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JPS54162465A - Chip replacing method - Google Patents

Chip replacing method

Info

Publication number
JPS54162465A
JPS54162465AJP7083178AJP7083178AJPS54162465AJP S54162465 AJPS54162465 AJP S54162465AJP 7083178 AJP7083178 AJP 7083178AJP 7083178 AJP7083178 AJP 7083178AJP S54162465 AJPS54162465 AJP S54162465A
Authority
JP
Japan
Prior art keywords
chip
solder
infrared rays
fixed
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7083178A
Other languages
Japanese (ja)
Inventor
Katsuhiko Shioda
Tomiro Yasuda
Koichi Inoue
Akihiro Kenmochi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi LtdfiledCriticalHitachi Ltd
Priority to JP7083178ApriorityCriticalpatent/JPS54162465A/en
Publication of JPS54162465ApublicationCriticalpatent/JPS54162465A/en
Pendinglegal-statusCriticalCurrent

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Abstract

PURPOSE: To avoid the adverse effect to the adjacent chips, by covering the adjacent chips with the metal plate interrupting infrared rays and performing chip replacement through molten solder by means of infrared ray heating, in replacing one of a plurality of semiconductor chips fixed on the substrate.
CONSTITUTION: When the chip 1 is removed, fixed on the substrate 4, first the adjacent chips 2 are covered with the Al plate 5 in Au plating having the ability of reflection with interrupting infrared rays. Next, infrared rays are emitted on the chip 1, the solder 3 fixed on the chip 1 is molten with heating up to a maximum of 400°C, and the chip 1 is absorbed up with the vacuum chuck lifted down. After that, the emission of infrared rays is stopped, the steel piece 8 is placed on the solder 7 remained in less amount, and the solder 7 is attached to the steel piece 8 with infrared rays again emitted. Further, the steel piece 8 is lifted up with the chuck 6, the solder 10 in suitable amount is remained on the substrate 4, the solder 3 is added and new chip 11 is inserted on it and fixed with infrared rays.
COPYRIGHT: (C)1979,JPO&Japio
JP7083178A1978-06-141978-06-14Chip replacing methodPendingJPS54162465A (en)

Priority Applications (1)

Application NumberPriority DateFiling DateTitle
JP7083178AJPS54162465A (en)1978-06-141978-06-14Chip replacing method

Applications Claiming Priority (1)

Application NumberPriority DateFiling DateTitle
JP7083178AJPS54162465A (en)1978-06-141978-06-14Chip replacing method

Publications (1)

Publication NumberPublication Date
JPS54162465Atrue JPS54162465A (en)1979-12-24

Family

ID=13442907

Family Applications (1)

Application NumberTitlePriority DateFiling Date
JP7083178APendingJPS54162465A (en)1978-06-141978-06-14Chip replacing method

Country Status (1)

CountryLink
JP (1)JPS54162465A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US4923521A (en)*1988-10-111990-05-08American Telephone And Telegraph CompanyMethod and apparatus for removing solder
US5542601A (en)*1995-02-241996-08-06International Business Machines CorporationRework process for semiconductor chips mounted in a flip chip configuration on an organic substrate
US5560841A (en)*1994-10-111996-10-01United Technologies CorporationStator vane extraction
US5984165A (en)*1996-11-291999-11-16Fujitsu LimitedMethod of bonding a chip part to a substrate using solder bumps
JP2007096088A (en)*2005-09-292007-04-12Nec Electronics CorpDevice and method for replacing electronic component

Cited By (5)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US4923521A (en)*1988-10-111990-05-08American Telephone And Telegraph CompanyMethod and apparatus for removing solder
US5560841A (en)*1994-10-111996-10-01United Technologies CorporationStator vane extraction
US5542601A (en)*1995-02-241996-08-06International Business Machines CorporationRework process for semiconductor chips mounted in a flip chip configuration on an organic substrate
US5984165A (en)*1996-11-291999-11-16Fujitsu LimitedMethod of bonding a chip part to a substrate using solder bumps
JP2007096088A (en)*2005-09-292007-04-12Nec Electronics CorpDevice and method for replacing electronic component

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