【発明の詳細な説明】産業上の利用分野本発明は電子部品の供給、特にコム状のり−トを有する
電子部品の、装着装置などへの供給に適した電子部品集
合体に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an electronic component assembly suitable for supplying electronic components, particularly for supplying electronic components having comb-shaped glue to a mounting device.
従来例の構成とその問題点従来、第１図に示すフラットパッケージＩＣ及び第２図
に丞す４方向フラツトパツケージＩＣに代表されるコム
状のり−トを有し、比較的形状の小さなＩＣ（以下電子
部品という）は、電子回路を構成する基板上に装着する
装置において、第３図に示すようなトレイ２で供給する
方法がとられてきた。しかし−この方法では、自動化か
外しい。Conventional configurations and their problems Conventionally, ICs with a relatively small shape and having a comb-shaped board, as typified by the flat package IC shown in Fig. 1 and the four-way flat package IC shown in Fig. 2, have been used. 2. Description of the Related Art In devices for mounting electronic components (hereinafter referred to as electronic components) on a substrate constituting an electronic circuit, a method has been adopted in which a tray 2 as shown in FIG. 3 is used to supply electronic components. However, this method is unlikely to be automated.
位置決めしにくい、ストック数が少ないなどの問題があ
った。その後、第４図に示す収納大月テープ供給方法が
取られたが−この方法では一供給が比較的安定している
が一電子部品を収納穴から１個づつ取り出す際コム状の
リードが収納穴に接触したシ、テープに静電気が発生し
た際テープに電子部品が装着したりして取り出せ々かっ
たり、あるい（は取り出すことができてもコム状のリー
ドを変形させたりして一連続的な安定供給において問題
が残る。また静電気によって不良になった電子部品を装
着することになったり、静電気により大気中のゴミやホ
コリがテープに付着して、正しく基板に装着することが
できなくなるなとの静電気問題もあった。There were problems such as difficulty in positioning and a small number of stocks. Later, the Otsuki storage tape supply method shown in Figure 4 was adopted; however, although this method provides relatively stable supply, the comb-shaped leads are stored when electronic components are taken out one by one from the storage hole. If the tape comes into contact with a hole or static electricity is generated on the tape, electronic parts may be attached to the tape and cannot be removed, or even if it can be removed, the comb-shaped lead may be deformed and the tape may become unremovable. In addition, static electricity may cause defective electronic parts to be mounted, and static electricity may cause dust and dirt in the atmosphere to adhere to the tape, making it impossible to properly mount it on the board. There was also a problem with static electricity.
最近では、第６，６図に示すような粘着テープによるテ
ープ供給方法か行なわれている。ここで−３は送り穴４
と接着穴５ｆ：有したテープ。テープ３の片面には粘着
テープ６か固定されており、穴５０部分では粘着面６ａ
か反対面に出るようになっている。そして、電子部品１
が粘着面６２Ｌに接着されている。しかし−この方法で
も、電子部品１がはがれやすい、リード線の保護がされ
ていないなどの問題がある。Recently, a tape supply method using an adhesive tape as shown in FIGS. 6 and 6 has been used. Here -3 is sprocket hole 4
and adhesive hole 5f: tape. An adhesive tape 6 is fixed to one side of the tape 3, and the adhesive surface 6a is fixed at the hole 50 part.
It is supposed to come out on the other side. And electronic parts 1
is adhered to the adhesive surface 62L. However, even with this method, there are problems such as the electronic component 1 being easily peeled off and the lead wires not being protected.
発明の目的本発明は前記欠点に鑑み、自動装着機にかけやすく、ス
トック数か多いうえに−リード線の保護も可能にした電
子部品集合体を提供するものであり、電子部品の連続安
定供給を可能にする。Purpose of the Invention In view of the above-mentioned drawbacks, the present invention provides an electronic component assembly that is easy to apply to an automatic mounting machine, can be stocked in large quantities, and also protects the lead wires, thereby ensuring a continuous and stable supply of electronic components. enable.
