JPS5283132A - Portable card for electric signal processor and method of fabricating same - Google Patents

Portable card for electric signal processor and method of fabricating same

Info

Publication number: JPS5283132A
Authority: JP; Japan
Prior art keywords: signal processor; electric signal; portable card; fabricating same; fabricating
Prior art date: 1975-12-31
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Other versions

Inventor

Gasuton Bado Berunaaru

Jiyozefu Giyoomu Furansowa

Gasuton Kurutsuueiyu Kareru

Original Assignee

Cii

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1975-12-31

Filing date

1976-12-28

Publication date

1977-07-11

1976-12-28Application filed by CiifiledCriticalCii

1977-07-11Publication of JPS5283132ApublicationCriticalpatent/JPS5283132A/en

1986-07-12Publication of JPS6130315B2publicationCriticalpatent/JPS6130315B2/ja

StatusGrantedlegal-statusCriticalCurrent

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0105—Tin [Sn]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01058—Cerium [Ce]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01063—Europium [Eu]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01094—Plutonium [Pu]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
- H01L2924/15172—Fan-out arrangement of the internal vias
- H01L2924/15173—Fan-out arrangement of the internal vias in a single layer of the multilayer substrate
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector

Landscapes

Engineering & Computer Science (AREA)
Computer Hardware Design (AREA)
Microelectronics & Electronic Packaging (AREA)
Physics & Mathematics (AREA)
General Physics & Mathematics (AREA)
Power Engineering (AREA)
Theoretical Computer Science (AREA)
Condensed Matter Physics & Semiconductors (AREA)
Credit Cards Or The Like (AREA)
Control Of Vending Devices And Auxiliary Devices For Vending Devices (AREA)
Audible And Visible Signals (AREA)
Financial Or Insurance-Related Operations Such As Payment And Settlement (AREA)
Handling Of Sheets (AREA)

JP15766976A1975-12-311976-12-28Portable card for electric signal processor and method of fabricating sameGrantedJPS5283132A (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
FR7540361AFR2337381A1 (en)	1975-12-31	1975-12-31	PORTABLE CARD FOR ELECTRICAL SIGNAL PROCESSING SYSTEM AND PROCESS FOR MANUFACTURING THIS CARD

Publications (2)

Publication Number	Publication Date
JPS5283132Atrue JPS5283132A (en)	1977-07-11
JPS6130315B2 JPS6130315B2 (en)	1986-07-12

Family

ID=9164418

Family Applications (2)

Application Number	Title	Priority Date	Filing Date
JP15766976AGrantedJPS5283132A (en)	1975-12-31	1976-12-28	Portable card for electric signal processor and method of fabricating same
JP61052763AGrantedJPS625894A (en)	1975-12-31	1986-03-12	Card and manufacture of card

Family Applications After (1)

Application Number	Title	Priority Date	Filing Date
JP61052763AGrantedJPS625894A (en)	1975-12-31	1986-03-12	Card and manufacture of card

Country Status (11)

Country	Link
JP (2)	JPS5283132A (en)
BR (1)	BR7608831A (en)
CA (1)	CA1083714A (en)
CH (1)	CH619310A5 (en)
DE (1)	DE2659573C2 (en)
ES (1)	ES454567A1 (en)
FR (1)	FR2337381A1 (en)
GB (1)	GB1567784A (en)
IT (1)	IT1124741B (en)
NL (1)	NL190131C (en)
SE (1)	SE415304B (en)

Cited By (26)

