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JPS58171264U - manual fluid dispensing device - Google Patents

manual fluid dispensing device

Info

Publication number
JPS58171264U
JPS58171264UJP6668882UJP6668882UJPS58171264UJP S58171264 UJPS58171264 UJP S58171264UJP 6668882 UJP6668882 UJP 6668882UJP 6668882 UJP6668882 UJP 6668882UJP S58171264 UJPS58171264 UJP S58171264U
Authority
JP
Japan
Prior art keywords
cylindrical piston
dispensing device
piston
fluid dispensing
rod
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6668882U
Other languages
Japanese (ja)
Other versions
JPS6246457Y2 (en
Inventor
関　道紀
Original Assignee
特殊エアゾ−ル株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 特殊エアゾ−ル株式会社filedCritical特殊エアゾ−ル株式会社
Priority to JP6668882UpriorityCriticalpatent/JPS58171264U/en
Publication of JPS58171264UpublicationCriticalpatent/JPS58171264U/en
Application grantedgrantedCritical
Publication of JPS6246457Y2publicationCriticalpatent/JPS6246457Y2/ja
Grantedlegal-statusCriticalCurrent

Links

Landscapes

Abstract

Translated fromJapanese

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

Translated fromJapanese
【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の１実施態様の装置の立話面図である。第２図Ａ、　Ｂは第１図に示す装置の撓み部材部の平面
図と立面断面図である。第３図は第、１図に示す装置の
作動状態を示す図である。これらの図において：１０：ポンプシリンダー、２１：
パケット、２０：筒状ピストン、３０：弾性手段、４０
：逆止弁、５０：棒状ピストン、５２：パケット、９０
：撓み部材。FIG. 1 is an elevational view of an apparatus according to one embodiment of the present invention. 2A and 2B are a plan view and an elevational sectional view of the flexure member portion of the apparatus shown in FIG. 1; FIG. 3 is a diagram showing the operating state of the apparatus shown in FIGS. In these figures: 10: pump cylinder, 21:
Packet, 20: Cylindrical piston, 30: Elastic means, 40
: Check valve, 50: Rod-shaped piston, 52: Packet, 90
: Flexible member.

Claims (1)

Translated fromJapanese
【実用新案登録請求の範囲】[Scope of utility model registration request]ポンプシリンダーと；その下端が該シリンダーの内壁を
摺動する下向きパケットとなっている筒状ピストンと；
該筒状ピストンを上方に押し上げる弾性手段と；シリン
ダーの下端に位置する逆止弁と；前記筒状ピストン内に
流体通路を保って挿入される棒状部と、前記筒状ピスト
ンのパケットの内面を摺動する下向きパケットからなる
棒状ピストンと；前記筒状ピストンの上端と前記棒状ピ
ストンの上端を結合する撓み部材からなる手動流体分与
装置。a pump cylinder; a cylindrical piston whose lower end is a downward packet that slides on the inner wall of the cylinder;
an elastic means for pushing the cylindrical piston upward; a check valve located at the lower end of the cylinder; a rod-shaped portion inserted into the cylindrical piston while maintaining a fluid passage; and an inner surface of the packet of the cylindrical piston. A manual fluid dispensing device comprising: a rod piston comprising a sliding downward packet; and a flexible member connecting the upper end of the cylindrical piston and the upper end of the rod piston.
JP6668882U1982-05-101982-05-10 manual fluid dispensing deviceGrantedJPS58171264U (en)

Priority Applications (1)

Application NumberPriority DateFiling DateTitle
JP6668882UJPS58171264U (en)1982-05-101982-05-10 manual fluid dispensing device

Applications Claiming Priority (1)

Application NumberPriority DateFiling DateTitle
JP6668882UJPS58171264U (en)1982-05-101982-05-10 manual fluid dispensing device

Publications (2)

Publication NumberPublication Date
JPS58171264Utrue JPS58171264U (en)1983-11-15
JPS6246457Y2 JPS6246457Y2 (en)1987-12-15

Family

ID=30076550

Family Applications (1)

Application NumberTitlePriority DateFiling Date
JP6668882UGrantedJPS58171264U (en)1982-05-101982-05-10 manual fluid dispensing device

Country Status (1)

