Movatterモバイル変換

[0]ホーム
URL:

JPS5745959A - Resin-sealed semiconductor device - Google Patents

Resin-sealed semiconductor device

Info

Publication number
JPS5745959A
JPS5745959AJP55121513AJP12151380AJPS5745959AJP S5745959 AJPS5745959 AJP S5745959AJP 55121513 AJP55121513 AJP 55121513AJP 12151380 AJP12151380 AJP 12151380AJP S5745959 AJPS5745959 AJP S5745959A
Authority
JP
Japan
Prior art keywords
resin
hole
semiconductor device
adherence
holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP55121513A
Other languages
Japanese (ja)
Inventor
Shinichi Akashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co LtdfiledCriticalNEC Corp
Priority to JP55121513ApriorityCriticalpatent/JPS5745959A/en
Publication of JPS5745959ApublicationCriticalpatent/JPS5745959A/en
Pendinglegal-statusCriticalCurrent

Links

Classifications

Landscapes

Abstract

PURPOSE:To improve the adherence of a resin sealed simiconductor device by forming a hole at a position isolated from the mounting part of a semiconductor element on a heat dissipating plate, covering and filling sealing resin at the hole part. CONSTITUTION:Holes 6 are formed at four positions suficiently isolated from the mounting part of a semiconductor element 2 on a heat dissipating plate 1, are covered with resin 4, and the resin is also filled in the hole 6. Since the resin is buried even in the holes 6, its adherence is not decreased even at high temperature, and introduction of moisture can be sufficiently prevented.
JP55121513A1980-09-021980-09-02Resin-sealed semiconductor devicePendingJPS5745959A (en)

Priority Applications (1)

Application NumberPriority DateFiling DateTitle
JP55121513AJPS5745959A (en)1980-09-021980-09-02Resin-sealed semiconductor device

Applications Claiming Priority (1)

Application NumberPriority DateFiling DateTitle
JP55121513AJPS5745959A (en)1980-09-021980-09-02Resin-sealed semiconductor device

Publications (1)

Publication NumberPublication Date
JPS5745959Atrue JPS5745959A (en)1982-03-16

Family

ID=14813057

Family Applications (1)

Application NumberTitlePriority DateFiling Date
JP55121513APendingJPS5745959A (en)1980-09-021980-09-02Resin-sealed semiconductor device

Country Status (1)

CountryLink
JP (1)JPS5745959A (en)

