【発明の詳細な説明】〔産業上の利用分野〕本発明は、プリント基板の種別を、該プリント基板の種
類毎に異なるランド孔位置によって識別し得るプリント
基板識別装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a printed circuit board identification device that can identify the type of printed circuit board by the position of a land hole that differs for each type of printed circuit board.
最近のプリント基板は、益々部品の実装密度が高まりつ
つあり、従来のように基板の種別を表示するためのスペ
ースを設けることが困難になってきた。このため種別表
示が無くてもプリント基板の種類を自動的に識別し得る
機能を備えたプリント基板識別装置の開発が強く要望さ
れている。In recent printed circuit boards, the mounting density of components has been increasing, and it has become difficult to provide a space for displaying the type of board as in the past. Therefore, there is a strong demand for the development of a printed circuit board identification device having a function of automatically identifying the type of printed circuit board even without a type display.
従来、プリント基板の識別は、全て該基板の何処かに記
されている該基板固有の表示を読み取る手段によって行
われていた。Conventionally, all printed circuit boards have been identified by means of reading an indication unique to the board written somewhere on the board.
該表示は、エツチング法や捺印法によるのが通常の方法
であるが、どちらも成る特定のスペースを必要とするの
で、部品実装率の低下は避けられず、特に分類作業を自
動化する場合、表示読取り機構が複雑化するという難点
があった。The usual methods for this display are the etching method and the stamping method, but since both require a specific space, a decline in the component mounting rate is unavoidable, especially when automating the classification process. The problem was that the reading mechanism became complicated.
本発明は、上記の問題点即ち従来方法による部品実装率
の低下と、自動化の妨げとなる読取り機構の複雑化とを
解決するためになされたものである。The present invention has been made in order to solve the above-mentioned problems, namely, the decrease in component mounting rate caused by the conventional method and the complication of the reading mechanism, which hinders automation.
本発明においては上記の問題点を解決するための手段と
して、光源と対向する位置に複数の受光素子が碁盤目状
に配置されたホト・マトリソクスを付設し、該ホト・マ
トリックスと前記光源間に被検査プリント基板を載置し
て、該プリント基板のランド孔通過光位置を前記ホト・
マトリックスによって検知するよう構成されたプリント
基板識別装置を提供するものである。In the present invention, as a means for solving the above-mentioned problems, a photo matrix in which a plurality of light receiving elements are arranged in a grid pattern is provided at a position facing the light source, and a photo matrix is provided between the photo matrix and the light source. Place the printed circuit board to be inspected, and align the position of the light passing through the land hole of the printed circuit board with the photo.
A printed circuit board identification device configured for matrix sensing is provided.
上記構成のプリント基板識別装置に付設された光源と、
ホト・マトリックス間に被検査プリント板を載置するこ
とによって、該被検査プリント基板に設けられたランド
孔を通過した光線のみが、複数の受光素子を碁盤目状に
配置したホト・マトリックス面を照射する。A light source attached to the printed circuit board identification device configured as above;
By placing the printed circuit board to be inspected between the photo matrices, only the light beams that have passed through the land holes provided in the printed circuit board to be inspected will be able to cross the photo matrix surface on which a plurality of light receiving elements are arranged in a grid pattern. irradiate.
その照射位置は、当該被検査プリント板に特有のランド
孔配置を示すものであり、該ランド孔位置の認識によっ
て、不特定多数中の被検査プリント板の種別が的確に判
別されることになる。The irradiation position indicates the land hole arrangement specific to the printed board to be inspected, and by recognizing the position of the land hole, the type of printed board to be inspected from an unspecified number of people can be accurately determined. .
〔実施例〕以下、図面によって本発明によるプリント基板識別装置
の実施例を説明する。[Embodiments] Hereinafter, embodiments of the printed circuit board identification device according to the present invention will be described with reference to the drawings.
第１図は本発明の構成を示す要部斜視図、第２図は本発
明の主要構成部材の一動作例を示す図である。FIG. 1 is a perspective view of essential parts showing the configuration of the present invention, and FIG. 2 is a diagram showing an example of the operation of the main components of the present invention.
図中、同一符号は同一対象物を示す。In the figures, the same reference numerals indicate the same objects.