発明の構成本発明の電子部品集合体は、複数個の凹みを有する第１
の帯状長尺材料と、前記第１の帯状長尺材料の一方の側
にイイって前記凹みの開口部を被覆可能な第２の帯状長
尺材料とからなり、前記凹みか電子部品の部品本体又ｆ
ｄ ’Ｊ−ド線又はその両方で前記電子部品を位置決め
する凸部又は凹部等からなる係合部を有し、前記凸部又
は凹部に前記電子部品を位置決め搭載し、第１．第２の
帯状長尺材料の一方もしくは両方に機械送り可能な送り
案内手段を設は一電子部品の連続安定供給を可能にする
ものである。Structure of the Invention The electronic component assembly of the present invention has a first structure having a plurality of recesses.
and a second strip-like elongated material that can be placed on one side of the first elongated band material to cover the opening of the recess, and a second elongated material that can cover the opening of the recess or the electronic component. Main body or f
d' has an engaging portion consisting of a convex portion or a concave portion for positioning the electronic component with or both of the wires, the electronic component is positioned and mounted on the convex portion or the concave portion, and the first. One or both of the second strip-shaped elongated materials are provided with feeding guide means that can be mechanically fed, thereby making it possible to continuously and stably supply electronic components.
実施例の説明以下、本発明の第１の実施例について第７図を参照しな
がら説明する。DESCRIPTION OF EMBODIMENTS A first embodiment of the present invention will be described below with reference to FIG.
１は第２図で示した４方向フラツトパツケージＩＣ等の
電子部品、７は導電体素材でできた第１の帯状長尺材料
としてのテープで一電子部品１を搭載する凹み７Ｎを有
し−凹み７２Ｌの内部に電子部品１を位置決めする保合
部としての凸部７ｂ。1 is an electronic component such as a four-way flat package IC shown in FIG. 2; 7 is a tape as a first strip-like elongated material made of a conductive material; and 1 has a recess 7N in which the electronic component 1 is mounted. - Convex portion 7b as a retaining portion for positioning electronic component 1 inside recess 72L.
７Ｃを有している。It has 7C.
８は導電体素材でできた第２の帯状長尺材料としてのテ
ープである。8 is a tape as a second strip-like elongated material made of a conductive material.
そして、電子部品１の部品本体の下面１ｂとテープ７の
凸部７ｂ及び、電子部品１のリート線の中間部１Ｃとテ
ープ７の凸部７Ｃで電子部品１をリード線の先端部１ｄ
がテープ７．８に接触しないよう−かつ、電子部品１の
位置のずれか電子部品１を装着する機械の認識装置の対
応できる範囲内に入るように位置決めしている。Then, the electronic component 1 is connected to the lower surface 1b of the component body of the electronic component 1, the convex portion 7b of the tape 7, the intermediate portion 1C of the lead wire of the electronic component 1, and the convex portion 7C of the tape 7 to the tip portion 1d of the lead wire.
The electronic component 1 is positioned so that it does not come into contact with the tape 7.8, and the positional deviation of the electronic component 1 is within the range that can be handled by the recognition device of the machine on which the electronic component 1 is mounted.
このとき、電子部品１がずれないように寸法］＋＞１２
と々っている。At this time, make sure that the electronic component 1 does not shift in size]+>12
It's so hot.
また−テープ７と８には電子部品１の積載に対応して送
り穴９が設けられている。Furthermore, the tapes 7 and 8 are provided with perforations 9 in correspondence with the loading of the electronic components 1 thereon.
そして、テープ７と８の電子部品１の位置する部分には
確認及び取出しの補助として穴７ｄ、ｓ？Ｌが電子部品
ｔのテープから抜けない大きさで設けである。There are holes 7d and s in the tapes 7 and 8 where the electronic component 1 is located to assist in confirmation and removal. L is designed to be large enough to prevent the electronic component t from coming off the tape.
