JPS5950445U - electronic cooling element - Google Patents

Abstract

Translated fromJapanese

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

Translated fromJapanese

【図面の簡単な説明】[Brief explanation of drawings]

第１図は従来の電子冷却素子を示す正面図、第２図は従
来の素子を示す正面図、第２図は従来の冷却素子にヒー
トシンクを付けた状態を示す図、第３図はこの考案によ
る電子冷却素子の一例を示す正面図、第４図はその他の
例を示す正面図である。１：Ｎ形半導体、２：Ｐ形半導体、３：導体片、７：放
熱フィン、９．１０：金属基板、１１：ホーロー引き、
１２．１３：ホーロー基板。第３図Ｌｊ　　　ｕ　　　ｕ　　　ｕ　　　Ｌｊゝｑ−才　４
　Ｍ口　　　　　　　　　　　　口口口Ｌ■１日Ｌ＋−７Figure 1 is a front view of a conventional electronic cooling element, Figure 2 is a front view of a conventional element, Figure 2 is a diagram of a conventional cooling element with a heat sink attached, and Figure 3 is this invention. FIG. 4 is a front view showing an example of an electronic cooling device according to the present invention, and FIG. 4 is a front view showing another example. 1: N-type semiconductor, 2: P-type semiconductor, 3: Conductor piece, 7: Radiation fin, 9.10: Metal substrate, 11: Enamel drawn,
12.13: Enamel board. Figure 3 Lj u u Ljゝq-years old 4
M mouth mouth mouth L■1 day L+-7

Claims (1)

Translated fromJapanese

【実用新案登録請求の範囲】[Scope of utility model registration request]Ｐ形半導体とＮ形半導体とが交互に配列され、これら半
導体の隣接するものの一面と、他面とが交互にそれぞれ
導体片で接続されて全体の半導体が直列に接続され、金
属基板上にホーロ引きされた基板に上記−面の導体片が
固着されている電子冷却素子。P-type semiconductors and N-type semiconductors are arranged alternately, and one side and the other side of adjacent semiconductors are alternately connected with conductor pieces, so that the entire semiconductor is connected in series, and a hole is formed on the metal substrate. An electronic cooling element in which a conductor piece on the negative side is fixed to a drawn substrate.