【発明の詳細な説明】〔発明の利用分野〕本発明は、印刷配線技術によって製作される小形ｈｌｒ
ｌ上平タ用のコ・１ルに［ｔ、６゜〔発明の背景〕従来、慣性が小さく、加速性能の良好なモータとして、
絶縁板上に印刷配線技術によって形成された扁平な導体
箔のコイルを有するいわゆるプリントモータが用いられ
ている。性能の良好なプリントモータ？得るためには、
コイル導体の間隔を狭く、膜厚を犬にしてコイルの巻線
密度を高くし、コイル束の断面において導体の占める割
合すなわち導体古漬率を出来るだけ大きくすることが必
要である。DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a small HLR manufactured by printed wiring technology.
[t, 6°] [Background of the Invention] Conventionally, as a motor with small inertia and good acceleration performance,
A so-called printed motor is used, which has a flat conductor foil coil formed on an insulating plate by printed wiring technology. A print motor with good performance? In order to get
It is necessary to increase the winding density of the coil by narrowing the spacing between the coil conductors and increasing the film thickness, and to increase as much as possible the proportion of the conductors in the cross section of the coil bundle, that is, the percentage of conductors used.
従来、プリントコイルは、金属板１例えばステンレス板
を用い、根土にコイルとは逆パターンのめつきレジスト
２を形成し、露出するステンレス板面に電気銅めっきを
施して渦巻き状のコイル導体３を形成する。次に該導体
３を接着剤４付きの絶縁性フィルム５に転写してコイル
シート６を作成する。さらに・コイルの巻数を増すため
にコイルシート６と接着剤４′とを交互に多数枚重ね合
せて接着、一体化し、層間のコイルを直列に接続し′Ｃ
完成している。Conventionally, printed coils are manufactured by using a metal plate 1, such as a stainless steel plate, forming a plating resist 2 in the base soil with a pattern opposite to that of the coil, and applying electrolytic copper plating to the exposed stainless steel plate surface to form a spiral coil conductor 3. form. Next, the conductor 3 is transferred onto an insulating film 5 with an adhesive 4 attached to form a coil sheet 6. Furthermore, in order to increase the number of turns of the coil, a large number of coil sheets 6 and adhesive 4' are alternately stacked, bonded and integrated, and the coils between the layers are connected in series.
It's completed.
しかし・この方法においては導体膜厚をめっきレジスト
より大きくするとめつき膜が側方に広がるサイトスブリ
ージング現象が顕著であるため、隣接する導体と短絡し
、めっきレジストの膜厚より導体膜厚を大きくできない
。また、めっきレジストとして使用される感光性樹脂フ
ィルムは、高々７５μｍであり、核フィルムの膜厚を大
きくすると結果として形成できるレジストパターンの精
度が低下する。これらのことより従来技術では導体間隔
が狭く、膜厚の大きい導体を形成することが難しい。However, in this method, when the thickness of the conductor film is made larger than the plating resist, the phenomenon of site bleeding, where the plating film spreads laterally, is noticeable, resulting in a short circuit with the adjacent conductor, and the thickness of the conductor film being larger than the thickness of the plating resist. I can't make it bigger. Further, the photosensitive resin film used as a plating resist has a thickness of at most 75 μm, and as the thickness of the core film increases, the precision of the resist pattern that can be formed decreases. For these reasons, in the prior art, it is difficult to form a conductor with a narrow conductor interval and a large film thickness.
本発明の目的は、上述した従来技術の問題点を解消し、
巻線密度が高く、導体占積率の大きいプリントコイルを
提供することにある。The purpose of the present invention is to solve the problems of the prior art described above,
The object of the present invention is to provide a printed coil with a high winding density and a large conductor space factor.
感光性樹脂フィルムを用いて金属板ｌ上に渦巻き状のめ
つきレジスト２を形成し・該レジストの膜厚まで電気銅
めっきで導体３′！！−形成し、然るのちに無電解銅め
っきを行い、最終的にきのこ形の断面形状を有する導体
３′を形成するものである。A spiral plating resist 2 is formed on a metal plate 1 using a photosensitive resin film, and a conductor 3' is formed by electrolytic copper plating up to the thickness of the resist. ! - formed, followed by electroless copper plating to finally form a conductor 3' having a mushroom-shaped cross-section.
本発明において、無電解めっきを用いる理由は電気めっ
きに比べてサイトスブリージングが少なく、従って導体
膜厚を大きくできることによるものである。In the present invention, the reason why electroless plating is used is that it causes less cytobleeding than electroplating and can therefore increase the thickness of the conductor film.