以上のように本実施例によれば、テープ７の有する凸部
了す、７ｃとテープ８で電子部品１を装着する機械の認
識装置の対応できるずれの範囲で位置決めすることを可
能にし、また−電子部品１のリード線の先端部１ｄを保
護している。As described above, according to this embodiment, the convex portions 7c of the tape 7 and the tape 8 make it possible to position the electronic component 1 within the range of deviation that can be accommodated by the recognition device of the machine to which the electronic component 1 is mounted. - Protects the tip end 1d of the lead wire of the electronic component 1.
そして、テープ７．８を巻き取れは一部品収納容積を大
きく必要とせず１等間隔に設けた送り穴９を利用して電
子部品１を多数１固連続して確実に送ることか可能であ
り、１だ、テープ７．８が導電体素材でできているため
、静電気を防ぐことができ、自動装着機にかけやすく電
子部品集合体として有益なものである。In order to wind up the tape 7.8, it is possible to reliably feed a large number of electronic components 1 one after the other by using the feed holes 9 provided at equal intervals without requiring a large component storage capacity. , 1. Since the tape 7.8 is made of a conductive material, it can prevent static electricity, is easy to apply to an automatic mounting machine, and is useful as an electronic component assembly.
以下１本発明の第２の実施例について第８図を参照しな
がら説明する。A second embodiment of the present invention will be described below with reference to FIG.
１は第２図で示した４方向フラツトパツケージＩＣ等の
電子部品−７は導電体素材でできた第１の帯状長尺材料
としてのテープで一電子部品１を搭載する凹み７１Ｌを
有し、凹み７？Ｌの内部に電子部品１を位置決めする保
合部としての凹部７８゜７ｆを有している。Reference numeral 1 denotes an electronic component 7 such as a four-way flat package IC shown in FIG. 2, which is a tape as a first strip-like elongated material made of a conductive material, and has a recess 71L in which the electronic component 1 is mounted. , dent 7? It has a concave portion 78° 7f as a retaining portion for positioning the electronic component 1 inside the L.
８に導電体素材でできた第２の帯状長尺材料としてのテ
ープである。8 is a tape as a second strip-like elongated material made of a conductive material.
そして−電子部品１０部品本体の上面１ａとテープ７の
凹部７ｅ及び、電子部品１の部品本体の上横面１ｅとテ
ープ７の凹部７ｆで電子部品１をリード線の先端部１ｄ
がテープ７．８に接触しないよう２かつ、電子部品１の
位置のずれが電子部品１を装着する機械の認識装置の対
応できる範囲内に入るように位置決めしている。このと
き電子部品１がずれないように寸法β３ ＞ Ａ！４
となっている。- The electronic component 1 is connected between the upper surface 1a of the main body of the electronic component 10 and the recess 7e of the tape 7, and between the upper lateral surface 1e of the electronic component 1 and the recess 7f of the tape 7.
The electronic component 1 is positioned so that it does not come into contact with the tape 7.8, and the positional deviation of the electronic component 1 is within the range that can be handled by the recognition device of the machine to which the electronic component 1 is mounted. At this time, in order to prevent the electronic component 1 from shifting, the dimension β3 > A! 4
It becomes.
またーテープ７と８には電子部品１の積載に対応して送
り穴９が設けられている。Further, the tapes 7 and 8 are provided with feed holes 9 corresponding to the loading of the electronic components 1.
そして、テープ７と８の電子部品１の位置する部分には
確認及び取出しの補助として穴７ｄ。Holes 7d are provided in the portions of the tapes 7 and 8 where the electronic component 1 is located to assist in confirmation and removal.
８ａが電子部品１がテープから抜けない大きさで設けで
ある。8a is a size that prevents the electronic component 1 from coming off the tape.
以上のように本実施例によれば、第１の実施例と同様の
効果が有る上に一電子部品１の搭載方向を上下逆にでき
るという利点かある０以下１本発明の第３の実施クリについて第９図を参照し
ながら説明する。As described above, this embodiment has the same effects as the first embodiment, and also has the advantage that the mounting direction of the electronic component 1 can be reversed.The following is a third embodiment of the present invention. The chestnut will be explained with reference to FIG. 9.
