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JPS58182823U - Molding mounting structure - Google Patents

Molding mounting structure

Info

Publication number
JPS58182823U
JPS58182823UJP7990882UJP7990882UJPS58182823UJP S58182823 UJPS58182823 UJP S58182823UJP 7990882 UJP7990882 UJP 7990882UJP 7990882 UJP7990882 UJP 7990882UJP S58182823 UJPS58182823 UJP S58182823U
Authority
JP
Japan
Prior art keywords
molding
mounting structure
peripheral edge
panel
molding mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7990882U
Other languages
Japanese (ja)
Inventor
小枝 至
堀家 昌芳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nissan Motor Co Ltd
Original Assignee
Nissan Motor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissan Motor Co LtdfiledCriticalNissan Motor Co Ltd
Priority to JP7990882UpriorityCriticalpatent/JPS58182823U/en
Publication of JPS58182823UpublicationCriticalpatent/JPS58182823U/en
Pendinglegal-statusCriticalCurrent

Links

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Abstract

Translated fromJapanese

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

Translated fromJapanese
【図面の簡単な説明】[Brief explanation of drawings]

′第1図は自動車の後半部を示した斜視図、第2図は従
来例を示しウィンドパネルを取外した状態の背面図、第
3図は従来例のモールの取付状態を示した切断面図、第
4図はこの考案の実施例を示しモールの取付構造を示し
た切断斜視図、第5図は同一のモールの一部分を示した
側面図、第6図は取付状態を示した切断面図、第7図は
モールの変形例を示した切断面図である。主要な図面符号の説明、1・・・車体パネル、5・・・
開口周縁部、9・・・ウィンドパネル、13・・・モー
ル、 −15・・・脚部、91.91’・・・周縁部、
17゜17a・・・周縁開口部、29・・・スペーサー
(間隙調節部材)、35・・・スペーサ一部(間隙調節
部材)。
'Figure 1 is a perspective view showing the rear half of the automobile, Figure 2 is a rear view of a conventional example with the wind panel removed, and Figure 3 is a sectional view showing the conventional example with the molding installed. , Fig. 4 is a cutaway perspective view showing an embodiment of this invention and shows the mounting structure of the molding, Fig. 5 is a side view showing a part of the same molding, and Fig. 6 is a cutaway view showing the mounting state. , FIG. 7 is a sectional view showing a modification of the molding. Explanation of main drawing symbols, 1... Vehicle body panel, 5...
Opening periphery, 9... Wind panel, 13... Molding, -15... Leg, 91.91'... Periphery,
17° 17a... Peripheral opening, 29... Spacer (gap adjustment member), 35... Part of spacer (gap adjustment member).

Claims (1)

Translated fromJapanese
【実用新案登録請求の範囲】[Scope of utility model registration request]ウィンドパネルが装着される車体パネル開口周縁部と該
ウィンドパネルの周縁部とで構成される周縁開口部にモ
ールの脚部が嵌挿固定されるようなモールの取付構造に
おいて、前記周縁開口部の少くとも下側部に嵌挿される
前記モールの脚部に上記ウィンドパネル周縁部と車体パ
ネルの開口周縁部との間隙を調節する間隙調節部材を脚
部と一体または別体に設けたことを特徴とするモールの
取付構造。
In a molding mounting structure in which legs of a molding are fitted and fixed to a peripheral opening formed by a peripheral opening of a vehicle body panel to which a wind panel is attached and a peripheral edge of the wind panel, A gap adjusting member for adjusting the gap between the wind panel peripheral edge and the opening peripheral edge of the vehicle body panel is provided on at least the leg of the molding that is fitted into the lower side part, either integrally with the leg or separately. Mounting structure of the molding.
JP7990882U1982-06-011982-06-01 Molding mounting structurePendingJPS58182823U (en)

Priority Applications (1)

Application NumberPriority DateFiling DateTitle
JP7990882UJPS58182823U (en)1982-06-011982-06-01 Molding mounting structure

Applications Claiming Priority (1)

Application NumberPriority DateFiling DateTitle
JP7990882UJPS58182823U (en)1982-06-011982-06-01 Molding mounting structure

Publications (1)

Publication NumberPublication Date
JPS58182823Utrue JPS58182823U (en)1983-12-06

Family

ID=30089080

Family Applications (1)

Application NumberTitlePriority DateFiling Date
JP7990882UPendingJPS58182823U (en)1982-06-011982-06-01 Molding mounting structure

Country Status (1)

CountryLink
JP (1)JPS58182823U (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US6911136B2 (en)2002-04-292005-06-28Applied Materials, Inc.Method for regulating the electrical power applied to a substrate during an immersion process
US6913680B1 (en)2000-05-022005-07-05Applied Materials, Inc.Method of application of electrical biasing to enhance metal deposition
US6929774B2 (en)1997-07-102005-08-16Applied Materials, Inc.Method and apparatus for heating and cooling substrates
US7094291B2 (en)1990-05-182006-08-22Semitool, Inc.Semiconductor processing apparatus
US7144805B2 (en)1998-02-042006-12-05Semitool, Inc.Method of submicron metallization using electrochemical deposition of recesses including a first deposition at a first current density and a second deposition at an increased current density
US7192494B2 (en)1999-03-052007-03-20Applied Materials, Inc.Method and apparatus for annealing copper films
US7285195B2 (en)2004-06-242007-10-23Applied Materials, Inc.Electric field reducing thrust plate
US7311810B2 (en)2003-04-182007-12-25Applied Materials, Inc.Two position anneal chamber
US7399713B2 (en)1998-03-132008-07-15Semitool, Inc.Selective treatment of microelectric workpiece surfaces
US7462269B2 (en)1998-02-042008-12-09Semitool, Inc.Method for low temperature annealing of metallization micro-structures in the production of a microelectronic device

Cited By (11)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US7094291B2 (en)1990-05-182006-08-22Semitool, Inc.Semiconductor processing apparatus
US7138016B2 (en)1990-05-182006-11-21Semitool, Inc.Semiconductor processing apparatus
US6929774B2 (en)1997-07-102005-08-16Applied Materials, Inc.Method and apparatus for heating and cooling substrates
US7144805B2 (en)1998-02-042006-12-05Semitool, Inc.Method of submicron metallization using electrochemical deposition of recesses including a first deposition at a first current density and a second deposition at an increased current density
US7462269B2 (en)1998-02-042008-12-09Semitool, Inc.Method for low temperature annealing of metallization micro-structures in the production of a microelectronic device
US7399713B2 (en)1998-03-132008-07-15Semitool, Inc.Selective treatment of microelectric workpiece surfaces
US7192494B2 (en)1999-03-052007-03-20Applied Materials, Inc.Method and apparatus for annealing copper films
US6913680B1 (en)2000-05-022005-07-05Applied Materials, Inc.Method of application of electrical biasing to enhance metal deposition
US6911136B2 (en)2002-04-292005-06-28Applied Materials, Inc.Method for regulating the electrical power applied to a substrate during an immersion process
US7311810B2 (en)2003-04-182007-12-25Applied Materials, Inc.Two position anneal chamber
US7285195B2 (en)2004-06-242007-10-23Applied Materials, Inc.Electric field reducing thrust plate

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