′第1図は自動車の後半部を示した斜視図、第2図は従
来例を示しウィンドパネルを取外した状態の背面図、第
3図は従来例のモールの取付状態を示した切断面図、第
4図はこの考案の実施例を示しモールの取付構造を示し
た切断斜視図、第5図は同一のモールの一部分を示した
側面図、第6図は取付状態を示した切断面図、第7図は
モールの変形例を示した切断面図である。主要な図面符号の説明、1・・・車体パネル、5・・・
開口周縁部、9・・・ウィンドパネル、13・・・モー
ル、 −15・・・脚部、91.91’・・・周縁部、
17゜17a・・・周縁開口部、29・・・スペーサー
(間隙調節部材)、35・・・スペーサ一部(間隙調節
部材)。'Figure 1 is a perspective view showing the rear half of the automobile, Figure 2 is a rear view of a conventional example with the wind panel removed, and Figure 3 is a sectional view showing the conventional example with the molding installed. , Fig. 4 is a cutaway perspective view showing an embodiment of this invention and shows the mounting structure of the molding, Fig. 5 is a side view showing a part of the same molding, and Fig. 6 is a cutaway view showing the mounting state. , FIG. 7 is a sectional view showing a modification of the molding. Explanation of main drawing symbols, 1... Vehicle body panel, 5...
 Opening periphery, 9... Wind panel, 13... Molding, -15... Leg, 91.91'... Periphery,
 17° 17a... Peripheral opening, 29... Spacer (gap adjustment member), 35... Part of spacer (gap adjustment member).
| Application Number | Priority Date | Filing Date | Title | 
|---|---|---|---|
| JP7990882UJPS58182823U (en) | 1982-06-01 | 1982-06-01 | Molding mounting structure | 
| Application Number | Priority Date | Filing Date | Title | 
|---|---|---|---|
| JP7990882UJPS58182823U (en) | 1982-06-01 | 1982-06-01 | Molding mounting structure | 
| Publication Number | Publication Date | 
|---|---|
| JPS58182823Utrue JPS58182823U (en) | 1983-12-06 | 
| Application Number | Title | Priority Date | Filing Date | 
|---|---|---|---|
| JP7990882UPendingJPS58182823U (en) | 1982-06-01 | 1982-06-01 | Molding mounting structure | 
| Country | Link | 
|---|---|
| JP (1) | JPS58182823U (en) | 
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| US6911136B2 (en) | 2002-04-29 | 2005-06-28 | Applied Materials, Inc. | Method for regulating the electrical power applied to a substrate during an immersion process | 
| US6913680B1 (en) | 2000-05-02 | 2005-07-05 | Applied Materials, Inc. | Method of application of electrical biasing to enhance metal deposition | 
| US6929774B2 (en) | 1997-07-10 | 2005-08-16 | Applied Materials, Inc. | Method and apparatus for heating and cooling substrates | 
| US7094291B2 (en) | 1990-05-18 | 2006-08-22 | Semitool, Inc. | Semiconductor processing apparatus | 
| US7144805B2 (en) | 1998-02-04 | 2006-12-05 | Semitool, Inc. | Method of submicron metallization using electrochemical deposition of recesses including a first deposition at a first current density and a second deposition at an increased current density | 
| US7192494B2 (en) | 1999-03-05 | 2007-03-20 | Applied Materials, Inc. | Method and apparatus for annealing copper films | 
| US7285195B2 (en) | 2004-06-24 | 2007-10-23 | Applied Materials, Inc. | Electric field reducing thrust plate | 
| US7311810B2 (en) | 2003-04-18 | 2007-12-25 | Applied Materials, Inc. | Two position anneal chamber | 
| US7399713B2 (en) | 1998-03-13 | 2008-07-15 | Semitool, Inc. | Selective treatment of microelectric workpiece surfaces | 
| US7462269B2 (en) | 1998-02-04 | 2008-12-09 | Semitool, Inc. | Method for low temperature annealing of metallization micro-structures in the production of a microelectronic device | 
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| US7094291B2 (en) | 1990-05-18 | 2006-08-22 | Semitool, Inc. | Semiconductor processing apparatus | 
| US7138016B2 (en) | 1990-05-18 | 2006-11-21 | Semitool, Inc. | Semiconductor processing apparatus | 
| US6929774B2 (en) | 1997-07-10 | 2005-08-16 | Applied Materials, Inc. | Method and apparatus for heating and cooling substrates | 
| US7144805B2 (en) | 1998-02-04 | 2006-12-05 | Semitool, Inc. | Method of submicron metallization using electrochemical deposition of recesses including a first deposition at a first current density and a second deposition at an increased current density | 
| US7462269B2 (en) | 1998-02-04 | 2008-12-09 | Semitool, Inc. | Method for low temperature annealing of metallization micro-structures in the production of a microelectronic device | 
| US7399713B2 (en) | 1998-03-13 | 2008-07-15 | Semitool, Inc. | Selective treatment of microelectric workpiece surfaces | 
| US7192494B2 (en) | 1999-03-05 | 2007-03-20 | Applied Materials, Inc. | Method and apparatus for annealing copper films | 
| US6913680B1 (en) | 2000-05-02 | 2005-07-05 | Applied Materials, Inc. | Method of application of electrical biasing to enhance metal deposition | 
| US6911136B2 (en) | 2002-04-29 | 2005-06-28 | Applied Materials, Inc. | Method for regulating the electrical power applied to a substrate during an immersion process | 
| US7311810B2 (en) | 2003-04-18 | 2007-12-25 | Applied Materials, Inc. | Two position anneal chamber | 
| US7285195B2 (en) | 2004-06-24 | 2007-10-23 | Applied Materials, Inc. | Electric field reducing thrust plate | 
| Publication | Publication Date | Title | 
|---|---|---|
| JPS58182823U (en) | Molding mounting structure | |
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