Cited By (48)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US5328870A (en)*1992-01-171994-07-12Amkor Electronics, Inc.Method for forming plastic molded package with heat sink for integrated circuit devices
US5604378A (en)*1993-04-071997-02-18Sumitomo Metal Mining Company, LimitedSemiconductor device, its lead frame, and heat spreader having through holes
US5701034A (en)*1994-05-031997-12-23Amkor Electronics, Inc.Packaged semiconductor die including heat sink with locking feature
US6143981A (en)*1998-06-242000-11-07Amkor Technology, Inc.Plastic integrated circuit package and method and leadframe for making the package
US6281568B1 (en)1998-10-212001-08-28Amkor Technology, Inc.Plastic integrated circuit device package and leadframe having partially undercut leads and die pad
US6448633B1 (en)1998-11-202002-09-10Amkor Technology, Inc.Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant
US6469369B1 (en)1999-06-302002-10-22Amkor Technology, Inc.Leadframe having a mold inflow groove and method for making
US6475827B1 (en)1999-10-152002-11-05Amkor Technology, Inc.Method for making a semiconductor package having improved defect testing and increased production yield
US6476478B1 (en)1999-11-122002-11-05Amkor Technology, Inc.Cavity semiconductor package with exposed leads and die pad
US6501161B1 (en)1999-10-152002-12-31Amkor Technology, Inc.Semiconductor package having increased solder joint strength
US6525406B1 (en)1999-10-152003-02-25Amkor Technology, Inc.Semiconductor device having increased moisture path and increased solder joint strength
US6555899B1 (en)1999-10-152003-04-29Amkor Technology, Inc.Semiconductor package leadframe assembly and method of manufacture
US6566164B1 (en)2000-12-072003-05-20Amkor Technology, Inc.Exposed copper strap in a semiconductor package
US6605865B2 (en)2001-03-192003-08-12Amkor Technology, Inc.Semiconductor package with optimized leadframe bonding strength
US6605866B1 (en)1999-12-162003-08-12Amkor Technology, Inc.Stackable semiconductor package and method for manufacturing same
US6608366B1 (en)2002-04-152003-08-19Harry J. FogelsonLead frame with plated end leads
US6611047B2 (en)2001-10-122003-08-26Amkor Technology, Inc.Semiconductor package with singulation crease
US6616436B1 (en)1999-10-152003-09-09Amkor Technology, Inc.Apparatus for manufacturing semiconductor packages
US6627976B1 (en)1999-10-152003-09-30Amkor Technology, Inc.Leadframe for semiconductor package and mold for molding the same
US6627977B1 (en)2002-05-092003-09-30Amkor Technology, Inc.Semiconductor package including isolated ring structure
US6646339B1 (en)1999-10-152003-11-11Amkor Technology, Inc.Thin and heat radiant semiconductor package and method for manufacturing
US6677662B1 (en)1999-10-152004-01-13Amkor Technology, Inc.Clamp and heat block assembly for wire bonding a semiconductor package assembly
US6677663B1 (en)1999-12-302004-01-13Amkor Technology, Inc.End grid array semiconductor package
US6696747B1 (en)1999-10-152004-02-24Amkor Technology, Inc.Semiconductor package having reduced thickness
US6700187B2 (en)2001-03-272004-03-02Amkor Technology, Inc.Semiconductor package and method for manufacturing the same
US6713322B2 (en)2001-03-272004-03-30Amkor Technology, Inc.Lead frame for semiconductor package
US6730544B1 (en)1999-12-202004-05-04Amkor Technology, Inc.Stackable semiconductor package and method for manufacturing same
US6753597B1 (en)1999-12-162004-06-22Amkor Technology, Inc.Encapsulated semiconductor package including chip paddle and leads
US6756658B1 (en)2001-04-062004-06-29Amkor Technology, Inc.Making two lead surface mounting high power microleadframe semiconductor packages
US6798046B1 (en)2002-01-222004-09-28Amkor Technology, Inc.Semiconductor package including ring structure connected to leads with vertically downset inner ends
US6833609B1 (en)1999-11-052004-12-21Amkor Technology, Inc.Integrated circuit device packages and substrates for making the packages
US6841414B1 (en)2002-06-192005-01-11Amkor Technology, Inc.Saw and etch singulation method for a chip package
US6847103B1 (en)1999-11-092005-01-25Amkor Technology, Inc.Semiconductor package with exposed die pad and body-locking leadframe
US6847099B1 (en)2003-02-052005-01-25Amkor Technology Inc.Offset etched corner leads for semiconductor package
US6853059B1 (en)1999-10-152005-02-08Amkor Technology, Inc.Semiconductor package having improved adhesiveness and ground bonding
US6858919B2 (en)2000-03-252005-02-22Amkor Technology, Inc.Semiconductor package
US6867071B1 (en)2002-07-122005-03-15Amkor Technology, Inc.Leadframe including corner leads and semiconductor package using same
US6885086B1 (en)2002-03-052005-04-26Amkor Technology, Inc.Reduced copper lead frame for saw-singulated chip package
US6927478B2 (en)2001-01-152005-08-09Amkor Technology, Inc.Reduced size semiconductor package with stacked dies
US7042068B2 (en)2000-04-272006-05-09Amkor Technology, Inc.Leadframe and semiconductor package made using the leadframe
US8154111B2 (en)1999-12-162012-04-10Amkor Technology, Inc.Near chip size semiconductor package
US9631481B1 (en)2011-01-272017-04-25Amkor Technology, Inc.Semiconductor device including leadframe with a combination of leads and lands and method
US9673122B2 (en)2014-05-022017-06-06Amkor Technology, Inc.Micro lead frame structure having reinforcing portions and method
US9691734B1 (en)2009-12-072017-06-27Amkor Technology, Inc.Method of forming a plurality of electronic component packages
US9871015B1 (en)2002-11-082018-01-16Amkor Technology, Inc.Wafer level package and fabrication method
US9947623B1 (en)2011-11-292018-04-17Amkor Technology, Inc.Semiconductor device comprising a conductive pad on a protruding-through electrode
US10014240B1 (en)2012-03-292018-07-03Amkor Technology, Inc.Embedded component package and fabrication method
US10090228B1 (en)2012-03-062018-10-02Amkor Technology, Inc.Semiconductor device with leadframe configured to facilitate reduced burr formation