１は第２図で示した４方同フラツトパツケージＩＣ等の
電子部品、７は導電体素材でできた第１の帯状長尺材料
としてのテープで２電子部品１を搭載する凹み了ａを有
し−凹み７ａの内部に電子部品１を位置決めする係合部
としての凸部７ｇを有している。1 is an electronic component such as the four-sided flat package IC shown in FIG. 2; 7 is a tape as a first strip-like long material made of a conductive material; 2 is a concave hole a in which the electronic component 1 is mounted; It has a convex portion 7g as an engaging portion for positioning the electronic component 1 inside the recess 7a.
８は導電体素口でできた第２の帯状長尺材料としてのテ
ープである。Reference numeral 8 denotes a tape as a second strip-like elongated material made of conductor blanks.
そして、電子部品１の部品本体の下横面１ｆ’とテープ
Ｙの凸部７ｇ及び−電子部品１のリード線の中間部１Ｃ
とテープＴの凸部７ｇで電子部品１をリード線の先端部
１ｄがテープ７．８に接触しないよう−かつ、電子部品
１の位置ずれが電子部品１を装着する機械の認識装置の
対応できる範囲内に入るように位置決めしている。この
時−電子部品１がずれないように寸法Ａｓ＞Ａ６ とな
っている。Then, the lower lateral surface 1f' of the component body of the electronic component 1, the convex portion 7g of the tape Y, and the intermediate portion 1C of the lead wire of the electronic component 1.
The convex portion 7g of the tape T is used to prevent the leading end 1d of the electronic component 1 from coming into contact with the tape 7.8, and the recognition device of the machine to which the electronic component 1 is installed can handle any misalignment of the electronic component 1. Positioned to be within range. At this time, the dimension As>A6 is set so that the electronic component 1 does not shift.
また、テープ７と８には電子部品１の積載に対応して送
り穴９が設けられている。Further, the tapes 7 and 8 are provided with feed holes 9 corresponding to the loading of the electronic components 1.
そして、テープ７と８の電子部品１の位置する部分には
確認及び取り出しの補助として穴７ｄ。Holes 7d are provided in the portions of the tapes 7 and 8 where the electronic component 1 is located to assist in confirmation and removal.
Ｓ２Ｌが電子部品１がテープから抜けない大きさで設け
である。S2L is provided with a size that prevents the electronic component 1 from coming off the tape.
以上のように本実施例によれは、第１の実施例と同様の
効果が有る上に、電子部品１の部品本体の下横面１ｆと
リード線の中間部１Ｃの間にテーヘプアの凸部７ｇを入
れる形で位置決めしているため、第１．第２の実施例よ
り確実に位置決めかでき有益なものである。As described above, this embodiment has the same effects as the first embodiment, and also has a convex portion of the taper between the lower lateral surface 1f of the component body of the electronic component 1 and the intermediate portion 1C of the lead wire. Since it is positioned in such a way that 7g is inserted, the first. This embodiment is advantageous because it allows more reliable positioning than the second embodiment.
なお一本第１．第２．第３の実施例では電子部品１とし
て第２図に示す４方回フラノ！・ノククケージＩＣで説
明したが、第１図に示すフラ、／ トパッケージＩＣで
も同様の電子部品集合体が可能であるＯ発明の効果以上のように５本発明の電子部品集合体は一複数個の凹
みを有する第１の帯状長尺材料と、第１の帯状長尺材料
の一方の側に有って前記凹みの開口部を被覆可能な第２
の帯状長尺材料とからなり。Please note that the first one. Second. In the third embodiment, the electronic component 1 is a four-way flannelette shown in FIG.・Although the description has been made using the Nokuku cage IC, a similar electronic component assembly can be made using the flat/to-package IC shown in FIG. a first strip-shaped elongated material having a recess; and a second strip-like elongated material on one side of the first strip-like elongated material that can cover the opening of the recess.
It consists of a long strip of material.