本発明で使用される無電解銅めっき液は、主成分として
、銅塩、錯化剤、還元剤、ｐＨ調整剤を含有して成り、
良質のめつき膜を短時間で得るために、めっき液を加熱
し、一定温度に保持してめっきを行うものである。The electroless copper plating solution used in the present invention contains a copper salt, a complexing agent, a reducing agent, and a pH adjuster as main components.
In order to obtain a high-quality plated film in a short time, plating is performed by heating the plating solution and maintaining it at a constant temperature.
以下に本発明を実施例によシ具体的に説明する。The present invention will be specifically explained below using examples.
実施例金属板として厚み０．５闇のステンレス板を用い・表面
を＋１０００のエメリーペーパで研磨した。Example A stainless steel plate with a thickness of 0.5 mm was used as the metal plate, and the surface was polished with +1000 emery paper.
次に中性洗剤、トリクミルエチレン中で超音波洗浄を行
い、清浄化した表面に、ネガ型フォトレジスト（チオコ
ールダイナケム社、ラミノーＧＴ、膜厚５０μｍ）を張
り付け、コイルパターンのネガマスクを密着した。その
後、超高圧水銀灯を光源とする露光機により紫外線を照
射し・さらにトリクロルエタン中で現像を行ってめっき
レジストを形成した。Next, perform ultrasonic cleaning in a neutral detergent and tricumyl ethylene, apply a negative photoresist (Thiocol Dynachem, Laminor GT, film thickness 50 μm) to the cleaned surface, and adhere a coil pattern negative mask. did. Thereafter, a plating resist was formed by irradiating ultraviolet rays with an exposure machine using an ultra-high pressure mercury lamp as a light source and developing in trichloroethane.
次に下記組成硫酸銅・五水和物 ２００ｇ硫酸
５０ｇＪＭ化ナトリウム
１ｇチオ尿素
０．０１ｇ水 全体を１
ｔにする量から成る電気銅めっき液に浸漬し、液温３０
℃、カソード電流３Ａ／ｄｍ２でめっきし、膜厚５０μ
ｍで導体幅２５０μｍ、導体間隔８０１ｔｍの渦巻き状
のコイル導体を形成した。Next, add copper sulfate pentahydrate with the following composition: 200g sulfuric acid
50g Sodium JM
1g thiourea
0.01g water total 1
Immerse it in an electrolytic copper plating solution consisting of an amount of
℃, cathode current 3A/dm2, film thickness 50μ
A spiral coil conductor with a conductor width of 250 μm and a conductor interval of 801 tm was formed.
さらに下記組成硫酸銅・五水和物 １０〜２０ｇエチレ
ンジアミン四酢酸二ナトリウム・二水和物１０〜６０ｇホルムアルデヒド（３７ｑ６） １〜１０ｍｌ
ｍｌエリレングリコール １０〜４０ｍｔ２．２
′ジピリジル １０〜５０ｍ７水酸化ナトリ
ウム １０〜２０ｇ水
全体を１ｔにする量から成る無電解銅めっき液を用
い、液温を７０′Ｃに加熱した状態の液に該コイルを２
時間浸漬し、２０μｍの膜厚のめっきを行って、膜厚が
７０μｍのコイル導体を完成した。Furthermore, the following composition: Copper sulfate pentahydrate 10-20g Disodium ethylenediaminetetraacetate dihydrate 10-60g Formaldehyde (37q6) 1-10ml
ml erylene glycol 10-40mt2.2
'Dipyridyl 10-50m7 Sodium hydroxide 10-20g Water
Using an electroless copper plating solution with a total amount of 1 ton, the coil was immersed in the solution heated to 70'C.
The coil conductor was immersed for a period of time and plated to a thickness of 20 μm to complete a coil conductor having a thickness of 70 μm.
次に厚さ１２μｍのポリエステルフィルムを用い、ニト
リルゴム変性フエノーシ樹脂系接着剤（セール・チルニ
ー（ジャパン）リミテッド、エバーグリップ７０５Ｈ）
’５＝アプリケータで塗布、指触乾燥した両面接着剤付
きフィルムを用い、無電解銅めっき面を接着剤側にして
・コイルシート２枚を配置し、全体を温度８０℃に加熱
・加圧して接着し、冷却後、ステンレス板を剥離してプ
リントコイルを作成した。Next, using a polyester film with a thickness of 12 μm, a nitrile rubber-modified phenolic resin adhesive (Sale Chilny (Japan) Limited, Evergrip 705H) was used.
