
耐摩耗性が要求される精密部品の表面硬化処理方法に関
するものである。
[Detailed Description of the Invention] [Industrial Application Field] This invention is applicable to precision parts that constitute a magnetic circuit and require wear resistance, such as armatures and yokes used in the printing drive section of printers. The present invention relates to a surface hardening treatment method.

[従来の技術]従来において、軟磁特性が要求される精密部品、たとえ
ばプリンターの印字駆動部のアーマチア、ヨーク等には
、電磁軟鉄、ケイ素鋼等の表面に防錆および耐摩耗性を
付与する目的でNiメッキ、Znメッキ、C「メッキ、
N1−P無電解メッキなどがほどこされている。
[Prior Art] Conventionally, precision parts that require soft magnetic properties, such as armatures and yokes of printing drive parts of printers, have been made of electromagnetic soft iron, silicon steel, etc. for the purpose of imparting rust prevention and wear resistance to their surfaces. Ni plating, Zn plating, C plating,
N1-P electroless plating etc. are applied.

[発明が解決しようとする問題点]上記従来例において、Niメッキ、Znメッキは表面硬
度がHV400程度であり耐摩耗性で問題がある。Cr
メッキはHV800程度であり耐久性は有利であるが電
気メッキのため部品へのメッキの付き回りにムラがあり
、量産上不適当である。N i −Pメッキでも耐摩耗
性がHV400以下と低いので問題である。なおN i
 −Pメッキ後400℃前後で熱処理を行なうとHV8
00程度に向上するが、その場合材料本来の磁気特性に
劣化が生じるため使用することができない。
[Problems to be Solved by the Invention] In the conventional example described above, the surface hardness of Ni plating and Zn plating is about HV400, and there is a problem in wear resistance. Cr
The plating has an HV of about 800, which is advantageous in terms of durability, but because it is electroplated, the plating coverage on parts is uneven, making it unsuitable for mass production. Even with Ni-P plating, the wear resistance is low at HV400 or less, which is a problem. Furthermore, N i
-If heat treated at around 400℃ after P plating, HV8
00, but in that case, the inherent magnetic properties of the material deteriorate, making it unusable.

[問題点を解決するための手段]この発明はこうした従来例における問題点を解決するた
めのものであり、ケイ素鋼部材に対し、まず、磁気特性
を得る目的、および表面の酸化膜の形成防止を兼ねて真
空中において焼鈍し、ついでメッキのための前処理とし
て、有機溶剤による脱脂処理、アルカリによる脱脂処理
、酸洗い処理、さらに酸とインヒビターの混合液による
シリコン酸化物除去処理を施した後、コバルト・リン系
無電解化学メッキを施すことにより、被処理材の磁性特
性を損なうことなく、耐摩耗性の向上した表面硬化処理
をするものである。
[Means for Solving the Problems] The present invention is intended to solve the problems in the conventional examples, and first, it is aimed at obtaining magnetic properties and preventing the formation of an oxide film on the surface of silicon steel members. Then, as pretreatment for plating, it is degreased with an organic solvent, degreased with an alkali, pickled, and silicon oxide removed with a mixture of acid and inhibitor. By applying cobalt-phosphorus electroless chemical plating, the surface of the treated material is hardened to improve wear resistance without impairing the magnetic properties of the treated material.

[実施例〕まず素材として3%ケイ素鋼を用い、所定の部品形状に
加工しておく。このケイ素鋼は磁気特性はすぐれている
が、表面が活性のため酸化膜(Si02)を形成しやす
い材料である。
[Example] First, 3% silicon steel is used as a material and processed into a predetermined part shape. Although this silicon steel has excellent magnetic properties, it is a material that tends to form an oxide film (Si02) due to its active surface.

本発明による処理法は、第一ステップとして、ケイ素鋼
本来の磁気特性を得る目的とともにケイ素鋼表面に酸化
膜の形成防止を兼ねて、真空中において850℃、1時
間の焼鈍をおこなう。この場合、真空雰囲気以外のN2
、Ar等の無酸化雰囲気では表面見かけ上光輝に仕上が
るが、最終的なメッキ仕上り後の密着性が不十分であり
、真空雰囲気による熱処理が必要とされる。
In the treatment method according to the present invention, as a first step, annealing is performed at 850° C. for 1 hour in a vacuum for the purpose of obtaining the original magnetic properties of silicon steel and also to prevent the formation of an oxide film on the surface of silicon steel. In this case, N2 other than vacuum atmosphere
In a non-oxidizing atmosphere such as , Ar, etc., the surface appears to be shiny, but the adhesion after the final plating finish is insufficient, and heat treatment in a vacuum atmosphere is required.