前記凹みが電子部品の部品本体又ＨＩＪ−ド線又はその
両方で電子部品を位置決めする凸部又は凹部等の係合部
を有し、前記凸部又は凹部に電子部品を位置決め搭載し
、第１．第２の帯状長尺材料の一方もしくは両方に機械
送り可能な送り案内手段を設けてあり一電子部品装着機
の認識装置の対応できるずれの範囲で電子部品を位置決
めすることかでき、電子部品のリード線の先端部を保護
しており５部品収納容積を大きく必−夕とぜず、送り案
内手段で電子部品を多数個連続して確実に送ることかで
き、電子部品の連続安定供給を可能にする電子部品集合
体として有益なものである。The recess has an engaging portion such as a protrusion or a recess for positioning the electronic component with the component body of the electronic component or the HIJ-domain or both, and the electronic component is positioned and mounted in the protrusion or the recess, and ．． One or both of the second strip-like elongated materials are provided with a mechanically-feedable feed guide means, and the electronic components can be positioned within the range of deviation that can be handled by the recognition device of the electronic component mounting machine. The tips of the lead wires are protected, and without the need for a large storage capacity for 5 components, the feeding guide means can reliably feed a large number of electronic components in succession, allowing for a continuous and stable supply of electronic components. It is useful as an assembly of electronic components.
第１図は電子部品の一例としてのフラ７）バクケージＩ
Ｃの斜視図、第２図は電子部品の一例としての４方向フ
ラツトパツケージＩＣの斜視図−第３図は従来の電子部
品集合体の一例であるトレイによるものを示す斜視図−
第４図は従来の電子部品集合体としての収納穴付テープ
を示す斜視図。第５図、第６図は従来の電子部品集合体としての粘着テ
ープによるものを示す平面図及び断面図。第７図ａＵ本発明の第１の実施例を示す平面図−第７図
ｂＶ：Ｌ同断面図−第８図は本発明の第２の実施例を示
す断面図、第９図は本発明の第３の実施例を示す断面図
である。１・・・・・・電子部品、７−・−・第１の帯状長尺材
料としてのテープ−７ａ・・・・・凹み一７ｂ・・・・
凸部−７Ｃ・・・・・・凸部−７ｄ・・・・・穴−７ｅ
・・・・凹部、γｆ・・・・凹部−７ｇ・・・・・凸部
、８・・・・−第２の帯状長尺材料としてのテープ−８
ａ−・・・・・穴−９・・、送り穴。代理人の氏名 弁理士 中 尾 敏 男 ほか１名第５
図第６図Figure 1 shows an example of an electronic component.
FIG. 2 is a perspective view of a four-way flat package IC as an example of an electronic component; FIG. 3 is a perspective view of a tray as an example of a conventional electronic component assembly; FIG.
FIG. 4 is a perspective view showing a tape with storage holes as a conventional electronic component assembly. FIG. 5 and FIG. 6 are a plan view and a sectional view showing a conventional electronic component assembly using adhesive tape. Fig. 7 aU is a plan view showing the first embodiment of the present invention - Fig. 7 b is a sectional view of the same V:L - Fig. 8 is a sectional view showing the second embodiment of the present invention, Fig. 9 is a sectional view showing the second embodiment of the present invention FIG. 3 is a sectional view showing a third embodiment of the present invention. 1...Electronic component, 7-...Tape as the first strip-shaped elongated material-7a...Recess 7b...
