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JPS53141573A - Pellet dividing method of semiconductor wafer - Google Patents

Pellet dividing method of semiconductor wafer

Info

Publication number
JPS53141573A
JPS53141573AJP5622577AJP5622577AJPS53141573AJP S53141573 AJPS53141573 AJP S53141573AJP 5622577 AJP5622577 AJP 5622577AJP 5622577 AJP5622577 AJP 5622577AJP S53141573 AJPS53141573 AJP S53141573A
Authority
JP
Japan
Prior art keywords
semiconductor wafer
dividing method
substrate
pellet
pellet dividing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5622577A
Other languages
English (en)
Inventor
Shigeru Ozawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co LtdfiledCriticalToshiba Corp
Priority to JP5622577ApriorityCriticalpatent/JPS53141573A/ja
Publication of JPS53141573ApublicationCriticalpatent/JPS53141573A/ja
Pendinglegal-statusCriticalCurrent

Links

Landscapes

JP5622577A1977-05-161977-05-16Pellet dividing method of semiconductor waferPendingJPS53141573A (en)

Priority Applications (1)

Application NumberPriority DateFiling DateTitle
JP5622577AJPS53141573A (en)1977-05-161977-05-16Pellet dividing method of semiconductor wafer

Applications Claiming Priority (1)

Application NumberPriority DateFiling DateTitle
JP5622577AJPS53141573A (en)1977-05-161977-05-16Pellet dividing method of semiconductor wafer

Publications (1)

Publication NumberPublication Date
JPS53141573Atrue JPS53141573A (en)1978-12-09

Family

ID=13021152

Family Applications (1)

Application NumberTitlePriority DateFiling Date
JP5622577APendingJPS53141573A (en)1977-05-161977-05-16Pellet dividing method of semiconductor wafer

Country Status (1)

CountryLink
JP (1)JPS53141573A (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
JPS60164385A (ja)*1984-02-061985-08-27Rohm Co Ltd半導体レ−ザのチツプ製造方法
JP2009054624A (ja)*2007-08-232009-03-12Nec Electronics Corpウェーハ補助シート、半導体ウェーハのブレーキング装置及びブレーキング方法
US8865566B2 (en)2002-12-032014-10-21Hamamatsu Photonics K.K.Method of cutting semiconductor substrate
US8889525B2 (en)2002-03-122014-11-18Hamamatsu Photonics K.K.Substrate dividing method
US8937264B2 (en)2000-09-132015-01-20Hamamatsu Photonics K.K.Laser processing method and laser processing apparatus

Cited By (18)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
JPS60164385A (ja)*1984-02-061985-08-27Rohm Co Ltd半導体レ−ザのチツプ製造方法
US8946591B2 (en)2000-09-132015-02-03Hamamatsu Photonics K.K.Method of manufacturing a semiconductor device formed using a substrate cutting method
US10796959B2 (en)2000-09-132020-10-06Hamamatsu Photonics K.K.Laser processing method and laser processing apparatus
US9837315B2 (en)2000-09-132017-12-05Hamamatsu Photonics K.K.Laser processing method and laser processing apparatus
US8937264B2 (en)2000-09-132015-01-20Hamamatsu Photonics K.K.Laser processing method and laser processing apparatus
US8946592B2 (en)2000-09-132015-02-03Hamamatsu Photonics K.K.Laser processing method and laser processing apparatus
US9287177B2 (en)2002-03-122016-03-15Hamamatsu Photonics K.K.Substrate dividing method
US9142458B2 (en)2002-03-122015-09-22Hamamatsu Photonics K.K.Substrate dividing method
US8889525B2 (en)2002-03-122014-11-18Hamamatsu Photonics K.K.Substrate dividing method
US9543207B2 (en)2002-03-122017-01-10Hamamatsu Photonics K.K.Substrate dividing method
US9543256B2 (en)2002-03-122017-01-10Hamamatsu Photonics K.K.Substrate dividing method
US9548246B2 (en)2002-03-122017-01-17Hamamatsu Photonics K.K.Substrate dividing method
US9553023B2 (en)2002-03-122017-01-24Hamamatsu Photonics K.K.Substrate dividing method
US9711405B2 (en)2002-03-122017-07-18Hamamatsu Photonics K.K.Substrate dividing method
US10068801B2 (en)2002-03-122018-09-04Hamamatsu Photonics K.K.Substrate dividing method
US11424162B2 (en)2002-03-122022-08-23Hamamatsu Photonics K.K.Substrate dividing method
US8865566B2 (en)2002-12-032014-10-21Hamamatsu Photonics K.K.Method of cutting semiconductor substrate
JP2009054624A (ja)*2007-08-232009-03-12Nec Electronics Corpウェーハ補助シート、半導体ウェーハのブレーキング装置及びブレーキング方法

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