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JPS56162841A - Forming method for insulating film of compound semiconductor - Google Patents

Forming method for insulating film of compound semiconductor

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Publication number
JPS56162841A
JPS56162841AJP6597180AJP6597180AJPS56162841AJP S56162841 AJPS56162841 AJP S56162841AJP 6597180 AJP6597180 AJP 6597180AJP 6597180 AJP6597180 AJP 6597180AJP S56162841 AJPS56162841 AJP S56162841A
Authority
JP
Japan
Prior art keywords
insulating film
tube
compound semiconductor
approx
forming method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6597180A
Other languages
Japanese (ja)
Inventor
Masashi Yamaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Telegraph and Telephone Corp
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone CorpfiledCriticalNippon Telegraph and Telephone Corp
Priority to JP6597180ApriorityCriticalpatent/JPS56162841A/en
Publication of JPS56162841ApublicationCriticalpatent/JPS56162841A/en
Pendinglegal-statusCriticalCurrent

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Abstract

PURPOSE:To obtain an insulating film which has uniform and excellent insulating characteristic and thermal stability by heat treating the III-V group compound semiconductors at the predetermined temperature range in an ammonia gas atmosphere and forming the insulating film made of nitride of ingredient element on the surface of the semiconductor. CONSTITUTION:InP single crystal 5 of compound semiconductor is placed in a reaction tube 6 which is evacuated in vacuum to approx. 10<-5>Torr, and highly pure ammonia gas 4 is filled in the tube to maintain the tube at 1 atm. The tube is inserted into an electric furnace 8, is heat treated at approx. 400-650 deg.C for 1- 64hr, and an insulating film 9 of nitride made of InN, PN having a thickness of 100-1000Angstrom is formed on the surface of the single crystal. Thus, the insulating film of the compound semiconductor having uniform and excellent insulating characteristics and thermal stability can be formed.
JP6597180A1980-05-201980-05-20Forming method for insulating film of compound semiconductorPendingJPS56162841A (en)

Priority Applications (1)

Application NumberPriority DateFiling DateTitle
JP6597180AJPS56162841A (en)1980-05-201980-05-20Forming method for insulating film of compound semiconductor

Applications Claiming Priority (1)

Application NumberPriority DateFiling DateTitle
JP6597180AJPS56162841A (en)1980-05-201980-05-20Forming method for insulating film of compound semiconductor

Publications (1)

Publication NumberPublication Date
JPS56162841Atrue JPS56162841A (en)1981-12-15

Family

ID=13302387

Family Applications (1)

Application NumberTitlePriority DateFiling Date
JP6597180APendingJPS56162841A (en)1980-05-201980-05-20Forming method for insulating film of compound semiconductor

Country Status (1)

CountryLink
JP (1)JPS56162841A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
WO2002017450A1 (en)*2000-08-222002-02-28Mitsui Chemicals Inc.Method for manufacturing semiconductor laser device
EP1120821A3 (en)*2000-01-272004-07-28RikenProcess for formation of cap layer for semiconductor
JP2007152020A (en)*2005-12-082007-06-21Olympus CorpEndoscope apparatus
US8279273B2 (en)2006-01-272012-10-02Olympus CorporationEndoscope apparatus

Citations (1)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
JPS4931270A (en)*1972-07-201974-03-20

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
JPS4931270A (en)*1972-07-201974-03-20

Cited By (6)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
EP1120821A3 (en)*2000-01-272004-07-28RikenProcess for formation of cap layer for semiconductor
WO2002017450A1 (en)*2000-08-222002-02-28Mitsui Chemicals Inc.Method for manufacturing semiconductor laser device
US6703254B2 (en)2000-08-222004-03-09Mitsui Chemicals, Inc.Method for manufacturing semiconductor laser device
JP2007152020A (en)*2005-12-082007-06-21Olympus CorpEndoscope apparatus
US8194380B2 (en)2005-12-082012-06-05Olympus CorporationEndoscope apparatus
US8279273B2 (en)2006-01-272012-10-02Olympus CorporationEndoscope apparatus

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