【０００１】[0001]
【発明の属する技術分野】本発明は、例えば積層プリン
ト基板のように、被成形物を加熱・圧締して積層成形を
行う多段積層装置に関し、特に真空雰囲気下で積層成形
を行う真空多段積層装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multi-stage laminating apparatus for laminating and forming an object to be molded by heating and pressing, such as a laminated printed circuit board, and more particularly to a vacuum multi-stage laminating apparatus for laminating and forming in a vacuum atmosphere. It relates to the device.
【０００２】[0002]
【従来の技術】従来の真空多段積層装置は一般に、複数
のステーに固定された固定盤と、この固定盤に対して近
接離間移動するように、ステーに摺動可能に取付けられ
た可動盤と、固定盤と可動盤との間に配設された複数の
熱板とを備えており、例えばプリント配線板のような多
層基板等の積層成形に使用されている。各熱板は、鋼等
からなるブロックの内部に熱油等の温調流体流路や電気
ヒータ等の加熱手段を設けたもので、その両面は平滑に
形成されている。そして、この真空多段積層装置を用い
て多層基板を成形する場合においては、熱板間に挿入さ
れた被成形物の揮発成分を除去してボイド等の不具合を
防止するため、真空多段積層装置全体をチャンバー内に
配置し、チャンバー内を減圧して真空雰囲気下で被成形
物を熱板間に挿入して積層成形している。2. Description of the Related Art A conventional vacuum multi-stage laminating apparatus generally comprises a fixed plate fixed to a plurality of stays and a movable plate slidably attached to the stays so as to move closer to and away from the fixed plate. It is provided with a plurality of heating plates arranged between a fixed platen and a movable platen, and is used for lamination molding of a multilayer substrate such as a printed wiring board. Each hot plate is provided with a temperature control fluid flow path such as hot oil and a heating means such as an electric heater inside a block made of steel or the like, and both surfaces thereof are formed to be smooth. When a multilayer substrate is formed by using this vacuum multi-stage laminating apparatus, the entire vacuum multi-stage laminating apparatus is used in order to prevent voids and other defects by removing volatile components of the molding object inserted between the hot plates. Is placed in a chamber, the inside of the chamber is decompressed, and the molding target is inserted between the hot plates in a vacuum atmosphere to perform lamination molding.
【０００３】ところで、近年の基板においては、集積密
度が高くなり、表面実装の発展に伴ってその構成も変化
して、図４に示すように、チップ等の表面実装部品を積
載するための階段状の窪みを有する基板が必要となって
いる。By the way, in recent boards, the integration density has increased, and the structure thereof has changed with the development of surface mounting. As shown in FIG. 4, steps for mounting surface mounting components such as chips are provided. There is a need for a substrate having a dent.
【０００４】[0004]
【発明が解決しようとする課題】上記従来の技術にあっ
ては、上下方向に重合された熱板の間に被成形物を挟持
して圧締を行うため、被成形物にかかる圧締力が挟持さ
れる熱板の位置によって異なり、被成形物を均一に圧締
することが困難であるという問題があった。In the above-mentioned conventional technique, since the object to be molded is clamped between the hot plates which are vertically overlapped with each other for clamping, the clamping force applied to the object to be molded is clamped. There is a problem that it is difficult to uniformly press the object to be molded, depending on the position of the hot plate.
【０００５】また、熱板の両面が平滑に形成されている
ため、上述したように階段状の窪みを有する多層基板を
積層成形するような場合においては、窪みの階段部分に
接着圧を加えるために窪みの形状に合わせたシリコンラ
バー等を埋め込んで加熱・圧締するか、または、各階層
毎に加熱・圧締を繰り返して積層成形を行わなければな
らない。Further, since both sides of the hot plate are formed to be smooth, in the case where a multi-layer substrate having stepped depressions is laminated and formed as described above, adhesive pressure is applied to the stepped portions of the depressions. It is necessary to embed a silicon rubber or the like matching the shape of the depression and heat and press it, or repeat heating and pressurization for each layer to perform laminated molding.