CountryLink
JP (1)JPS58171264U (en)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US6988942B2 (en)2000-02-172006-01-24Applied Materials Inc.Conductive polishing article for electrochemical mechanical polishing
US6991528B2 (en)2000-02-172006-01-31Applied Materials, Inc.Conductive polishing article for electrochemical mechanical polishing
US7014538B2 (en)1999-05-032006-03-21Applied Materials, Inc.Article for polishing semiconductor substrates
US7029365B2 (en)2000-02-172006-04-18Applied Materials Inc.Pad assembly for electrochemical mechanical processing
US7059948B2 (en)2000-12-222006-06-13Applied MaterialsArticles for polishing semiconductor substrates
US7077721B2 (en)2000-02-172006-07-18Applied Materials, Inc.Pad assembly for electrochemical mechanical processing
US7125477B2 (en)2000-02-172006-10-24Applied Materials, Inc.Contacts for electrochemical processing
US7137879B2 (en)2001-04-242006-11-21Applied Materials, Inc.Conductive polishing article for electrochemical mechanical polishing
US7278911B2 (en)2000-02-172007-10-09Applied Materials, Inc.Conductive polishing article for electrochemical mechanical polishing
US7303462B2 (en)2000-02-172007-12-04Applied Materials, Inc.Edge bead removal by an electro polishing process
US7303662B2 (en)2000-02-172007-12-04Applied Materials, Inc.Contacts for electrochemical processing
US7344432B2 (en)2001-04-242008-03-18Applied Materials, Inc.Conductive pad with ion exchange membrane for electrochemical mechanical polishing
US7374644B2 (en)2000-02-172008-05-20Applied Materials, Inc.Conductive polishing article for electrochemical mechanical polishing
US7427340B2 (en)2005-04-082008-09-23Applied Materials, Inc.Conductive pad
US7520968B2 (en)2004-10-052009-04-21Applied Materials, Inc.Conductive pad design modification for better wafer-pad contact

Cited By (21)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US7014538B2 (en)1999-05-032006-03-21Applied Materials, Inc.Article for polishing semiconductor substrates
US7278911B2 (en)2000-02-172007-10-09Applied Materials, Inc.Conductive polishing article for electrochemical mechanical polishing
US6991528B2 (en)2000-02-172006-01-31Applied Materials, Inc.Conductive polishing article for electrochemical mechanical polishing
US7029365B2 (en)2000-02-172006-04-18Applied Materials Inc.Pad assembly for electrochemical mechanical processing
US7569134B2 (en)2000-02-172009-08-04Applied Materials, Inc.Contacts for electrochemical processing
US7077721B2 (en)2000-02-172006-07-18Applied Materials, Inc.Pad assembly for electrochemical mechanical processing
US7125477B2 (en)2000-02-172006-10-24Applied Materials, Inc.Contacts for electrochemical processing
US7137868B2 (en)2000-02-172006-11-21Applied Materials, Inc.Pad assembly for electrochemical mechanical processing
US7374644B2 (en)2000-02-172008-05-20Applied Materials, Inc.Conductive polishing article for electrochemical mechanical polishing
US6988942B2 (en)2000-02-172006-01-24Applied Materials Inc.Conductive polishing article for electrochemical mechanical polishing
US7207878B2 (en)2000-02-172007-04-24Applied Materials, Inc.Conductive polishing article for electrochemical mechanical polishing
US7303662B2 (en)2000-02-172007-12-04Applied Materials, Inc.Contacts for electrochemical processing
US7303462B2 (en)2000-02-172007-12-04Applied Materials, Inc.Edge bead removal by an electro polishing process
US7285036B2 (en)2000-02-172007-10-23Applied Materials, Inc.Pad assembly for electrochemical mechanical polishing
US7344431B2 (en)2000-02-172008-03-18Applied Materials, Inc.Pad assembly for electrochemical mechanical processing
US7059948B2 (en)2000-12-222006-06-13Applied MaterialsArticles for polishing semiconductor substrates
US7344432B2 (en)2001-04-242008-03-18Applied Materials, Inc.Conductive pad with ion exchange membrane for electrochemical mechanical polishing
US7311592B2 (en)2001-04-242007-12-25Applied Materials, Inc.Conductive polishing article for electrochemical mechanical polishing
US7137879B2 (en)2001-04-242006-11-21Applied Materials, Inc.Conductive polishing article for electrochemical mechanical polishing
US7520968B2 (en)2004-10-052009-04-21Applied Materials, Inc.Conductive pad design modification for better wafer-pad contact
US7427340B2 (en)2005-04-082008-09-23Applied Materials, Inc.Conductive pad

Also Published As

Publication numberPublication date
JPS6246457Y2 (en)1987-12-15

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