Convex part -7C... Convex part -7d... Hole -7e
...Concave portion, γf...Concave portion-7g...Convex portion, 8...-Tape as second strip-shaped elongated material-8
a-...Hole-9..., Sprocket hole. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 5
Figure 6
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22253183AJPS60113998A (en) | 1983-11-26 | 1983-11-26 | Electronic part assembly |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22253183AJPS60113998A (en) | 1983-11-26 | 1983-11-26 | Electronic part assembly |
| Publication Number | Publication Date |
|---|---|
| JPS60113998Atrue JPS60113998A (en) | 1985-06-20 |
| JPH0442260B2 JPH0442260B2 (en) | 1992-07-10 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22253183AGrantedJPS60113998A (en) | 1983-11-26 | 1983-11-26 | Electronic part assembly |
| Country | Link |
|---|---|
| JP (1) | JPS60113998A (en) |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6470370A (en)* | 1987-09-07 | 1989-03-15 | Nec Corp | Packaging material for semiconductor device |
| JPH0215464U (en)* | 1988-03-01 | 1990-01-31 | ||
| WO1990004915A1 (en) | 1988-10-27 | 1990-05-03 | Reel Service Limited | Tape for storage of electronic components |
| JPH0362997A (en)* | 1989-07-31 | 1991-03-19 | Elna Co Ltd | Electronic parts string |
| JPH0338763U (en)* | 1989-08-25 | 1991-04-15 | ||
| JPH03133761A (en)* | 1989-10-12 | 1991-06-06 | Sumitomo Bakelite Co Ltd | Carrier tape for semiconductor device |
| JPH03133762A (en)* | 1989-10-12 | 1991-06-06 | Sumitomo Bakelite Co Ltd | Carrier tape for semiconductor device |
| WO1991012187A1 (en)* | 1990-02-06 | 1991-08-22 | Sumitomo Bakelite Company Limited | Covering tape for electronic component chip |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS556860A (en)* | 1978-06-29 | 1980-01-18 | Matsushita Electric Ind Co Ltd | Electronic part assembly |
| JPS56117580U (en)* | 1980-02-08 | 1981-09-08 | ||
| JPS587399U (en)* | 1981-07-03 | 1983-01-18 | 松下電器産業株式会社 | Tape for chip parts |
| JPS5952697U (en)* | 1982-09-29 | 1984-04-06 | 山形日本電気株式会社 | packaging tape |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS556860A (en)* | 1978-06-29 | 1980-01-18 | Matsushita Electric Ind Co Ltd | Electronic part assembly |
| JPS56117580U (en)* | 1980-02-08 | 1981-09-08 | ||
| JPS587399U (en)* | 1981-07-03 | 1983-01-18 | 松下電器産業株式会社 | Tape for chip parts |
| JPS5952697U (en)* | 1982-09-29 | 1984-04-06 | 山形日本電気株式会社 | packaging tape |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6470370A (en)* | 1987-09-07 | 1989-03-15 | Nec Corp | Packaging material for semiconductor device |
| JPH0215464U (en)* | 1988-03-01 | 1990-01-31 | ||
| WO1990004915A1 (en) | 1988-10-27 | 1990-05-03 | Reel Service Limited | Tape for storage of electronic components |
| JPH04500058A (en)* | 1988-10-27 | 1992-01-09 | リール サービス リミテッド | Electronic component storage tape |
| JPH0362997A (en)* | 1989-07-31 | 1991-03-19 | Elna Co Ltd | Electronic parts string |
| JPH0338763U (en)* | 1989-08-25 | 1991-04-15 | ||
| JPH03133761A (en)* | 1989-10-12 | 1991-06-06 | Sumitomo Bakelite Co Ltd | Carrier tape for semiconductor device |
| JPH03133762A (en)* | 1989-10-12 | 1991-06-06 | Sumitomo Bakelite Co Ltd | Carrier tape for semiconductor device |
| WO1991012187A1 (en)* | 1990-02-06 | 1991-08-22 | Sumitomo Bakelite Company Limited | Covering tape for electronic component chip |
| US5346765A (en)* | 1990-02-06 | 1994-09-13 | Sumitono Bakelite Company Limited | Cover tape for packaging chip type electronic parts |
| Publication number | Publication date |
|---|---|
| JPH0442260B2 (en) | 1992-07-10 |
| Publication | Publication Date | Title |
|---|---|---|
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| JP3158480B2 (en) | Tape carrier mounting method and liquid crystal display device manufacturing method | |
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| JPS5860600A (en) | Electronic part assembly | |
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