【０００６】窪みの形状に合わせたシリコンラバー等を
埋め込んで加熱・圧締を行う場合にあっては、基板の窪
みの形状に合わせたシリコンラバーを用意しなければな
らず、また、被成形物の窪みに対するシリコンラバーの
取付けおよび取外しの手間を要するという問題があっ
た。また、各階層毎に加熱・圧締を行う場合にあって
は、一工程で積層成形を行うことができないという問題
があった。このため、階段状の窪みを有する多層基板を
積層成形するような場合においては、成形効率の向上を
図ることが困難であった。In the case of embedding a silicon rubber or the like matching the shape of the depression to heat and press it, it is necessary to prepare the silicon rubber corresponding to the shape of the depression of the substrate, and the object to be molded. There is a problem that it takes time and effort to attach and detach the silicone rubber to and from the depression. Further, in the case of performing heating / clamping for each layer, there is a problem that the laminate molding cannot be performed in one step. For this reason, it has been difficult to improve the molding efficiency in the case of laminating and molding a multilayer substrate having a stepped depression.
【０００７】さらに、上記従来の技術において、真空多
段積層装置全体をチャンバー内に配置した場合にあって
は、チャンバーの内部全体を減圧するため、被成形物を
チャンバに出し入れするためのシャッタには気密性や耐
圧性を有する強固なものが要求され、しかも、このシャ
ッタを開閉するための付帯設備が必要であるという問題
があった。また、減圧容積が大きいため、減圧に要する
時間が多くなって成形サイクルが長くなり、積層装置の
稼働効率を減退させるという問題があった。Further, in the above-mentioned conventional technique, when the entire vacuum multi-stage laminating apparatus is arranged in the chamber, the pressure inside the chamber is reduced so that the shutter for inserting and removing the molded article into and out of the chamber is used. There is a problem that a strong thing having airtightness and pressure resistance is required, and additionally, an auxiliary facility for opening and closing this shutter is required. In addition, since the pressure reduction volume is large, there is a problem that the time required for the pressure reduction is increased, the molding cycle is lengthened, and the operation efficiency of the laminating apparatus is reduced.
【０００８】本発明は、上記課題を解決するためになさ
れたもので、窪みを有するような平坦でない被成形物の
ように、その形状に影響されることなく積層成形を均一
かつ確実に行うことができる真空多段積層装置を提供す
ることを目的とする。また、本発明は、階段状の窪みを
有する多層基板を積層成形するような場合においても一
工程で積層成形を行うことができる、真空多段積層装置
の成形効率の向上を図ることを目的とするものである。
さらに本発明は、被成形物を真空雰囲気下で積層成形す
るための構造や付帯設備の簡略化を図ると共に、減圧に
要する時間の短縮化を図り、真空多段積層装置の稼働効
率の向上を図ることを目的とするものである。The present invention has been made in order to solve the above-mentioned problems, and it is possible to uniformly and surely perform laminated molding without being affected by the shape of a non-planar molding object having a depression. An object of the present invention is to provide a vacuum multi-stage laminating apparatus capable of performing the above. Another object of the present invention is to improve the molding efficiency of a vacuum multi-stage laminating apparatus, which can perform laminating and molding in one step even when laminating and molding a multi-layer substrate having a stepped depression. It is a thing.
Further, the present invention simplifies the structure and incidental equipment for laminating and molding an object to be molded in a vacuum atmosphere, shortens the time required for depressurization, and improves the operating efficiency of a vacuum multistage laminating apparatus. That is the purpose.
【０００９】[0009]
【課題を解決するための手段】上記課題を解決するた
め、第１の発明に係る真空多段積層装置は、固定盤と可
動盤との対向面間に複数の熱板を配置し、被成形物を各
熱板間に挿入して真空雰囲気下で加熱・圧締する真空多
段積層装置において、熱板は、一方の面に設けられた膜
体と、外周に沿って設けられた枠体とを備え、互いに熱
板を近接させたときに前記膜体および前記枠体が隣接す
る熱板との間に被成形物の成形空間を形成し、前記成形
空間を真空雰囲気にした際に前記膜体を熱板に吸着保持
すると共に、前記膜体と隣接する熱板との間で被成形物
を圧締すべく膜体を加圧する吸引・加圧手段を備えたこ
とを特徴とするものである。In order to solve the above-mentioned problems, a vacuum multi-stage laminating apparatus according to a first aspect of the present invention has a plurality of hot plates arranged between the facing surfaces of a fixed platen and a movable platen to form an object to be molded. In a vacuum multi-stage laminating apparatus that inserts between each hot plate and heats and clamps in a vacuum atmosphere, the hot plate has a film body provided on one surface and a frame body provided along the outer periphery. And forming a molding space of the object to be molded between the film body and the frame and the adjacent heat plates when the heat plates are brought close to each other, and the film body when the molding space is set to a vacuum atmosphere. And a suction / pressurizing means for pressurizing the film body so as to clamp the object to be molded between the film body and the adjacent hot plate. .