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Publication number	Priority date	Publication date	Assignee	Title
JPS5562591A (en)*	1978-10-30	1980-05-12	Fujitsu Ltd	Memory card
JPS5748175A (en)*	1980-07-09	1982-03-19	Philips Nv	Portable identifying structure
JPS5752977A (en)*	1980-08-07	1982-03-29	Gao Ges Automation Org	Identifying card and method of producing same
JPS5754356A (en)*	1980-08-05	1982-03-31	Gao Ges Automation Org
JPS57123556U (en)*	1981-01-26	1982-08-02
JPS57123555U (en)*	1981-01-26	1982-08-02
JPS57209578A (en)*	1981-06-19	1982-12-22	Fujitsu Ltd	Card
JPS5812082A (en)*	1981-04-14	1983-01-24	ガ−ア−オ−・ゲゼルシヤフト・フユ−ル・アウトマチオン・ウント・オルガニザチオン・エム・ベ−・ハ−	Data carrier for identification card or the like
JPS5888892A (en)*	1981-11-20	1983-05-27	Hitachi Ltd	bubble memory cassette
JPS5892597A (en)*	1981-11-28	1983-06-01	大日本印刷株式会社	IC card manufacturing method
JPS58110474U (en)*	1982-01-22	1983-07-27	凸版印刷株式会社	card
JPS58187858U (en)*	1982-06-08	1983-12-13	セイコーインスツルメンツ株式会社	IC card
JPS58221478A (en)*	1982-06-16	1983-12-23	Kyodo Printing Co Ltd	IC card
JPS5944067U (en)*	1982-09-16	1984-03-23	大日本印刷株式会社	IC card
JPS5958949U (en)*	1982-10-08	1984-04-17	凸版印刷株式会社	Card with built-in IC, etc.
JPS5990184A (en)*	1982-09-27	1984-05-24	エヌ・ベ−・フイリツプス・フル−イランペンフアブリケン	Data card and manufacture thereof
JPS59108581A (en)*	1983-11-17	1984-06-23	株式会社ソフイア	Card type pinball game
JPS59108580A (en)*	1983-11-17	1984-06-23	株式会社ソフイア	Infarmation recording card of card type pinball machine
JPS60126864U (en)*	1984-01-30	1985-08-26	共同印刷株式会社	IC card
JPS60126863U (en)*	1984-01-30	1985-08-26	共同印刷株式会社	IC card
JPS61248184A (en)*	1985-04-26	1986-11-05	Kyodo Printing Co Ltd	IC module
JPS63185688A (en)*	1987-01-29	1988-08-01	大日本印刷株式会社	IC card manufacturing method
JPH01152098A (en)*	1988-09-08	1989-06-14	Dainippon Printing Co Ltd	Card base material for ic card
JPH054483A (en)*	1979-05-17	1993-01-14	Gao Ges Autom Org Mbh	Method for producing identification card provided with ic chip
JPH071877A (en)*	1993-12-28	1995-01-06	Dainippon Printing Co Ltd	Card recording method
JPH07164787A (en)*	1992-03-26	1995-06-27	Dainippon Printing Co Ltd	IC card manufacturing method

