JPS5877099U - Pipe for transporting chip parts - Google Patents

Abstract

Translated fromJapanese

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

Translated fromJapanese

【図面の簡単な説明】[Brief explanation of the drawing]

第１図及び第２図はチップ部品のプリント配線工程を示
す部分断面図、第３図は第１図のマウントに用いる従来
装置の部分断面図、第４図は本考案に係るマウント装置
の拡大部分断面図、第５図は第４図の装置の■−■線に
沿った搬送用パイプの拡大断面図、及び第６図は第５図
のパイプ内を通過するチップ部品の斜視図である。７・・・・・・チップ部品、１１・・・・・・ホッパー
、３０・・・・・・搬送用パイプ、３１・・・・・・チ
ューブ、３２・・・・・・突条、３３・・・・・・溝部
。Figures 1 and 2 are partial cross-sectional views showing the printed wiring process for chip components, Figure 3 is a partial cross-sectional view of a conventional device used for the mounting shown in Figure 1, and Figure 4 is an enlarged view of the mounting device according to the present invention. 5 is an enlarged sectional view of the conveying pipe taken along the line ■-■ of the apparatus shown in FIG. 4, and FIG. 6 is a perspective view of a chip component passing through the pipe shown in FIG. 5. . 7... Chip parts, 11... Hopper, 30... Conveying pipe, 31... Tube, 32... Projection, 33・・・・・・Mizobe.

Claims (1)

Translated fromJapanese

【実用新案登録請求の範囲】[Scope of utility model registration request]ホッパーから個々に取り出されるチップ部品をパイプの
内部通路を経て所定位置に供給する電子部品マウント装
置において、前記パイプ内面にチップ部品の供給方向に
沿う縦方向の突条又は溝部を形成し前記チップ部品の移
動に際して生ずる空気抵抗を軽減したことを特徴とする
チップ部品の搬送用パイプ。In an electronic component mounting device that supplies chip components individually taken out from a hopper to a predetermined position through an internal passage of a pipe, a longitudinal protrusion or groove is formed on the inner surface of the pipe along the supply direction of the chip components, and the chip components A pipe for transporting chip parts, characterized by reduced air resistance that occurs when moving.