JPS57103336A - Semiconductor device - Google Patents

Abstract

PURPOSE:To obtain a resin molded semiconductor device having small temperature drift by absorbing the resin stress change to a chip coating material by covering a mounted pellet with the chip coating material when the pellet is mounted at the pellet mounting unit of a lead frame with silver paste. CONSTITUTION:A paste 16 of semiconductor chip is mounted via silver paste on a tab 12 of the pellet mounting unit of a lead frame 10, and the electrode of the pellet 16 is electrically connected to the inner lead of the frame 10 via a wire 18. Thereafter, they are molded with molding resin 22, and a dome-shaped chip coating material 20 is covered on the periphery of the pellet 16 at this time. Thus, the stress from the resin 22 can be absorbed by the coating material 20, the stress is not applied directly to the pellet 16, and the temperature hysteresis phenomenon such as offset voltage can be remarkably reduced.