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JPS5212575A - Production method of semi-conductor device - Google Patents

Production method of semi-conductor device

Info

Publication number
JPS5212575A
JPS5212575AJP50088755AJP8875575AJPS5212575AJP S5212575 AJPS5212575 AJP S5212575AJP 50088755 AJP50088755 AJP 50088755AJP 8875575 AJP8875575 AJP 8875575AJP S5212575 AJPS5212575 AJP S5212575A
Authority
JP
Japan
Prior art keywords
semi
production method
conductor device
insulation film
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50088755A
Other languages
Japanese (ja)
Inventor
Hiroaki Fujimoto
Masaharu Noyori
Isamu Kitahiro
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co LtdfiledCriticalMatsushita Electric Industrial Co Ltd
Priority to JP50088755ApriorityCriticalpatent/JPS5212575A/en
Publication of JPS5212575ApublicationCriticalpatent/JPS5212575A/en
Pendinglegal-statusCriticalCurrent

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Classifications

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Abstract

PURPOSE: To make superthin package possible by using a thin insulation film as a themal insulation substrate face-down bonding a semi-conductor element, and protect a metal prominence for bonding with a insulation film, thus increase its mechanical strength.
COPYRIGHT: (C)1977,JPO&Japio
JP50088755A1975-07-181975-07-18Production method of semi-conductor devicePendingJPS5212575A (en)

Priority Applications (1)

Application NumberPriority DateFiling DateTitle
JP50088755AJPS5212575A (en)1975-07-181975-07-18Production method of semi-conductor device

Applications Claiming Priority (1)

Application NumberPriority DateFiling DateTitle
JP50088755AJPS5212575A (en)1975-07-181975-07-18Production method of semi-conductor device

Publications (1)

Publication NumberPublication Date
JPS5212575Atrue JPS5212575A (en)1977-01-31

Family

ID=13951701

Family Applications (1)

Application NumberTitlePriority DateFiling Date
JP50088755APendingJPS5212575A (en)1975-07-181975-07-18Production method of semi-conductor device

Country Status (1)

CountryLink
JP (1)JPS5212575A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
JPS54128688A (en)*1978-03-271979-10-05IbmBonding method
JPS63108734A (en)*1986-10-271988-05-13Matsushita Electric Works LtdPrinted circuit substrate with bump
JPH01196843A (en)*1988-02-021989-08-08Seiko Epson Corp Assembly method of integrated circuit device
JPH03148846A (en)*1989-11-061991-06-25Nippon Mektron LtdIc placing flexible circuit board and manufacture thereof
WO2004093183A1 (en)*1995-03-172004-10-28Atsushi HinoFilm carrier and semiconductor device using the same
JP2011061179A (en)*2009-09-142011-03-24Samsung Electro-Mechanics Co LtdPrinted circuit board and method for manufacturing the same

Cited By (6)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
JPS54128688A (en)*1978-03-271979-10-05IbmBonding method
JPS63108734A (en)*1986-10-271988-05-13Matsushita Electric Works LtdPrinted circuit substrate with bump
JPH01196843A (en)*1988-02-021989-08-08Seiko Epson Corp Assembly method of integrated circuit device
JPH03148846A (en)*1989-11-061991-06-25Nippon Mektron LtdIc placing flexible circuit board and manufacture thereof
WO2004093183A1 (en)*1995-03-172004-10-28Atsushi HinoFilm carrier and semiconductor device using the same
JP2011061179A (en)*2009-09-142011-03-24Samsung Electro-Mechanics Co LtdPrinted circuit board and method for manufacturing the same

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