Cited By (61)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US5455462A (en)*1992-01-171995-10-03Amkor Electronics, Inc.Plastic molded package with heat sink for integrated circuit devices
US5328870A (en)*1992-01-171994-07-12Amkor Electronics, Inc.Method for forming plastic molded package with heat sink for integrated circuit devices
US5604378A (en)*1993-04-071997-02-18Sumitomo Metal Mining Company, LimitedSemiconductor device, its lead frame, and heat spreader having through holes
US5701034A (en)*1994-05-031997-12-23Amkor Electronics, Inc.Packaged semiconductor die including heat sink with locking feature
US5722161A (en)*1994-05-031998-03-03Amkor Electronics, Inc.Method of making a packaged semiconductor die including heat sink with locking feature
US6630728B2 (en)1998-06-242003-10-07Amkor Technology, Inc.Plastic integrated circuit package and leadframe for making the package
US6143981A (en)*1998-06-242000-11-07Amkor Technology, Inc.Plastic integrated circuit package and method and leadframe for making the package
US6684496B2 (en)1998-06-242004-02-03Amkor Technology, Inc.Method of making an integrated circuit package
US6433277B1 (en)1998-06-242002-08-13Amkor Technology, Inc.Plastic integrated circuit package and method and leadframe for making the package
US6281568B1 (en)1998-10-212001-08-28Amkor Technology, Inc.Plastic integrated circuit device package and leadframe having partially undercut leads and die pad
US6521987B1 (en)1998-10-212003-02-18Amkor Technology, Inc.Plastic integrated circuit device package and method for making the package
US6448633B1 (en)1998-11-202002-09-10Amkor Technology, Inc.Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant
US6825062B2 (en)1998-11-202004-11-30Amkor Technology, Inc.Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant
US6469369B1 (en)1999-06-302002-10-22Amkor Technology, Inc.Leadframe having a mold inflow groove and method for making
US6501161B1 (en)1999-10-152002-12-31Amkor Technology, Inc.Semiconductor package having increased solder joint strength
US6555899B1 (en)1999-10-152003-04-29Amkor Technology, Inc.Semiconductor package leadframe assembly and method of manufacture
US6525406B1 (en)1999-10-152003-02-25Amkor Technology, Inc.Semiconductor device having increased moisture path and increased solder joint strength
US6853059B1 (en)1999-10-152005-02-08Amkor Technology, Inc.Semiconductor package having improved adhesiveness and ground bonding
US6616436B1 (en)1999-10-152003-09-09Amkor Technology, Inc.Apparatus for manufacturing semiconductor packages
US6627976B1 (en)1999-10-152003-09-30Amkor Technology, Inc.Leadframe for semiconductor package and mold for molding the same
US6696747B1 (en)1999-10-152004-02-24Amkor Technology, Inc.Semiconductor package having reduced thickness
US6475827B1 (en)1999-10-152002-11-05Amkor Technology, Inc.Method for making a semiconductor package having improved defect testing and increased production yield
US6646339B1 (en)1999-10-152003-11-11Amkor Technology, Inc.Thin and heat radiant semiconductor package and method for manufacturing
US6677662B1 (en)1999-10-152004-01-13Amkor Technology, Inc.Clamp and heat block assembly for wire bonding a semiconductor package assembly
US6833609B1 (en)1999-11-052004-12-21Amkor Technology, Inc.Integrated circuit device packages and substrates for making the packages
US6847103B1 (en)1999-11-092005-01-25Amkor Technology, Inc.Semiconductor package with exposed die pad and body-locking leadframe
US6476478B1 (en)1999-11-122002-11-05Amkor Technology, Inc.Cavity semiconductor package with exposed leads and die pad
US6605866B1 (en)1999-12-162003-08-12Amkor Technology, Inc.Stackable semiconductor package and method for manufacturing same
US6753597B1 (en)1999-12-162004-06-22Amkor Technology, Inc.Encapsulated semiconductor package including chip paddle and leads
US8154111B2 (en)1999-12-162012-04-10Amkor Technology, Inc.Near chip size semiconductor package
US6730544B1 (en)1999-12-202004-05-04Amkor Technology, Inc.Stackable semiconductor package and method for manufacturing same
US6677663B1 (en)1999-12-302004-01-13Amkor Technology, Inc.End grid array semiconductor package
US6858919B2 (en)2000-03-252005-02-22Amkor Technology, Inc.Semiconductor package
US7042068B2 (en)2000-04-272006-05-09Amkor Technology, Inc.Leadframe and semiconductor package made using the leadframe
US6723582B2 (en)2000-12-072004-04-20Amkor Technology, Inc.Method of making a semiconductor package having exposed metal strap
US6566164B1 (en)2000-12-072003-05-20Amkor Technology, Inc.Exposed copper strap in a semiconductor package
US6927478B2 (en)2001-01-152005-08-09Amkor Technology, Inc.Reduced size semiconductor package with stacked dies
US6605865B2 (en)2001-03-192003-08-12Amkor Technology, Inc.Semiconductor package with optimized leadframe bonding strength
US6700187B2 (en)2001-03-272004-03-02Amkor Technology, Inc.Semiconductor package and method for manufacturing the same
US6713322B2 (en)2001-03-272004-03-30Amkor Technology, Inc.Lead frame for semiconductor package
US6756658B1 (en)2001-04-062004-06-29Amkor Technology, Inc.Making two lead surface mounting high power microleadframe semiconductor packages
US6611047B2 (en)2001-10-122003-08-26Amkor Technology, Inc.Semiconductor package with singulation crease
US6798046B1 (en)2002-01-222004-09-28Amkor Technology, Inc.Semiconductor package including ring structure connected to leads with vertically downset inner ends
US6885086B1 (en)2002-03-052005-04-26Amkor Technology, Inc.Reduced copper lead frame for saw-singulated chip package
US6608366B1 (en)2002-04-152003-08-19Harry J. FogelsonLead frame with plated end leads
US6627977B1 (en)2002-05-092003-09-30Amkor Technology, Inc.Semiconductor package including isolated ring structure
US6841414B1 (en)2002-06-192005-01-11Amkor Technology, Inc.Saw and etch singulation method for a chip package
US6867071B1 (en)2002-07-122005-03-15Amkor Technology, Inc.Leadframe including corner leads and semiconductor package using same
US10665567B1 (en)2002-11-082020-05-26Amkor Technology, Inc.Wafer level package and fabrication method
US9871015B1 (en)2002-11-082018-01-16Amkor Technology, Inc.Wafer level package and fabrication method
US6847099B1 (en)2003-02-052005-01-25Amkor Technology Inc.Offset etched corner leads for semiconductor package
US10546833B2 (en)2009-12-072020-01-28Amkor Technology, Inc.Method of forming a plurality of electronic component packages
US9691734B1 (en)2009-12-072017-06-27Amkor Technology, Inc.Method of forming a plurality of electronic component packages
US9631481B1 (en)2011-01-272017-04-25Amkor Technology, Inc.Semiconductor device including leadframe with a combination of leads and lands and method
US9978695B1 (en)2011-01-272018-05-22Amkor Technology, Inc.Semiconductor device including leadframe with a combination of leads and lands and method
US10410967B1 (en)2011-11-292019-09-10Amkor Technology, Inc.Electronic device comprising a conductive pad on a protruding-through electrode
US9947623B1 (en)2011-11-292018-04-17Amkor Technology, Inc.Semiconductor device comprising a conductive pad on a protruding-through electrode
US11043458B2 (en)2011-11-292021-06-22Amkor Technology Singapore Holding Pte. Ltd.Method of manufacturing an electronic device comprising a conductive pad on a protruding-through electrode
US10090228B1 (en)2012-03-062018-10-02Amkor Technology, Inc.Semiconductor device with leadframe configured to facilitate reduced burr formation
US10014240B1 (en)2012-03-292018-07-03Amkor Technology, Inc.Embedded component package and fabrication method
US9673122B2 (en)2014-05-022017-06-06Amkor Technology, Inc.Micro lead frame structure having reinforcing portions and method

