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JPS5679472A - Preparing method of mos-type semiconductor device - Google Patents

Preparing method of mos-type semiconductor device

Info

Publication number
JPS5679472A
JPS5679472AJP15637979AJP15637979AJPS5679472AJP S5679472 AJPS5679472 AJP S5679472AJP 15637979 AJP15637979 AJP 15637979AJP 15637979 AJP15637979 AJP 15637979AJP S5679472 AJPS5679472 AJP S5679472A
Authority
JP
Japan
Prior art keywords
silicon
poly
sio2
mask
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15637979A
Other languages
Japanese (ja)
Inventor
Yoshihisa Mizutani
Susumu Kayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co LtdfiledCriticalToshiba Corp
Priority to JP15637979ApriorityCriticalpatent/JPS5679472A/en
Publication of JPS5679472ApublicationCriticalpatent/JPS5679472A/en
Pendinglegal-statusCriticalCurrent

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Abstract

PURPOSE:To obtain an FET having a high integrated degree by embeding a gate electrode into an insulating layer and setting a poly-silicon or amorphous silicon channel thereon and a source drain at both sides thereof. CONSTITUTION:A poly-silicon 3 is laid on a SiO2 2 on a Si substrate 1. It is oxidized to change to SiO2 32 performing a mask 4. After demasking, it is covered with an oxide film 5 and a N<+> layer 5 is prepared injecting P-ion. Then, the poly- silicon 6 is selectively formed and the P-ion is injected to set the N<+> layer 8, 9 performing a resist mask 7. After removing the mask 7, the LASER is irradiated to activate it. Then, it is covered with SiO2 10 and Al electrodes 111, 112 are made by opening selectively. By this constitution, a smooth construction can be realized with poly-silicon film, thereby being capable of miniaturization and high integration of element without decreasing the reliability. Further, the combination with the conventional construction makes possible to obtain various kinds of devices.
JP15637979A1979-12-041979-12-04Preparing method of mos-type semiconductor devicePendingJPS5679472A (en)

Priority Applications (1)

Application NumberPriority DateFiling DateTitle
JP15637979AJPS5679472A (en)1979-12-041979-12-04Preparing method of mos-type semiconductor device

Applications Claiming Priority (1)

Application NumberPriority DateFiling DateTitle
JP15637979AJPS5679472A (en)1979-12-041979-12-04Preparing method of mos-type semiconductor device

Publications (1)

Publication NumberPublication Date
JPS5679472Atrue JPS5679472A (en)1981-06-30

Family

ID=15626457

Family Applications (1)

Application NumberTitlePriority DateFiling Date
JP15637979APendingJPS5679472A (en)1979-12-041979-12-04Preparing method of mos-type semiconductor device

Country Status (1)

CountryLink
JP (1)JPS5679472A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
JPS56140662A (en)*1980-04-021981-11-04Mitsubishi Electric CorpManufacture of field effect semiconductor of insulation gate complementary type
JPS60160173A (en)*1984-01-301985-08-21Sharp Corp thin film transistor
JPH03265143A (en)*1990-03-151991-11-26Matsushita Electron CorpManufacture of thin film transistor
JPH0555254A (en)*1991-08-271993-03-05Sharp Corp Thin film transistor and manufacturing method thereof
JPH05136169A (en)*1992-01-271993-06-01Seiko Epson CorpManufacture of thin-film transistor

Cited By (5)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
JPS56140662A (en)*1980-04-021981-11-04Mitsubishi Electric CorpManufacture of field effect semiconductor of insulation gate complementary type
JPS60160173A (en)*1984-01-301985-08-21Sharp Corp thin film transistor
JPH03265143A (en)*1990-03-151991-11-26Matsushita Electron CorpManufacture of thin film transistor
JPH0555254A (en)*1991-08-271993-03-05Sharp Corp Thin film transistor and manufacturing method thereof
JPH05136169A (en)*1992-01-271993-06-01Seiko Epson CorpManufacture of thin-film transistor

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