第１図に示す如く本発明のプリント基板識別装置は、光
源１と、該光源１と対向する位置に設けられた複数の受
光素子が碁盤目状４こ配置されたホト・マトリックス４
と、被検査プリント板が載置される検査テーブル１５と
で構成されている。As shown in FIG. 1, the printed circuit board identification device of the present invention includes a light source 1 and a photo matrix 4 in which a plurality of light receiving elements are arranged in a grid pattern in four locations facing the light source 1.
and an inspection table 15 on which a printed board to be inspected is placed.
なお検査テーブル１５には、被検査プリント基板２の検
査ゾーン３を光源ｌの真下、そしてホト・マトリックス
４の真上に位置させるように、該基板２の位置を調節す
るための位置決めボール７および該ボール７を前後、ま
たは左右に移動させるための位置調整孔８が設けられて
いる。The inspection table 15 includes a positioning ball 7 and a positioning ball 7 for adjusting the position of the printed circuit board 2 so that the inspection zone 3 of the printed circuit board 2 to be inspected is located directly below the light source 1 and directly above the photo matrix 4. A position adjustment hole 8 is provided for moving the ball 7 back and forth or left and right.
またホト・マトリックス４を構成する複数の受光素子は
それぞれ信号線６によって、他の回路に接続される。Further, each of the plurality of light receiving elements constituting the photo matrix 4 is connected to other circuits by a signal line 6.
このように構成されたプリント基板識別装置のテーブル
１５上に被検査プリント基板２が載置されると、光源１
から発光された光線が被検査プリント基板２の所定位置
に設定された検査ゾーン２゛に照射される。When the printed circuit board 2 to be inspected is placed on the table 15 of the printed circuit board identification device configured in this way, the light source 1
A light ray emitted from the test board 2 is irradiated onto an inspection zone 2' set at a predetermined position on the printed circuit board 2 to be inspected.
そして検査ゾーン２゛中のランド孔３を通過した光線の
みがホト・マトリックス４を照射し、複数の受光素子が
碁盤目状に配置された該ホト・マトリックス４には例え
ば第２図に示す如きランド孔通過光反応５が発生する。Only the light beams passing through the land holes 3 in the inspection zone 2 irradiate the photo matrix 4, and the photo matrix 4, in which a plurality of light receiving elements are arranged in a grid pattern, is exposed to a light beam as shown in FIG. 2, for example. A light reaction 5 that passes through the land hole occurs.
該ランド孔通過光反応５は、前記信号線６を介して、例
えば第３図に示す方法で処理され、該被検査プリント基
板の種別が確認される。The light reaction 5 passing through the land hole is processed, for example, by the method shown in FIG. 3 via the signal line 6, and the type of the printed circuit board to be inspected is confirmed.
第３図は本発明の一実施例構成を示すブロックダイヤグ
ラムである。FIG. 3 is a block diagram showing the configuration of an embodiment of the present invention.
同図に示す如く本発明のプリント基板識別装置は、ホト
・マトリックス４と、該ホトマトリックス４で得られた
ランド孔通過光反応５をコード化するコード化回路９と
で読取り部１０を構成し、前記ランド孔通過光反応５は
信号線６を介してコード化回路９に送られ、そこでコー
ド化されて制御部１１に入力される。 制御部１１では
コード化されたランド孔通過光反応５と図番データ１２
との照合が行われ、そのデータが外部インタフェイスＩ
３を介してコンビニーりへ入力され照合が行われる。As shown in the figure, in the printed circuit board identification device of the present invention, a reading section 10 is composed of a photo matrix 4 and a coding circuit 9 that codes the photoreaction 5 that passes through the land hole and is obtained from the photo matrix 4. The light reaction 5 passing through the land hole is sent to the encoding circuit 9 via the signal line 6, where it is encoded and input to the control section 11. In the control unit 11, the coded land hole passing light reaction 5 and drawing number data 12
The data is compared with the external interface I.
3 to the convenience store for verification.
なお本構成には表示装置１４が付設されていて、各構成
間の入出力データの状況をモニター出来るようになって
いる。Note that this configuration is equipped with a display device 14 so that the status of input/output data between each configuration can be monitored.
尚、第２図の例ではホト・マトリックス４の７トリンク
ス数即ち受光素子数は、縦、横各６マスになっているが
、これは検出すべき対象、即ちプリント基板の性格に応
じて適宜設定されることは云うまでもない。In the example shown in Fig. 2, the number of 7 links of the photo matrix 4, that is, the number of light-receiving elements, is 6 squares each vertically and horizontally, but this may be changed as appropriate depending on the nature of the object to be detected, that is, the printed circuit board. Needless to say, it is set.
