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JPS6166104U - - Google Patents

Info

Publication number
JPS6166104U
JPS6166104UJP15000984UJP15000984UJPS6166104UJP S6166104 UJPS6166104 UJP S6166104UJP 15000984 UJP15000984 UJP 15000984UJP 15000984 UJP15000984 UJP 15000984UJP S6166104 UJPS6166104 UJP S6166104U
Authority
JP
Japan
Prior art keywords
rotating shaft
tip
tape
machine
wheel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15000984U
Other languages
Japanese (ja)
Other versions
JPS6313133Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filedfiledCritical
Priority to JP15000984UpriorityCriticalpatent/JPS6313133Y2/ja
Publication of JPS6166104UpublicationCriticalpatent/JPS6166104U/ja
Application grantedgrantedCritical
Publication of JPS6313133Y2publicationCriticalpatent/JPS6313133Y2/ja
Expiredlegal-statusCriticalCurrent

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Description

Translated fromJapanese
【図面の簡単な説明】[Brief explanation of drawings]

図面は本考案に係る野菜等の結束機におけるテ
ープ緊張装置の一実施例を示し、第１図は一部欠
截側面図、第２図は第１図−′線方向の平面
図、第３図は同−′線断面図、第４図は同
−′線断面図、第５図は横断面図、第６図は第
５図−′線断面図、第７図はテープ切断状態
時の断面図である。 １〜機台、２〜機枠、３〜従動輪、４〜リール
支持輪、５〜第一回動軸、６〜第二回動軸、７〜
中介輪、８…駆動輪、９〜第一連動片、１０〜従
動歯車、１１〜第二連動片、１４〜伝達駒、１８
〜扇歯車、１９〜操作レバー、２２〜切断刃、２
５〜保持駒。 The drawings show an embodiment of the tape tensioning device for a vegetable tying machine according to the present invention, in which FIG. 1 is a partially cutaway side view, FIG. Figure 4 is a sectional view taken along the line ``-'', Figure 4 is a sectional view taken along the line ``-'', Figure 5 is a cross-sectional view, Figure 6 is a sectional view taken FIG. 1 - machine base, 2 - machine frame, 3 - driven wheel, 4 - reel support wheel, 5 - first rotation axis, 6 - second rotation axis, 7 -
Intermediate wheel, 8...driving wheel, 9-first moving piece, 10-driven gear, 11-second interlocking piece, 14-transmission piece, 18
~ Fan gear, 19 ~ Operation lever, 22 ~ Cutting blade, 2
5 ~ Holding piece.

Claims (1)

Translated fromJapanese
【実用新案登録請求の範囲】[Scope of utility model registration request] 一端に従動輪、他端にテープのリール支持輪を
備えた第一回動軸と、前記従動輪を駆動する中介
軸と駆動輪を備えた第二回動軸のそれぞれを機台
に立設した機枠に第一回動軸を後側にして横設し
、第二回動軸の前方に配した操作レバーの降下中
に先端が駆動輪に圧接し、しかも、上昇時には離
れる伝達駒を、前記第二回動軸に回動自在に支持
させた連動片の先端に揺動自在に取付け、該連動
片を回動する従動歯車を前記機枠に回動自在に軸
支すると共に、従動歯車にかみ合う駆動歯車を先
端に切断刃を備えた前記操作レバーと同軸にして
機枠に取付け、テープの案内となる前記操作レバ
ーの前方側の機台部にはテープ先端を保持する保
持材を設けた野菜等の結束機におけるテープ緊張
装置。 A first rotating shaft with a driven wheel on one end and a tape reel support wheel on the other end, and a second rotating shaft with an intermediate shaft and a driving wheel that drive the driven wheel are each erected on the machine. A transmission piece is installed horizontally on a machine frame with the first rotating shaft on the rear side, and the tip of the control lever placed in front of the second rotating shaft comes into pressure contact with the drive wheel while descending, and separates when ascending. , is swingably attached to the tip of an interlocking piece that is rotatably supported on the second rotating shaft, and a driven gear that rotates the interlocking piece is rotatably supported on the machine frame; A driving gear that meshes with the gear is attached to the machine frame coaxially with the operating lever having a cutting blade at its tip, and a holding material for holding the tip of the tape is attached to the machine base on the front side of the operating lever that guides the tape. A tape tensioning device for a vegetable tying machine.
JP15000984U1984-10-031984-10-03ExpiredJPS6313133Y2 (en)

Priority Applications (1)

Application NumberPriority DateFiling DateTitle
JP15000984UJPS6313133Y2 (en)1984-10-031984-10-03

Applications Claiming Priority (1)

Application NumberPriority DateFiling DateTitle
JP15000984UJPS6313133Y2 (en)1984-10-031984-10-03

Publications (2)

Publication NumberPublication Date
JPS6166104Utrue JPS6166104U (en)1986-05-07
JPS6313133Y2 JPS6313133Y2 (en)1988-04-14

Family

ID=30708166

Family Applications (1)

Application NumberTitlePriority DateFiling Date
JP15000984UExpiredJPS6313133Y2 (en)1984-10-031984-10-03

Country Status (1)

CountryLink
JP (1)JPS6313133Y2 (en)