Similar Documents

PublicationPublication DateTitle
JPS5745959A (en)Resin-sealed semiconductor device
JPS5315763A (en)Resin sealed type semiconductor device
JPS6457738A (en)Package for semiconductor device
JPS6484651A (en)Semiconductor device
KR890013753A (en) Semiconductor device
JPS57112055A (en)Integrated circuit package
JPS5345978A (en)Insulated-gate-protective semiconductor device
JPS5732658A (en)Resin sealing type semiconductor device with radiator plate
JPS56146263A (en)Manufacture of semiconductor device
JPS5662346A (en)Lead frame and semicondcutor device having thereof
JPS5745960A (en)Resin-sealed semiconductor device
JPS57210646A (en)Resin-sealed semiconductor device
JPS54111768A (en)Semiconductor device of resin sealing type
JPS5745961A (en)Resin-sealed semiconductor device
JPS5636145A (en)Thin semiconductor integrated circuit device and its manufacture
JPS5629352A (en)Resin-sealed semiconductor device
JPS53135579A (en)Liquid sealing semiconductor device
GB1240417A (en)Semiconductor device
JPS52156561A (en)Resin molded semiconductor device and its production
JPS5348471A (en)Production of resin seal type semiconductor device
JPS5291647A (en)Production of semiconductor device
JPS56147453A (en)Semiconductor device
JPS54577A (en)Resin seal semiconductor device
JPS57121261A (en)Mounting structure for semiconductor device
JPS53120373A (en)Molded type element
[8]ページ先頭
©2009-2025 Movatter.jp