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JPS56103487A - Manufacture of gunn diode - Google Patents

Manufacture of gunn diode

Info

Publication number
JPS56103487A
JPS56103487AJP593780AJP593780AJPS56103487AJP S56103487 AJPS56103487 AJP S56103487AJP 593780 AJP593780 AJP 593780AJP 593780 AJP593780 AJP 593780AJP S56103487 AJPS56103487 AJP S56103487A
Authority
JP
Japan
Prior art keywords
gaas
layer
gaas layer
transition region
sulphur
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP593780A
Other languages
Japanese (ja)
Other versions
JPS6250996B2 (en
Inventor
Tsutomu Tsuji
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co LtdfiledCriticalNEC Corp
Priority to JP593780ApriorityCriticalpatent/JPS56103487A/en
Publication of JPS56103487ApublicationCriticalpatent/JPS56103487A/en
Publication of JPS6250996B2publicationCriticalpatent/JPS6250996B2/ja
Grantedlegal-statusCriticalCurrent

Links

Classifications

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Abstract

PURPOSE:To enable to always constantly control the depth of an N-GaAs layer converted into a transition region by a method wherein an N<+>-GaAs layer is formed on the surface of the N-GaAs active layer and ions are injected. CONSTITUTION:An N<++> type buffer GaAs layer, the N-GaAs active layer 23 and the N<+>-GaAs layer 24 of sulphur or selenium doped are formed in sequence on the N<++>-GaAs substrate 21 by an epitaxial growth method. Thereafter, an impurity causing the sulphur or selenium which is kept doped in the N<+>-GaAs layer to be speed-up diffused is injected by the ion-injecting method and heat-treated, thereby enabling the N<++> type primary layer 26 and the constant thickness transition region to simultaneously be formed on the N-GaAs layer 23. Thus, the depth of the N-GaAs layer 23 converted to the transition region can always constantly be controlled. As a result, the Gunn diode less in fluctuation of the frequency is obtained.
JP593780A1980-01-221980-01-22Manufacture of gunn diodeGrantedJPS56103487A (en)

Priority Applications (1)

Application NumberPriority DateFiling DateTitle
JP593780AJPS56103487A (en)1980-01-221980-01-22Manufacture of gunn diode

Applications Claiming Priority (1)

Application NumberPriority DateFiling DateTitle
JP593780AJPS56103487A (en)1980-01-221980-01-22Manufacture of gunn diode

Publications (2)

Publication NumberPublication Date
JPS56103487Atrue JPS56103487A (en)1981-08-18
JPS6250996B2 JPS6250996B2 (en)1987-10-28

Family

ID=11624805

Family Applications (1)

Application NumberTitlePriority DateFiling Date
JP593780AGrantedJPS56103487A (en)1980-01-221980-01-22Manufacture of gunn diode

Country Status (1)

CountryLink
JP (1)JPS56103487A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
EP1267417A3 (en)*2001-06-142005-01-12Ixys CorporationSemiconductor devices having group III-V compound layers
JP2009214944A (en)*2004-02-172009-09-24Menicon Singapore Pte LtdPackage
US10865028B2 (en)2005-02-142020-12-15Mentcon Singapore Pte Ltd.Heat sealable, retortable laminated foil

Cited By (5)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
EP1267417A3 (en)*2001-06-142005-01-12Ixys CorporationSemiconductor devices having group III-V compound layers
KR100768803B1 (en)*2001-06-142007-10-19익시스 코포레이션Semiconductor devices having group ?-? compound layers
US10786057B2 (en)2002-08-172020-09-29Menicon Singapore Pte Ltd.Packaging for disposable soft contact lenses
JP2009214944A (en)*2004-02-172009-09-24Menicon Singapore Pte LtdPackage
US10865028B2 (en)2005-02-142020-12-15Mentcon Singapore Pte Ltd.Heat sealable, retortable laminated foil

Also Published As

Publication numberPublication date
JPS6250996B2 (en)1987-10-28

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