Cited By (21)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US6910947B2 (en)2001-06-192005-06-28Applied Materials, Inc.Control of chemical mechanical polishing pad conditioner directional velocity to improve pad life
US6913938B2 (en)2001-06-192005-07-05Applied Materials, Inc.Feedback control of plasma-enhanced chemical vapor deposition processes
US6961626B1 (en)2004-05-282005-11-01Applied Materials, IncDynamic offset and feedback threshold
US6984198B2 (en)2001-08-142006-01-10Applied Materials, Inc.Experiment management system, method and medium
US6999836B2 (en)2002-08-012006-02-14Applied Materials, Inc.Method, system, and medium for handling misrepresentative metrology data within an advanced process control system
US7047099B2 (en)2001-06-192006-05-16Applied Materials Inc.Integrating tool, module, and fab level control
US7069101B1 (en)1999-07-292006-06-27Applied Materials, Inc.Computer integrated manufacturing techniques
US7082345B2 (en)2001-06-192006-07-25Applied Materials, Inc.Method, system and medium for process control for the matching of tools, chambers and/or other semiconductor-related entities
US7096085B2 (en)2004-05-282006-08-22Applied MaterialsProcess control by distinguishing a white noise component of a process variance
US7101799B2 (en)2001-06-192006-09-05Applied Materials, Inc.Feedforward and feedback control for conditioning of chemical mechanical polishing pad
US7160739B2 (en)2001-06-192007-01-09Applied Materials, Inc.Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles
US7188142B2 (en)2000-11-302007-03-06Applied Materials, Inc.Dynamic subject information generation in message services of distributed object systems in a semiconductor assembly line facility
US7201936B2 (en)2001-06-192007-04-10Applied Materials, Inc.Method of feedback control of sub-atmospheric chemical vapor deposition processes
US7205228B2 (en)2003-06-032007-04-17Applied Materials, Inc.Selective metal encapsulation schemes
US7225047B2 (en)2002-03-192007-05-29Applied Materials, Inc.Method, system and medium for controlling semiconductor wafer processes using critical dimension measurements
US7272459B2 (en)2002-11-152007-09-18Applied Materials, Inc.Method, system and medium for controlling manufacture process having multivariate input parameters
US7333871B2 (en)2003-01-212008-02-19Applied Materials, Inc.Automated design and execution of experiments with integrated model creation for semiconductor manufacturing tools
US7337019B2 (en)2001-07-162008-02-26Applied Materials, Inc.Integration of fault detection with run-to-run control
US7356377B2 (en)2004-01-292008-04-08Applied Materials, Inc.System, method, and medium for monitoring performance of an advanced process control system
US7354332B2 (en)2003-08-042008-04-08Applied Materials, Inc.Technique for process-qualifying a semiconductor manufacturing tool using metrology data
US10717555B2 (en)2016-06-152020-07-21Max Co., Ltd.Binding machine for gardening

Cited By (25)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US7069101B1 (en)1999-07-292006-06-27Applied Materials, Inc.Computer integrated manufacturing techniques
US7174230B2 (en)1999-07-292007-02-06Applied Materials, Inc.Computer integrated manufacturing techniques
US7188142B2 (en)2000-11-302007-03-06Applied Materials, Inc.Dynamic subject information generation in message services of distributed object systems in a semiconductor assembly line facility
US6910947B2 (en)2001-06-192005-06-28Applied Materials, Inc.Control of chemical mechanical polishing pad conditioner directional velocity to improve pad life
US7047099B2 (en)2001-06-192006-05-16Applied Materials Inc.Integrating tool, module, and fab level control
US8694145B2 (en)2001-06-192014-04-08Applied Materials, Inc.Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles
US7082345B2 (en)2001-06-192006-07-25Applied Materials, Inc.Method, system and medium for process control for the matching of tools, chambers and/or other semiconductor-related entities
US7201936B2 (en)2001-06-192007-04-10Applied Materials, Inc.Method of feedback control of sub-atmospheric chemical vapor deposition processes
US6913938B2 (en)2001-06-192005-07-05Applied Materials, Inc.Feedback control of plasma-enhanced chemical vapor deposition processes
US7160739B2 (en)2001-06-192007-01-09Applied Materials, Inc.Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles
US7101799B2 (en)2001-06-192006-09-05Applied Materials, Inc.Feedforward and feedback control for conditioning of chemical mechanical polishing pad
US7337019B2 (en)2001-07-162008-02-26Applied Materials, Inc.Integration of fault detection with run-to-run control
US6984198B2 (en)2001-08-142006-01-10Applied Materials, Inc.Experiment management system, method and medium
US7225047B2 (en)2002-03-192007-05-29Applied Materials, Inc.Method, system and medium for controlling semiconductor wafer processes using critical dimension measurements
US6999836B2 (en)2002-08-012006-02-14Applied Materials, Inc.Method, system, and medium for handling misrepresentative metrology data within an advanced process control system
US7272459B2 (en)2002-11-152007-09-18Applied Materials, Inc.Method, system and medium for controlling manufacture process having multivariate input parameters
US7333871B2 (en)2003-01-212008-02-19Applied Materials, Inc.Automated design and execution of experiments with integrated model creation for semiconductor manufacturing tools
US7205228B2 (en)2003-06-032007-04-17Applied Materials, Inc.Selective metal encapsulation schemes
US7354332B2 (en)2003-08-042008-04-08Applied Materials, Inc.Technique for process-qualifying a semiconductor manufacturing tool using metrology data
US7356377B2 (en)2004-01-292008-04-08Applied Materials, Inc.System, method, and medium for monitoring performance of an advanced process control system
US7221990B2 (en)2004-05-282007-05-22Applied Materials, Inc.Process control by distinguishing a white noise component of a process variance
US7096085B2 (en)2004-05-282006-08-22Applied MaterialsProcess control by distinguishing a white noise component of a process variance
US7349753B2 (en)2004-05-282008-03-25Applied Materials, Inc.Adjusting manufacturing process control parameter using updated process threshold derived from uncontrollable error
US6961626B1 (en)2004-05-282005-11-01Applied Materials, IncDynamic offset and feedback threshold
US10717555B2 (en)2016-06-152020-07-21Max Co., Ltd.Binding machine for gardening

Also Published As

Publication numberPublication date
JPS6313133Y2 (en)1988-04-14

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