第二のステップとして、無電解Coメッキの前処理とし
て次の工程の処理をする。
As a second step, the next process is performed as a pretreatment for electroless Co plating.

(1)脱脂処理として、主に鉱物油の除去を目的として
有機溶剤による処理をする。有機溶剤として、例えば1
−1−1 )リクロルエタンの液中に超音波をかけて約
3分間浸漬する。
(1) As degreasing treatment, treatment with an organic solvent is performed mainly for the purpose of removing mineral oil. As an organic solvent, for example, 1
-1-1) Apply ultrasonic waves to the liquid of lychloroethane and immerse it for about 3 minutes.

(2)ついで第二の脱脂処理として、主に動で、植物浦
の除去を目的として、アルカリと表面活性剤の混合液、
たとえばオルソケイ酸ソーダのような市販のアルカリ脱
脂剤で、被処理材を揺動しながら約3分間液中に浸漬す
る。
(2) Next, as a second degreasing treatment, a mixed solution of alkali and a surfactant is
For example, the material to be treated is immersed in a commercially available alkaline degreasing agent such as sodium orthosilicate for about 3 minutes while being rocked.

(3)つぎに主に鉄の酸化物の除去を目的として、7%
の塩酸水溶液中で約10〜30秒彼処理材を揺動しなが
ら浸漬する。
(3) Next, mainly for the purpose of removing iron oxides, 7%
The treated material is immersed in the hydrochloric acid aqueous solution for about 10 to 30 seconds while rocking.

(4)さらに主にシリコンの酸化物の除去を目的として
、フッ素化合物を主成分とした、酸とインヒビターの混
合液の希釈液中に被処理物を揺動しながら10〜30秒
間浸漬する。
(4) Furthermore, for the purpose of mainly removing silicon oxides, the object to be treated is immersed for 10 to 30 seconds while being rocked in a diluted mixture of an acid and an inhibitor containing a fluorine compound as a main component.

上記(1)〜(4)の前処理を施した後、最後に被処理
物の耐久性を上げる目的で、ジ亜リン酸ソーダを還元剤
としたコバルト無電解メッキ液中に浸漬して、コバルト
に4〜6%程度のリンを添加した無電解化学COメッキ
を10〜20μm程度付着させる。10μm未満では十
分な耐久性を得ることはできず、20μmを超えると量
産性の点から問題がある。
After performing the pre-treatments (1) to (4) above, finally, in order to increase the durability of the object to be treated, it is immersed in a cobalt electroless plating solution using sodium diphosphite as a reducing agent. Electroless chemical CO plating, which is made by adding about 4 to 6% phosphorus to cobalt, is deposited to a thickness of about 10 to 20 μm. If it is less than 10 μm, sufficient durability cannot be obtained, and if it exceeds 20 μm, there is a problem in terms of mass productivity.

以上の工程を経て得られた被処理材はCo−P系の化学
メッキの表面硬度はHV400〜500であり、従来の
Niメッキに近いものであるが、潤滑性が保存されてい
るため、耐摩耗性が必要とされる精密部品に適したもの
である。
The surface hardness of Co-P chemical plating on the treated material obtained through the above process is HV400 to 500, which is close to that of conventional Ni plating, but the lubricity is preserved and the surface hardness is HV400-500. It is suitable for precision parts that require wear resistance.

インパクト型ドツトプリンタの印字機構のヨークに本発
明の処理を施したものを用いて、従来のNiメッキのも
のを使ったプリンタと印字回数を比較すると、従来のも
のでは3000万字程度の耐久性であったのに対し、本
発明のものでは約2億字と耐久性が飛躍的に向上した。
Comparing the number of prints using a yoke of the printing mechanism of an impact dot printer treated with the present invention and a printer using a conventional Ni-plated one, the durability of the conventional one is about 30 million characters. On the other hand, the durability of the paper of the present invention was dramatically improved to approximately 200 million characters.

