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JPS5655474A - Radiofrequency heating curable adhesive - Google Patents

Radiofrequency heating curable adhesive

Info

Publication number
JPS5655474A
JPS5655474AJP13220479AJP13220479AJPS5655474AJP S5655474 AJPS5655474 AJP S5655474AJP 13220479 AJP13220479 AJP 13220479AJP 13220479 AJP13220479 AJP 13220479AJP S5655474 AJPS5655474 AJP S5655474A
Authority
JP
Japan
Prior art keywords
dielectric
adhesive
thermosetting resin
electromagnetic field
hysteresis loss
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13220479A
Other languages
Japanese (ja)
Inventor
Hiroshi Ogawara
Masahiro Hotta
Kazuo Maejima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co LtdfiledCriticalSekisui Chemical Co Ltd
Priority to JP13220479ApriorityCriticalpatent/JPS5655474A/en
Publication of JPS5655474ApublicationCriticalpatent/JPS5655474A/en
Pendinglegal-statusCriticalCurrent

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Abstract

PURPOSE: To provide an adhesive which exhibits strong adhesive power and by which bonding operation can be carried out efficiently, and to enable the adhesive to be applied to a wide range of adherends, by a method wherein a strong dielectric having dielectric hysteresis loss in radiofrequency electromagnetic field, or a hydrated aluminosilicate is added to a thermosetting resin.
CONSTITUTION: A strong dielectric having dielectric hysteresis loss in radiofrequency electromagnetic field and/or a hydrated aluminosilicate are/is added to a thermosetting resin. Pref. barium titanate is used as the dielectric. It is preferred to add further a ferromagnetic substance having magnetic hysteresis loss in radiofrequency electromagnetic field to the radiofrequency heating curable adhesive obtd. by adding either or both of the strong dielectric and the hydrated aluminosilicate to the thermosetting resin, because exotherm efficiency is synergistically improved and bond strength becomes higher. Preferred examples of said dielectric are barium titanate and γ-iron oxide.
COPYRIGHT: (C)1981,JPO&Japio
JP13220479A1979-10-121979-10-12Radiofrequency heating curable adhesivePendingJPS5655474A (en)

Priority Applications (1)

Application NumberPriority DateFiling DateTitle
JP13220479AJPS5655474A (en)1979-10-121979-10-12Radiofrequency heating curable adhesive

Applications Claiming Priority (1)

Application NumberPriority DateFiling DateTitle
JP13220479AJPS5655474A (en)1979-10-121979-10-12Radiofrequency heating curable adhesive

Publications (1)

Publication NumberPublication Date
JPS5655474Atrue JPS5655474A (en)1981-05-16

Family

ID=15075819

Family Applications (1)

Application NumberTitlePriority DateFiling Date
JP13220479APendingJPS5655474A (en)1979-10-121979-10-12Radiofrequency heating curable adhesive

Country Status (1)

CountryLink
JP (1)JPS5655474A (en)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
JPS58174474A (en)*1982-04-071983-10-13Mitsui Toatsu Chem Inc thermal adhesive
JPS62205151A (en)*1986-03-041987-09-09Toagosei Chem Ind Co LtdComposition curable by high-frequency induction heating
JPS6310683A (en)*1986-06-191988-01-18アツシユランド・オイル・インコ−ポレ−テツドAdhesive composition
JPH01245059A (en)*1988-03-271989-09-29Matsushita Electric Works LtdShapeable highly dielectric thermosetting composition
EP0355423A3 (en)*1988-07-221992-06-17Heller, William C., Jr.Integrated multiple particle agent for inductive heating and method of inductive heating therewith
WO1994004623A1 (en)*1992-08-241994-03-03Battelle Memorial InstituteProcess for glueing two non-metallic substrates by means of an adhesive
US5378879A (en)*1993-04-201995-01-03Raychem CorporationInduction heating of loaded materials
WO1998012040A1 (en)*1996-09-191998-03-26Mcdonnell Douglas CorporationMagnetic particle integrated adhesive and method of repairing a composite material
WO1999047621A1 (en)*1998-03-171999-09-23Ameritherm, Inc.Rf active compositions for use in adhesion, bonding and coating
WO2000015007A1 (en)*1998-09-092000-03-16Allan Ernest ChurchmanA plastics material in combination with a paramagnetic silicate
JP2004506065A (en)*2000-08-032004-02-26ヘンケル・コマンディットゲゼルシャフト・アウフ・アクチエン Method of accelerating curing of adhesive
WO2003063548A3 (en)*2001-07-032004-02-26Tribond IncInduction heating using dual susceptors
WO2018079355A1 (en)*2016-10-272018-05-03リンテック株式会社Dielectric-heating bonding film and bonding method using dielectric-heating bonding film

Cited By (15)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
JPS58174474A (en)*1982-04-071983-10-13Mitsui Toatsu Chem Inc thermal adhesive
JPS62205151A (en)*1986-03-041987-09-09Toagosei Chem Ind Co LtdComposition curable by high-frequency induction heating
JPS6310683A (en)*1986-06-191988-01-18アツシユランド・オイル・インコ−ポレ−テツドAdhesive composition
JPH01245059A (en)*1988-03-271989-09-29Matsushita Electric Works LtdShapeable highly dielectric thermosetting composition
EP0355423A3 (en)*1988-07-221992-06-17Heller, William C., Jr.Integrated multiple particle agent for inductive heating and method of inductive heating therewith
WO1994004623A1 (en)*1992-08-241994-03-03Battelle Memorial InstituteProcess for glueing two non-metallic substrates by means of an adhesive
US5378879A (en)*1993-04-201995-01-03Raychem CorporationInduction heating of loaded materials
WO1998012040A1 (en)*1996-09-191998-03-26Mcdonnell Douglas CorporationMagnetic particle integrated adhesive and method of repairing a composite material
WO1999047621A1 (en)*1998-03-171999-09-23Ameritherm, Inc.Rf active compositions for use in adhesion, bonding and coating
WO2000015007A1 (en)*1998-09-092000-03-16Allan Ernest ChurchmanA plastics material in combination with a paramagnetic silicate
JP2004506065A (en)*2000-08-032004-02-26ヘンケル・コマンディットゲゼルシャフト・アウフ・アクチエン Method of accelerating curing of adhesive
WO2003063548A3 (en)*2001-07-032004-02-26Tribond IncInduction heating using dual susceptors
WO2018079355A1 (en)*2016-10-272018-05-03リンテック株式会社Dielectric-heating bonding film and bonding method using dielectric-heating bonding film
JPWO2018079355A1 (en)*2016-10-272019-09-12リンテック株式会社 Dielectric heating adhesive film and bonding method using dielectric heating adhesive film
US11673340B2 (en)2016-10-272023-06-13Lintec CorporationDielectric-heating bonding film and bonding method using dielectric-heating bonding film

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