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JPS59150691U - Anti-freezing device for tanks on ships in ice seas - Google Patents

Anti-freezing device for tanks on ships in ice seas

Info

Publication number
JPS59150691U
JPS59150691UJP4608983UJP4608983UJPS59150691UJP S59150691 UJPS59150691 UJP S59150691UJP 4608983 UJP4608983 UJP 4608983UJP 4608983 UJP4608983 UJP 4608983UJP S59150691 UJPS59150691 UJP S59150691U
Authority
JP
Japan
Prior art keywords
tanks
ships
freezing device
ice
seas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4608983U
Other languages
Japanese (ja)
Inventor
西本　綱徳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kanadevia Corp
Original Assignee
Hitachi Zosen Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Zosen CorpfiledCriticalHitachi Zosen Corp
Priority to JP4608983UpriorityCriticalpatent/JPS59150691U/en
Publication of JPS59150691UpublicationCriticalpatent/JPS59150691U/en
Pendinglegal-statusCriticalCurrent

Links

Abstract

Translated fromJapanese

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

Translated fromJapanese
【図面の簡単な説明】[Brief explanation of the drawing]

第１図はこの考案の１実施例を示す横断面図、第２図は
回能の実施例を示す横断面図である。Ｔ・・・・・・タンク、２．　４．　２２・・・・・２
・加熱流体区画、５．２３・・・・・・加熱装置、６．
２４・・・・・・循環管。FIG. 1 is a cross-sectional view showing one embodiment of this invention, and FIG. 2 is a cross-sectional view showing an embodiment of the invention. T...Tank, 2. 4. 22...2
- Heating fluid compartment, 5.23... Heating device, 6.
24...Circulation pipe.

Claims (1)

Translated fromJapanese
【実用新案登録請求の範囲】[Scope of utility model registration request]タンクＴ内の低温外気と接する部分に、該部分にそうよ
うに加熱流体区画２．　４．　２２が設けられるととも
に、その下部に加熱装置５．２３が配置せられ、加熱流
体区画２．　４．　２２の下部と同上部とをつなぐ循環
管６．２４が設けられた氷海船におけるタンクの凍結防
止装置。A heated fluid compartment 2. is placed in the part of the tank T that comes into contact with the cold outside air, so as to correspond to that part. 4. 22 and in the lower part of which a heating device 5.23 is arranged, the heated fluid compartment 2. 4. An anti-freeze system for tanks in ice-water vessels equipped with a circulation pipe 6.24 connecting the lower part of 22 and the upper part of the same.
JP4608983U1983-03-291983-03-29 Anti-freezing device for tanks on ships in ice seasPendingJPS59150691U (en)

Priority Applications (1)

Application NumberPriority DateFiling DateTitle
JP4608983UJPS59150691U (en)1983-03-291983-03-29 Anti-freezing device for tanks on ships in ice seas

Applications Claiming Priority (1)

Application NumberPriority DateFiling DateTitle
JP4608983UJPS59150691U (en)1983-03-291983-03-29 Anti-freezing device for tanks on ships in ice seas

Publications (1)

Publication NumberPublication Date
JPS59150691Utrue JPS59150691U (en)1984-10-08

Family

ID=30176635

Family Applications (1)

Application NumberTitlePriority DateFiling Date
JP4608983UPendingJPS59150691U (en)1983-03-291983-03-29 Anti-freezing device for tanks on ships in ice seas

Country Status (1)

CountryLink
JP (1)JPS59150691U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US8927900B2 (en)2000-09-132015-01-06Hamamatsu Photonics K.K.Method of cutting a substrate, method of processing a wafer-like object, and method of manufacturing a semiconductor device
US8969752B2 (en)2003-03-122015-03-03Hamamatsu Photonics K.K.Laser processing method

Cited By (5)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US8927900B2 (en)2000-09-132015-01-06Hamamatsu Photonics K.K.Method of cutting a substrate, method of processing a wafer-like object, and method of manufacturing a semiconductor device
US8933369B2 (en)2000-09-132015-01-13Hamamatsu Photonics K.K.Method of cutting a substrate and method of manufacturing a semiconductor device
US8946589B2 (en)2000-09-132015-02-03Hamamatsu Photonics K.K.Method of cutting a substrate, method of cutting a wafer-like object, and method of manufacturing a semiconductor device
US8969761B2 (en)2000-09-132015-03-03Hamamatsu Photonics K.K.Method of cutting a wafer-like object and semiconductor chip
US8969752B2 (en)2003-03-122015-03-03Hamamatsu Photonics K.K.Laser processing method

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