[発明の効果]この発明によれば、軟磁性精密部品に対し、磁性特性を
保ちながら、表面硬度とともに潤滑性をも付与すること
ができ、耐久性を向上させることができる。
[Effects of the Invention] According to the present invention, it is possible to impart not only surface hardness but also lubricity to a soft magnetic precision component while maintaining its magnetic properties, thereby improving durability.

以  上that's all

Claims (1)

Translated fromJapanese
【特許請求の範囲】軟磁性ケイ素鋼よりなる精密部品に対し、真空中で焼鈍する工程と、メッキの前処理として、有機溶剤による脱脂処理、アル
カリによる脱脂処理、酸洗い処理、さらに酸とインヒビ
ターの混合液によるシリコン酸化物除去処理を順次施す
工程と、コバルト・リン系無電解化学メッキを施す工程とを含む
軟磁性精密部品の表面硬化処理方法。
[Claims] Precision parts made of soft magnetic silicon steel are annealed in vacuum, and pre-treatment for plating includes degreasing with an organic solvent, degreasing with an alkali, pickling, and further treatment with acid and an inhibitor. A method for surface hardening of soft magnetic precision parts, comprising the steps of sequentially performing silicon oxide removal treatment using a mixed solution of the following: and applying cobalt-phosphorus electroless chemical plating.
JP27199085A1985-12-031985-12-03 NANJISEISEIMITSUBUHINNOHYOMENKOKASHORIHOHOExpired - LifetimeJPH0244902B2 (en)

Priority Applications (1)

Application NumberPriority DateFiling DateTitle
JP27199085AJPH0244902B2 (en)1985-12-031985-12-03 NANJISEISEIMITSUBUHINNOHYOMENKOKASHORIHOHO

Applications Claiming Priority (1)

Application NumberPriority DateFiling DateTitle
JP27199085AJPH0244902B2 (en)1985-12-031985-12-03 NANJISEISEIMITSUBUHINNOHYOMENKOKASHORIHOHO

Publications (2)

Publication NumberPublication Date
JPS62133079Atrue JPS62133079A (en)1987-06-16
JPH0244902B2 JPH0244902B2 (en)1990-10-05

Family

ID=17507612

Family Applications (1)

Application NumberTitlePriority DateFiling Date
JP27199085AExpired - LifetimeJPH0244902B2 (en)1985-12-031985-12-03 NANJISEISEIMITSUBUHINNOHYOMENKOKASHORIHOHO

Country Status (1)

CountryLink
JP (1)JPH0244902B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US7504719B2 (en)1998-09-282009-03-17Ibiden Co., Ltd.Printed wiring board having a roughened surface formed on a metal layer, and method for producing the same
CN108796568A (en)*2017-05-022018-11-13贵州理工学院The method and device of high-silicon steel thin strip is prepared under a kind of low-intensity magnetic fields

Cited By (10)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US7504719B2 (en)1998-09-282009-03-17Ibiden Co., Ltd.Printed wiring board having a roughened surface formed on a metal layer, and method for producing the same
US7535095B1 (en)1998-09-282009-05-19Ibiden Co., Ltd.Printed wiring board and method for producing the same
US7994433B2 (en)1998-09-282011-08-09Ibiden Co., Ltd.Printed wiring board and method for producing the same
US8006377B2 (en)1998-09-282011-08-30Ibiden Co., Ltd.Method for producing a printed wiring board
US8018045B2 (en)1998-09-282011-09-13Ibiden Co., Ltd.Printed circuit board
US8020291B2 (en)1998-09-282011-09-20Ibiden Co., Ltd.Method of manufacturing a printed wiring board
US8030577B2 (en)1998-09-282011-10-04Ibiden Co., Ltd.Printed wiring board and method for producing the same
US8093507B2 (en)1998-09-282012-01-10Ibiden Co., Ltd.Printed wiring board and method for producing the same
US8533943B2 (en)1998-09-282013-09-17Ibiden Co., Ltd.Printed wiring board and method for producing the same
CN108796568A (en)*2017-05-022018-11-13贵州理工学院The method and device of high-silicon steel thin strip is prepared under a kind of low-intensity magnetic fields

Also Published As

Publication numberPublication date
JPH0244902B2 (en)1990-10-05

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