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JPS5720458A - Cooling system for package of electronic circuit - Google Patents

Cooling system for package of electronic circuit

Info

Publication number
JPS5720458A
JPS5720458AJP9435380AJP9435380AJPS5720458AJP S5720458 AJPS5720458 AJP S5720458AJP 9435380 AJP9435380 AJP 9435380AJP 9435380 AJP9435380 AJP 9435380AJP S5720458 AJPS5720458 AJP S5720458A
Authority
JP
Japan
Prior art keywords
package
fan
electronic circuit
cooling system
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9435380A
Other languages
Japanese (ja)
Inventor
Toyoshi Watanabe
Takeo Nagasaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co LtdfiledCriticalNEC Corp
Priority to JP9435380ApriorityCriticalpatent/JPS5720458A/en
Publication of JPS5720458ApublicationCriticalpatent/JPS5720458A/en
Pendinglegal-statusCriticalCurrent

Links

Classifications

Landscapes

Abstract

PURPOSE:To simplify the maintenance of a cooling fan by a method wherein a fan package which can be mounted or dismounted to or from a shelf in accordance with the same specification as th package of the electronic circuit is prepared, and the electronic circuit is cooled. CONSTITUTION:The fan package 62 consists of a motor 52, the fan 51 and a rectifying cover 71, sucks F a cooling air by means of the fan 51, sends an air to a circuit element mounted to the package 22, which generates a large amount of heat, and cools the element, and discharges G a hot air. The circuit package, which generates a small amount of heat, is cooled at low cost through a natural convection H. According to this constitution, a forced cooling system can be introduced at low cost to places where heat generation is often dispersed while maintenance is also easy.
JP9435380A1980-07-101980-07-10Cooling system for package of electronic circuitPendingJPS5720458A (en)

Priority Applications (1)

Application NumberPriority DateFiling DateTitle
JP9435380AJPS5720458A (en)1980-07-101980-07-10Cooling system for package of electronic circuit

Applications Claiming Priority (1)

Application NumberPriority DateFiling DateTitle
JP9435380AJPS5720458A (en)1980-07-101980-07-10Cooling system for package of electronic circuit

Publications (1)

Publication NumberPublication Date
JPS5720458Atrue JPS5720458A (en)1982-02-02

Family

ID=14107913

Family Applications (1)

Application NumberTitlePriority DateFiling Date
JP9435380APendingJPS5720458A (en)1980-07-101980-07-10Cooling system for package of electronic circuit

Country Status (1)

CountryLink
JP (1)JPS5720458A (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
JPS58148988U (en)*1982-03-311983-10-06三洋電機株式会社 circuit board cooling device
JPS61203784U (en)*1985-06-101986-12-22
US4899254A (en)*1987-07-221990-02-06Tandem Computers IncorporatedElectronic module interconnection system
US4901200A (en)*1987-10-141990-02-13Schroff GmbhInsertable housing
US4931904A (en)*1989-05-301990-06-05Motorola, Inc.Localized circuit card cooling device
US4967311A (en)*1987-07-221990-10-30Tandem Computers IncorporatedElectronic module interconnection system
US5208730A (en)*1991-06-271993-05-04Compaq Computer CorporationComputer cooling fan vibration isolation apparatus
US5237484A (en)*1991-07-081993-08-17Tandem Computers IncorporatedApparatus for cooling a plurality of electronic modules
US5289363A (en)*1991-07-081994-02-22Tandem Computers, Inc.Modular power supply arrangement with cooling
JP2020126923A (en)*2019-02-042020-08-20富士ゼロックス株式会社Air blowing control device and air blowing control program

Cited By (10)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
JPS58148988U (en)*1982-03-311983-10-06三洋電機株式会社 circuit board cooling device
JPS61203784U (en)*1985-06-101986-12-22
US4899254A (en)*1987-07-221990-02-06Tandem Computers IncorporatedElectronic module interconnection system
US4967311A (en)*1987-07-221990-10-30Tandem Computers IncorporatedElectronic module interconnection system
US4901200A (en)*1987-10-141990-02-13Schroff GmbhInsertable housing
US4931904A (en)*1989-05-301990-06-05Motorola, Inc.Localized circuit card cooling device
US5208730A (en)*1991-06-271993-05-04Compaq Computer CorporationComputer cooling fan vibration isolation apparatus
US5237484A (en)*1991-07-081993-08-17Tandem Computers IncorporatedApparatus for cooling a plurality of electronic modules
US5289363A (en)*1991-07-081994-02-22Tandem Computers, Inc.Modular power supply arrangement with cooling
JP2020126923A (en)*2019-02-042020-08-20富士ゼロックス株式会社Air blowing control device and air blowing control program

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