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FR2379949A1 (en)*	1977-02-07	1978-09-01	Cii Honeywell Bull	DEVICE FOR CONTROLLING A CONTACT INSERTED BETWEEN A TRANSMITTER CIRCUIT AND A RECEIVER CIRCUIT FOR THE TRANSMISSION OF ELECTRIC SIGNALS
FR2415378A1 (en)*	1978-01-24	1979-08-17	Moreno Roland	METHOD AND DEVICE FOR ELECTRICALLY CONNECTING A REMOVABLE OBJECT, IN PARTICULAR A PORTABLE ELECTRONIC CARD
FR2439478A1 (en)*	1978-10-19	1980-05-16	Cii Honeywell Bull	FLAT HOUSING FOR DEVICES WITH INTEGRATED CIRCUITS
DE2919649A1 (en)*	1979-05-16	1980-11-20	Bbc Brown Boveri & Cie	SECURITY PAPER
DE2926867C2 (en)*	1979-07-03	1986-01-02	GAO Gesellschaft für Automation und Organisation mbH, 8000 München	Circuit unit
FR2477303B1 (en)*	1980-02-28	1986-09-26	Dassault Electronique	ELECTRONIC CARD READING DEVICE
FR2480008A1 (en)*	1980-04-04	1981-10-09	Flonic Sa	IMPROVEMENTS TO MEMORY CARDS
DE3019207A1 (en)*	1980-05-20	1981-11-26	GAO Gesellschaft für Automation und Organisation mbH, 8000 München	CARRIER ELEMENT FOR AN IC CHIP
DE3019206A1 (en)*	1980-05-20	1981-11-26	GAO Gesellschaft für Automation und Organisation mbH, 8000 München	METHOD FOR CONTACTING GALVANIC CONTACTS OF AN ID CARD WITH EMBEDDED IC COMPONENT
DE3033881A1 (en)*	1980-09-09	1982-04-15	Siemens AG, 1000 Berlin und 8000 München	Free-standing circuit module - with modules and conductors on two sides connected to two groups of connector pins
US4549247A (en)*	1980-11-21	1985-10-22	Gao Gesellschaft Fur Automation Und Organisation Mbh	Carrier element for IC-modules
DE3123198C2 (en)*	1980-12-08	1993-10-07	Gao Ges Automation Org	Carrier elements for an IC chip
NL191959B (en)*	1981-03-24	1996-07-01	Gao Ges Automation Org	Identification card with IC module and carrier element for an IC module.
DE3111516A1 (en)*	1981-03-24	1982-12-23	GAO Gesellschaft für Automation und Organisation mbH, 8000 München	Identity card with IC chip
DE3130324A1 (en)*	1981-07-31	1983-02-17	GAO Gesellschaft für Automation und Organisation mbH, 8000 München	CARRIER ELEMENT FOR AN IC COMPONENT
FR2511544A1 (en)*	1981-08-14	1983-02-18	Dassault Electronique	ELECTRONIC MODULE FOR AUTOMATIC TRANSACTION CARD AND CARD COMPRISING SUCH A MODULE
DE3151408C1 (en)*	1981-12-24	1983-06-01	GAO Gesellschaft für Automation und Organisation mbH, 8000 München	ID card with an IC module
FR2520541A1 (en)*	1982-01-22	1983-07-29	Flonic Sa	Mounting assembly for memory integrated circuit in bank card - comprises flexible film support carrying metallic connecting pads for chip connections
FR2523335A1 (en)*	1982-03-10	1983-09-16	Flonic Sa	Contact building method for card-borne integrated circuits - uses conductive pad welded onto foil used as contact to integrated circuit, creating more durable contact
DE3313414A1 (en)*	1983-04-13	1984-10-18	Hubert 8958 Füssen Schweiger	Use of a programmable read-only memory chip, integrated in an identity card, for storing information for a microprocessor-controlled reader
EP0128822B1 (en)*	1983-06-09	1987-09-09	Flonic S.A.	Method of producing memory cards, and cards obtained thereby
FR2555780B1 (en)*	1983-11-29	1986-04-11	Flonic Sa	METHOD FOR MANUFACTURING MEMORY CARDS AND CARDS OBTAINED ACCORDING TO THIS PROCESS
FR2548409B1 (en)*	1983-06-29	1985-11-15	Sligos	PROCESS FOR THE MANUFACTURE OF MEMORY CARDS, INSTALLATION AND MEMORY CARDS OBTAINED
FR2548857B1 (en)*	1983-07-04	1987-11-27	Cortaillod Cables Sa	PROCESS FOR THE CONTINUOUS MANUFACTURE OF A PRINTED CARD
JPS6084686A (en)*	1983-10-17	1985-05-14	Toshiba Corp	Recording method of information recording medium
DE3338597A1 (en)*	1983-10-24	1985-05-02	GAO Gesellschaft für Automation und Organisation mbH, 8000 München	DATA CARRIER WITH INTEGRATED CIRCUIT AND METHOD FOR PRODUCING THE SAME
FR2554275B1 (en)*	1983-10-26	1986-09-05	Radiotechnique Compelec	CONNECTION DEVICE FOR A POWER SEMICONDUCTOR
FR2557715B1 (en)*	1983-12-30	1987-07-17	Bull Sa	METHOD AND SYSTEM FOR CONFIDENTIALLY PROCESSING INFORMATION STORED ON AN OPTICALLY READING RECORD OF A PORTABLE MEDIUM
FR2575566B1 (en)*	1984-12-28	1990-06-22	Bull Sa	METHOD FOR CUSTOMIZING PORTABLE MEDIA SUCH AS CARDS
FR2581480A1 (en)*	1985-04-10	1986-11-07	Ebauches Electroniques Sa	ELECTRONIC UNIT, IN PARTICULAR FOR A MICROCIRCUIT BOARD AND CARD COMPRISING SUCH A UNIT
JPS61188871U (en)*	1985-05-16	1986-11-25
FR2584236B1 (en)*	1985-06-26	1988-04-29	Bull Sa	METHOD FOR MOUNTING AN INTEGRATED CIRCUIT ON A SUPPORT, RESULTING DEVICE AND ITS APPLICATION TO AN ELECTRONIC MICROCIRCUIT CARD