以上詳細に説明したように、本発明のプリント基板識別
装置は、複数の受光素子を碁盤目状に配置したホト・マ
トリックスと、光源とで構成された簡易構造の識別機構
によって、プリント基板の種類を的確に識別し得るとい
った効果大なるものである。As explained in detail above, the printed circuit board identification device of the present invention uses a simple structure identification mechanism consisting of a photo matrix in which a plurality of light receiving elements are arranged in a grid pattern, and a light source to identify the type of printed circuit board. This has a great effect in that it allows for accurate identification.
第１図は本発明の構成を示す要部斜視図、第２図は本発
明の主要構成部材の一動作例を示す図、第３図は本発明の一実施例構成を示すブロックダイヤグ
ラムである。図中、１は光源、２は被検査プリント基板、２゛は検査
ゾーン、３はランド孔、４は複数の受光素子が碁盤目状
に配置されたホト・マトリックス、５はランド孔通過光
反応、６は信号線、７は位置決めボール、８は位置調整
孔、９はコード化回路、１０は読取り部、１１は制御部
、１２は図番データ、１３は外部インタフヱイス、１４
は表示装置、をそれぞれ示す。第１図第２１１ＥｌFIG. 1 is a perspective view of the main parts showing the configuration of the present invention, FIG. 2 is a diagram showing an example of the operation of the main components of the present invention, and FIG. 3 is a block diagram showing the configuration of an embodiment of the present invention. . In the figure, 1 is a light source, 2 is a printed circuit board to be inspected, 2 is an inspection zone, 3 is a land hole, 4 is a photo matrix in which a plurality of light receiving elements are arranged in a grid pattern, and 5 is a reaction of light passing through the land hole. , 6 is a signal line, 7 is a positioning ball, 8 is a position adjustment hole, 9 is a coding circuit, 10 is a reading section, 11 is a control section, 12 is a drawing number data, 13 is an external interface, 14
indicates a display device, respectively. Figure 1 211El
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59135551AJPS6114549A (en) | 1984-06-29 | 1984-06-29 | Printed circuit board identification device |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59135551AJPS6114549A (en) | 1984-06-29 | 1984-06-29 | Printed circuit board identification device |
| Publication Number | Publication Date |
|---|---|
| JPS6114549Atrue JPS6114549A (en) | 1986-01-22 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59135551APendingJPS6114549A (en) | 1984-06-29 | 1984-06-29 | Printed circuit board identification device |
| Country | Link |
|---|---|
| JP (1) | JPS6114549A (en) |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5565789A (en)* | 1994-04-21 | 1996-10-15 | Temic Telefunken Microelectronic Gmbh | Process for encoding printed circuit boards |
| EP0810817A3 (en)* | 1996-05-30 | 1998-12-30 | Sony Video (M) SDN.BHD. | Mounting systems and methods |
| US6177281B1 (en) | 1993-06-02 | 2001-01-23 | Teikoku Hormone Mfg. Co., Ltd. | Simple immunochemical semi-quantitative assay method and apparatus |
| DE102013203708B4 (en)* | 2013-03-05 | 2015-12-24 | Siemens Ag Österreich | Method for unambiguous identification of multilayer printed circuit boards |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6177281B1 (en) | 1993-06-02 | 2001-01-23 | Teikoku Hormone Mfg. Co., Ltd. | Simple immunochemical semi-quantitative assay method and apparatus |
| US6582970B1 (en) | 1993-06-02 | 2003-06-24 | Teikoku Hormone Mfg. Co, Ltd. | Simple immunochemical semi-quantitative assay method and apparatus |
| US5565789A (en)* | 1994-04-21 | 1996-10-15 | Temic Telefunken Microelectronic Gmbh | Process for encoding printed circuit boards |
| EP0810817A3 (en)* | 1996-05-30 | 1998-12-30 | Sony Video (M) SDN.BHD. | Mounting systems and methods |
| DE102013203708B4 (en)* | 2013-03-05 | 2015-12-24 | Siemens Ag Österreich | Method for unambiguous identification of multilayer printed circuit boards |
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