'5 = Apply with an applicator and use a film with double-sided adhesive that is dry to the touch, with the electroless copper plating side facing the adhesive side. ・Arrange two coil sheets, and heat and pressurize the whole to a temperature of 80℃. After cooling, the stainless steel plate was peeled off to create a printed coil.
本発明の方法により作成したプリントコイルについて、
導体占積率を調べた結果６７優であり、従来法のように
導体膜厚をめっきレジストの膜厚と同じにしたものの６
３チに比べ、４チ向上した。Regarding the printed coil created by the method of the present invention,
As a result of examining the conductor space factor, it was 67. Although the conductor film thickness was made the same as the plating resist film thickness as in the conventional method, it was 67.
This is an improvement of 4 points compared to 3 points.
なお、めっきレジスト上での化学銅めっきによる導体の
側方への広がりは、膜厚２０μｍに対して１０μｍであ
り、隣接する導体との短絡が認められなかった。The lateral spread of the conductor due to chemical copper plating on the plating resist was 10 μm for a film thickness of 20 μm, and no short circuit with adjacent conductors was observed.
第１図は従来技術によるプリントコイルの製造工程を示
す図、第２図は本発明によるプリントコイルの製造工程
を示す図である。１・・・金属板、２・・・めっきレジスト、３・・・コ
イル導体、４．４′・・・接着剤、５・・・絶縁性フィ
ルム、６第 ｌ 口第 ２ 口／１頁の続き０発 明 者 用窪鐘治勝川市大字稲田１４１Ｏ番地株式会社日立製作所東海工場内FIG. 1 is a diagram showing a manufacturing process of a printed coil according to the prior art, and FIG. 2 is a diagram showing a manufacturing process of a printed coil according to the present invention. DESCRIPTION OF SYMBOLS 1...Metal plate, 2...Plating resist, 3...Coil conductor, 4.4'...Adhesive, 5...Insulating film, 6th port 2nd port/page 1 Continuing 0 inventions Author Kaneji Yokubo 1410 Oaza Inada, Katsukawa City Hitachi, Ltd. Tokai Factory
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58077479AJPS59204449A (en) | 1983-05-04 | 1983-05-04 | How to manufacture printed coils |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58077479AJPS59204449A (en) | 1983-05-04 | 1983-05-04 | How to manufacture printed coils |
| Publication Number | Publication Date |
|---|---|
| JPS59204449Atrue JPS59204449A (en) | 1984-11-19 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58077479APendingJPS59204449A (en) | 1983-05-04 | 1983-05-04 | How to manufacture printed coils |
| Country | Link |
|---|---|
| JP (1) | JPS59204449A (en) |
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|---|---|---|---|---|
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| JPH08138941A (en)* | 1994-09-12 | 1996-05-31 | Matsushita Electric Ind Co Ltd | Multilayer ceramic chip inductor and manufacturing method thereof |
| EP0716434A1 (en)* | 1994-12-06 | 1996-06-12 | AT&T Corp. | High Q intergrated inductor |
| WO1997030506A1 (en)* | 1996-02-16 | 1997-08-21 | Hitachi, Ltd. | Stator winding of rotating electric machine and its manufacturing method |
| JP2004006964A (en)* | 1994-09-12 | 2004-01-08 | Matsushita Electric Ind Co Ltd | Multilayer ceramic chip inductor and method of manufacturing the same |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61254039A (en)* | 1985-05-02 | 1986-11-11 | Sony Corp | Circuit pattern formation method |
| JPH08138941A (en)* | 1994-09-12 | 1996-05-31 | Matsushita Electric Ind Co Ltd | Multilayer ceramic chip inductor and manufacturing method thereof |
| JP2004006964A (en)* | 1994-09-12 | 2004-01-08 | Matsushita Electric Ind Co Ltd | Multilayer ceramic chip inductor and method of manufacturing the same |
| EP0716434A1 (en)* | 1994-12-06 | 1996-06-12 | AT&T Corp. | High Q intergrated inductor |
| KR100232334B1 (en)* | 1994-12-06 | 1999-12-01 | 엘리 웨이스 | High q, integrated inductor |
| WO1997030506A1 (en)* | 1996-02-16 | 1997-08-21 | Hitachi, Ltd. | Stator winding of rotating electric machine and its manufacturing method |
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