FR2584235B1 (en)*	1985-06-26	1988-04-22	Bull Sa	METHOD FOR MOUNTING AN INTEGRATED CIRCUIT ON A SUPPORT, RESULTING DEVICE AND ITS APPLICATION TO AN ELECTRONIC MICROCIRCUIT CARD
FR2584862B1 (en)*	1985-07-12	1988-05-20	Eurotechnique Sa	PROCESS FOR THE CONTINUOUS MANUFACTURE OF MICROMODULES FOR CARDS CONTAINING COMPONENTS, CONTINUOUS BAND OF MICROMODULES AND MICROMODULES CARRIED OUT BY SUCH A PROCESS
US4841134A (en)*	1985-07-27	1989-06-20	Dai Nippon Insatsu Kabushika Kaisha	IC card
FR2590051B1 (en)*	1985-11-08	1991-05-17	Eurotechnique Sa	CARD COMPRISING A COMPONENT AND MICROMODULE WITH SIDING CONTACTS
FR2590052B1 (en)*	1985-11-08	1991-03-01	Eurotechnique Sa	METHOD FOR RECYCLING A CARD COMPRISING A COMPONENT, CARD PROVIDED FOR RECYCLE
US4755661A (en)*	1986-01-10	1988-07-05	Ruebsam Herrn H	Connection of electronic components in a card
FR2599165A1 (en)*	1986-05-21	1987-11-27	Michot Gerard	OBJECT ASSOCIATED WITH ELECTRONIC ELEMENT AND METHOD OF OBTAINING
DE3723547C2 (en)*	1987-07-16	1996-09-26	Gao Ges Automation Org	Carrier element for installation in ID cards
US4931623A (en)*	1987-11-14	1990-06-05	Kabushiki Kaisha Toshiba	Portable storage medium
DE3924439A1 (en)*	1989-07-24	1991-04-18	Edgar Schneider	CARRIER ELEMENT WITH AT LEAST ONE INTEGRATED CIRCUIT, ESPECIALLY FOR INSTALLATION IN CHIP CARDS, AND METHOD FOR THE PRODUCTION OF THESE CARRIER ELEMENTS
JP2543235B2 (en)*	1990-06-29	1996-10-16	松下電器産業株式会社	IC card adapter
DE9100665U1 (en)*	1991-01-21	1992-07-16	TELBUS Gesellschaft für elektronische Kommunikations-Systeme mbH, 85391 Allershausen	Carrier element for integrated semiconductor circuits, especially for installation in chip cards
DE9113601U1 (en)*	1991-10-31	1993-03-04	Schneider, Edgar, 8057 Günzenhausen	Multifunctional protective shield for microelectronic circuits and sensors, especially for so-called chip cards
DE4209184C1 (en)*	1992-03-21	1993-05-19	Orga Kartensysteme Gmbh, 6072 Dreieich, De
US5497140A (en)*	1992-08-12	1996-03-05	Micron Technology, Inc.	Electrically powered postage stamp or mailing or shipping label operative with radio frequency (RF) communication
USRE42773E1 (en)	1992-06-17	2011-10-04	Round Rock Research, Llc	Method of manufacturing an enclosed transceiver
US5776278A (en)	1992-06-17	1998-07-07	Micron Communications, Inc.	Method of manufacturing an enclosed transceiver
DE4345610B4 (en)*	1992-06-17	2013-01-03	Micron Technology Inc.	Method for producing a radio-frequency identification device (HFID)
US7158031B2 (en)	1992-08-12	2007-01-02	Micron Technology, Inc.	Thin, flexible, RFID label and system for use
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DE4340847A1 (en)*	1993-11-26	1995-06-01	Optosys Gmbh Berlin	Chip module with chip on substrate material
US5817207A (en)	1995-10-17	1998-10-06	Leighton; Keith R.	Radio frequency identification card and hot lamination process for the manufacture of radio frequency identification cards
DE19539181C2 (en)*	1995-10-20	1998-05-14	Ods Gmbh & Co Kg	Chip card module and corresponding manufacturing process
FR2747812B1 (en)*	1996-04-23	1998-05-22	Solaic Sa	CONTACTLESS INTEGRATED CIRCUIT CARD WITH CONDUCTIVE POLYMER ANTENNA
DE19618103C2 (en)*	1996-05-06	1998-05-14	Siemens Ag	Chip card module with a coating of conductive plastic and process for its production
US5988510A (en)*	1997-02-13	1999-11-23	Micron Communications, Inc.	Tamper resistant smart card and method of protecting data in a smart card
DE19708617C2 (en)	1997-03-03	1999-02-04	Siemens Ag	Chip card module and method for its production as well as this comprehensive chip card
US6329213B1 (en)	1997-05-01	2001-12-11	Micron Technology, Inc.	Methods for forming integrated circuits within substrates
US6339385B1 (en)	1997-08-20	2002-01-15	Micron Technology, Inc.	Electronic communication devices, methods of forming electrical communication devices, and communication methods
FR2769130B1 (en)*	1997-09-30	2001-06-08	Thomson Csf	METHOD FOR COATING AN ELECTRONIC CHIP AND ELECTRONIC CARD COMPRISING AT LEAST ONE COATED CHIP ACCORDING TO THIS PROCESS
US6273339B1 (en)	1999-08-30	2001-08-14	Micron Technology, Inc.	Tamper resistant smart card and method of protecting data in a smart card
US6427918B1 (en)*	2000-11-29	2002-08-06	Palm, Inc.	Apparatus for storing auxiliary add-in cards for a portable electronic system

