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JPS5232670A - Flip chip solder bump - Google Patents

Flip chip solder bump

Info

Publication number
JPS5232670A
JPS5232670AJP50108788AJP10878875AJPS5232670AJP S5232670 AJPS5232670 AJP S5232670AJP 50108788 AJP50108788 AJP 50108788AJP 10878875 AJP10878875 AJP 10878875AJP S5232670 AJPS5232670 AJP S5232670A
Authority
JP
Japan
Prior art keywords
flip chip
solder bump
chip solder
piling
consecutively
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50108788A
Other languages
Japanese (ja)
Inventor
Masayuki Kataoka
Takayoshi Kawakami
Shiro Yokota
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric CorpfiledCriticalMitsubishi Electric Corp
Priority to JP50108788ApriorityCriticalpatent/JPS5232670A/en
Publication of JPS5232670ApublicationCriticalpatent/JPS5232670A/en
Pendinglegal-statusCriticalCurrent

Links

Classifications

Landscapes

Abstract

PURPOSE:To secure a high-strength bump with easy manufacturing process by piling solder layers in such a way that the fusing point of each layer lowers consecutively.
JP50108788A1975-09-081975-09-08Flip chip solder bumpPendingJPS5232670A (en)

Priority Applications (1)

Application NumberPriority DateFiling DateTitle
JP50108788AJPS5232670A (en)1975-09-081975-09-08Flip chip solder bump

Applications Claiming Priority (1)

Application NumberPriority DateFiling DateTitle
JP50108788AJPS5232670A (en)1975-09-081975-09-08Flip chip solder bump

Publications (1)

Publication NumberPublication Date
JPS5232670Atrue JPS5232670A (en)1977-03-12

Family

ID=14493484

Family Applications (1)

Application NumberTitlePriority DateFiling Date
JP50108788APendingJPS5232670A (en)1975-09-081975-09-08Flip chip solder bump

Country Status (1)

CountryLink
JP (1)JPS5232670A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
JPS57190020A (en)*1981-05-201982-11-22Dainippon Ink & Chem IncPreparation of polyester
JPS58197751A (en)*1982-05-131983-11-17Mitsubishi Electric CorpFormation of salient electrode
JPS5930854A (en)*1982-08-111984-02-18Teijin LtdPolyester composition
JPH07226400A (en)*1993-06-181995-08-22Kawasaki Steel Corp Semiconductor device and manufacturing method thereof

Citations (3)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
JPS4878874A (en)*1972-01-201973-10-23
JPS4962306A (en)*1972-10-191974-06-17
JPS504666B1 (en)*1970-12-251975-02-22

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
JPS504666B1 (en)*1970-12-251975-02-22
JPS4878874A (en)*1972-01-201973-10-23
JPS4962306A (en)*1972-10-191974-06-17

Cited By (4)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
JPS57190020A (en)*1981-05-201982-11-22Dainippon Ink & Chem IncPreparation of polyester
JPS58197751A (en)*1982-05-131983-11-17Mitsubishi Electric CorpFormation of salient electrode
JPS5930854A (en)*1982-08-111984-02-18Teijin LtdPolyester composition
JPH07226400A (en)*1993-06-181995-08-22Kawasaki Steel Corp Semiconductor device and manufacturing method thereof

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