JPS55124251A - Method of fabricating package - Google Patents

Abstract

PURPOSE:To reduce the thickness, size and weight of a package by securing a circuit element such as IC or the like into a hole of a light metal substrate insulated on the surface, forming a wiring pattern with photosensitive resin and metal layer and forming a number of wires in high density. CONSTITUTION:An opening 12 is perforated at a metal plate 14 such as aluminum, an insulating film 13 such as Al2O3 or the like if formed on the exposed surface thereof, and active and passive circuit elements 16 such as IC, LSI, resistors, capacitors and the like are secured onto a plate 17 such as aluminum or the like and inserted into the opening 12, and fixed thereto with adhesive resin 18 or the like. Then, photosensitive resin 19 is coated on the entire surface of the plate, electrode portions are perforated, resin except the elements is removed, a metal film 22 is coated then on the entire surface, a photosensitive resin mask 23 is patterned, and necessary wires 24 are formed thereon. Passive elements 15 such as capacitors may be formed on the insulating film. Thus, since the substrate is metal, it can entirely reduce the thickness, size and weight of a package and improve the mechanical strength thereof.