Citations (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS5192141A (en)*	1974-12-30	1976-08-12		Keitaikanona shikibetsujohoofukumubutsupin
JPS536491A (en)*	1976-07-01	1978-01-20	Kanegafuchi Chem Ind Co Ltd	Frothing compositon

Family Cites Families (2)

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Publication number	Priority date	Publication date	Assignee	Title
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1975
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1976
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- 1976-12-16CACA268,082Apatent/CA1083714A/ennot_activeExpired
- 1976-12-20GBGB5321476Apatent/GB1567784A/ennot_activeExpired
- 1976-12-23ESES454567Apatent/ES454567A1/ennot_activeExpired
- 1976-12-28SESE7614622Apatent/SE415304B/ennot_activeIP Right Cessation
- 1976-12-28JPJP15766976Apatent/JPS5283132A/enactiveGranted
- 1976-12-30BRBR7608831Apatent/BR7608831A/enunknown
- 1976-12-30DEDE19762659573patent/DE2659573C2/ennot_activeExpired
- 1976-12-31NLNL7614637Apatent/NL190131C/ennot_activeIP Right Cessation
1986
- 1986-03-12JPJP61052763Apatent/JPS625894A/enactiveGranted

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JPS5192141A (en)*	1974-12-30	1976-08-12		Keitaikanona shikibetsujohoofukumubutsupin
JPS536491A (en)*	1976-07-01	1978-01-20	Kanegafuchi Chem Ind Co Ltd	Frothing compositon

Cited By (27)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS5562591A (en)*	1978-10-30	1980-05-12	Fujitsu Ltd	Memory card
JPH054483A (en)*	1979-05-17	1993-01-14	Gao Ges Autom Org Mbh	Method for producing identification card provided with ic chip
JPS5748175A (en)*	1980-07-09	1982-03-19	Philips Nv	Portable identifying structure
JPS5754356A (en)*	1980-08-05	1982-03-31	Gao Ges Automation Org
JPH05270183A (en)*	1980-08-05	1993-10-19	Gao Ges Autom Org Mbh	Carrier element for ic module
JPS5752977A (en)*	1980-08-07	1982-03-29	Gao Ges Automation Org	Identifying card and method of producing same
JPS57123556U (en)*	1981-01-26	1982-08-02
JPS57123555U (en)*	1981-01-26	1982-08-02
JPS5812082A (en)*	1981-04-14	1983-01-24	ガ−ア−オ−・ゲゼルシヤフト・フユ−ル・アウトマチオン・ウント・オルガニザチオン・エム・ベ−・ハ−	Data carrier for identification card or the like
JPS57209578A (en)*	1981-06-19	1982-12-22	Fujitsu Ltd	Card
JPS5888892A (en)*	1981-11-20	1983-05-27	Hitachi Ltd	bubble memory cassette
JPS5892597A (en)*	1981-11-28	1983-06-01	大日本印刷株式会社	IC card manufacturing method
JPS58110474U (en)*	1982-01-22	1983-07-27	凸版印刷株式会社	card
JPS58187858U (en)*	1982-06-08	1983-12-13	セイコーインスツルメンツ株式会社	IC card
JPS58221478A (en)*	1982-06-16	1983-12-23	Kyodo Printing Co Ltd	IC card
JPS5944067U (en)*	1982-09-16	1984-03-23	大日本印刷株式会社	IC card
JPS5990184A (en)*	1982-09-27	1984-05-24	エヌ・ベ−・フイリツプス・フル−イランペンフアブリケン	Data card and manufacture thereof
JPS5958949U (en)*	1982-10-08	1984-04-17	凸版印刷株式会社	Card with built-in IC, etc.
JPS59108581A (en)*	1983-11-17	1984-06-23	株式会社ソフイア	Card type pinball game
JPS59108580A (en)*	1983-11-17	1984-06-23	株式会社ソフイア	Infarmation recording card of card type pinball machine
JPS60126864U (en)*	1984-01-30	1985-08-26	共同印刷株式会社	IC card
JPS60126863U (en)*	1984-01-30	1985-08-26	共同印刷株式会社	IC card
JPS61248184A (en)*	1985-04-26	1986-11-05	Kyodo Printing Co Ltd	IC module
JPS63185688A (en)*	1987-01-29	1988-08-01	大日本印刷株式会社	IC card manufacturing method
JPH01152098A (en)*	1988-09-08	1989-06-14	Dainippon Printing Co Ltd	Card base material for ic card
JPH07164787A (en)*	1992-03-26	1995-06-27	Dainippon Printing Co Ltd	IC card manufacturing method
JPH071877A (en)*	1993-12-28	1995-01-06	Dainippon Printing Co Ltd	Card recording method

