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JPS53139468A - Mounting structure of resin mold semiconductor device - Google Patents

Mounting structure of resin mold semiconductor device

Info

Publication number
JPS53139468A
JPS53139468AJP5407077AJP5407077AJPS53139468AJP S53139468 AJPS53139468 AJP S53139468AJP 5407077 AJP5407077 AJP 5407077AJP 5407077 AJP5407077 AJP 5407077AJP S53139468 AJPS53139468 AJP S53139468A
Authority
JP
Japan
Prior art keywords
semiconductor device
mounting structure
resin mold
mold semiconductor
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5407077A
Other languages
Japanese (ja)
Inventor
Kazuo Inoue
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Watch Co Ltd
Original Assignee
Citizen Watch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Watch Co LtdfiledCriticalCitizen Watch Co Ltd
Priority to JP5407077ApriorityCriticalpatent/JPS53139468A/en
Priority to US05/808,216prioritypatent/US4143456A/en
Priority to GB26291/77Aprioritypatent/GB1581587A/en
Publication of JPS53139468ApublicationCriticalpatent/JPS53139468A/en
Pendinglegal-statusCriticalCurrent

Links

Classifications

Landscapes

Abstract

PURPOSE: To secure a good coating over the semiconductor chip surface with the resin as well as to obtain the shaping effect by reducing the resin flow and to reduce the cost, by providing a pierced hole to the circuit substrate and then injecting the mold resin through the rear surface of the substrate.
COPYRIGHT: (C)1978,JPO&Japio
JP5407077A1976-06-281977-05-11Mounting structure of resin mold semiconductor devicePendingJPS53139468A (en)

Priority Applications (3)

Application NumberPriority DateFiling DateTitle
JP5407077AJPS53139468A (en)1977-05-111977-05-11Mounting structure of resin mold semiconductor device
US05/808,216US4143456A (en)1976-06-281977-06-20Semiconductor device insulation method
GB26291/77AGB1581587A (en)1976-06-281977-06-23Semi-conductor assembly

Applications Claiming Priority (1)

Application NumberPriority DateFiling DateTitle
JP5407077AJPS53139468A (en)1977-05-111977-05-11Mounting structure of resin mold semiconductor device

Publications (1)

Publication NumberPublication Date
JPS53139468Atrue JPS53139468A (en)1978-12-05

Family

ID=12960350

Family Applications (1)

Application NumberTitlePriority DateFiling Date
JP5407077APendingJPS53139468A (en)1976-06-281977-05-11Mounting structure of resin mold semiconductor device

Country Status (1)

CountryLink
JP (1)JPS53139468A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US4913930A (en)*1988-06-281990-04-03Wacker Silicones CorporationMethod for coating semiconductor components on a dielectric film
US5304513A (en)*1987-07-161994-04-19Gao Gesellschaft Fur Automation Und Organisation MbhMethod for manufacturing an encapsulated semiconductor package using an adhesive barrier frame
US5710071A (en)*1995-12-041998-01-20Motorola, Inc.Process for underfilling a flip-chip semiconductor device
USRE43404E1 (en)1996-03-072012-05-22Tessera, Inc.Methods for providing void-free layer for semiconductor assemblies

Cited By (4)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US5304513A (en)*1987-07-161994-04-19Gao Gesellschaft Fur Automation Und Organisation MbhMethod for manufacturing an encapsulated semiconductor package using an adhesive barrier frame
US4913930A (en)*1988-06-281990-04-03Wacker Silicones CorporationMethod for coating semiconductor components on a dielectric film
US5710071A (en)*1995-12-041998-01-20Motorola, Inc.Process for underfilling a flip-chip semiconductor device
USRE43404E1 (en)1996-03-072012-05-22Tessera, Inc.Methods for providing void-free layer for semiconductor assemblies

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