Also Published As

Publication number	Publication date
NL190131C (en)	1993-11-01
IT1124741B (en)	1986-05-14
SE415304B (en)	1980-09-22
CA1083714A (en)	1980-08-12
FR2337381B1 (en)	1979-07-06
NL7614637A (en)	1977-07-04
ES454567A1 (en)	1977-12-16
SE7614622L (en)	1977-07-02
GB1567784A (en)	1980-05-21
DE2659573A1 (en)	1977-07-14
CH619310A5 (en)	1980-09-15
JPS625894A (en)	1987-01-12
JPS6130315B2 (en)	1986-07-12
JPS6313840B2 (en)	1988-03-28
FR2337381A1 (en)	1977-07-29
DE2659573C2 (en)	1986-02-27
BR7608831A (en)	1977-10-25
NL190131B (en)	1993-06-01

Publication	Publication Date	Title
JPS5283132A (en)	1977-07-11	Portable card for electric signal processor and method of fabricating same
JPS5556639A (en)	1980-04-25	Strip for carrying device for processing electric signal and method of manufacturing same
JPS5279730A (en)	1977-07-05	Method of fabricating document and device therefor
JPS5286077A (en)	1977-07-16	Supercompact device and method of manufacture thereof
JPS5262491A (en)	1977-05-23	Method of and apparatus for determining mode characteristic of structure
JPS5293200A (en)	1977-08-05	Device and method of collecting fingerprint
JPS5283302A (en)	1977-07-12	Improvement in separation method of nnparaffin and isoparaffin
JPS52120772A (en)	1977-10-11	Method of etching and apparatus therefor
JPS5297186A (en)	1977-08-15	Electric connector and method of manufacture thereof
JPS52101492A (en)	1977-08-25	Electric connector and method of manufacture thereof
JPS5247801A (en)	1977-04-16	Separator and method of its application
JPS52143498A (en)	1977-11-30	Electric parts and method of manufacture thereof
IL50534A (en)	1980-02-29	Lithium-bromine cell and method of making it
JPS53104813A (en)	1978-09-12	Enclosed electric induction device and method of manufacture thereof
JPS524004A (en)	1977-01-12	Metod of and device for conducting electric connections
JPS5210565A (en)	1977-01-26	Method of and device for manufacturing electric circuit board
JPS53104802A (en)	1978-09-12	Electric device* method of manufacture thereof* and terminals
JPS5285530A (en)	1977-07-15	Method of and apparatus for obtaining electric signals
JPS5351458A (en)	1978-05-10	Method of manufacturing capacttor and apparatus therefor
JPS5259815A (en)	1977-05-17	Lithiummbromine battery and method of making same
JPS51121225A (en)	1976-10-23	Data indicator and method of using same
JPS5220666A (en)	1977-02-16	Electric floating method and its device
JPS5345972A (en)	1978-04-25	Electrical device and method of manufacture thereof
PH12074A (en)	1978-10-30	Diarylbutanolamines and method of use thereof
JPS5234357A (en)	1977-03-16	Method of and device for manufacturing electric device

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