【００１０】また、第２の発明に係る真空多段積層装置
は、上記課題を解決するため、第１の発明において、枠
体の隣接する熱板と対向する面にシール材を設け、互い
に隣接する熱板との間に枠体を挟持した際に、密閉され
た被成形物の成形空間を減圧する吸引手段を成形空間内
に開口するように接続したことを特徴とするものであ
る。In order to solve the above-mentioned problems, the vacuum multi-stage laminating apparatus according to the second aspect of the present invention, in the first aspect of the present invention, is provided with a sealing material on the surface of the frame which faces the adjacent hot plate, and they are adjacent to each other. When the frame is sandwiched between the hot plate and the hot plate, a suction means for reducing the pressure of the sealed molding space of the molding target is connected so as to open in the molding space.
【００１１】[0011]
【発明の実施の形態】本発明に係る真空多段積層装置の
構成の一実施の形態を、図１に基づいて説明する。な
お、図において同一符号は同一部分または相当部分とす
る。BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of the structure of a vacuum multistage laminating apparatus according to the present invention will be described with reference to FIG. The same reference numerals in the drawings denote the same or corresponding parts.
【００１２】本発明に係る真空多段積層装置は、基盤 1
の角隅近傍に立設されたステー 2の上端部に固定盤とし
ての上定盤 3が固定され、基盤 1にはシリンダ 4が形成
され、シリンダ 4にはラム 5が挿通され、ラム 5には上
定盤 3と相対向して可動盤としての可動定盤 6が設けら
れている。上定盤 3と可動定盤 6との相対向する面の間
には、被成形物を加熱圧締するための複数の熱板 7が所
定の間隔を有するように支持されている。シリンダ 4に
は、ラム 5を伸長駆動して所定位置に保持するための作
動油の給排管（図示を省略した）が接続される。The vacuum multi-stage laminating apparatus according to the present invention comprises a substrate 1
The upper surface plate 3 as a fixed plate is fixed to the upper end of the stay 2 which is erected near the corners of the base plate, the cylinder 1 is formed on the base plate 1, the ram 5 is inserted through the cylinder 4, and the ram 5 is inserted. Is provided with a movable platen 6 as a movable plate opposite to the upper platen 3. Between the surfaces of the upper surface plate 3 and the movable surface plate 6 facing each other, a plurality of hot plates 7 for heating and pressing the object to be molded are supported so as to have predetermined intervals. The cylinder 4 is connected to a supply / discharge pipe (not shown) of hydraulic oil for driving the ram 5 to extend and hold it at a predetermined position.
【００１３】各熱板 7は、熱伝導率の優れた鋼等を略矩
形のブロック状に形成したものからなり、その内部には
被成形物の加熱手段として熱油等の温調流体を流通させ
る流路10が形成されている。なお、この温調流体流路10
の代りに電気ヒータ等を設けることもできる。この実施
の形態の場合、熱板 7の上面7aは平滑に形成され、熱板
7の下面7bには金網や布、紙等の通気性を有するシート
状の部材11を介して、耐熱性、可撓性および伸縮性を有
するゴム等からなる膜体12が配置されており、通気性シ
ート状部材11および膜体12の周縁部はボルト13によって
取付けられた枠体14によって固定されている。枠体14の
下方に位置する隣接した熱板 7の上面7aと対向する面、
すなわち下面には、Ｏリング等のシール材15が設けられ
ている。ラム 5の伸長駆動によって上下に隣接する熱板
7を互いに重合させた際に、膜体12と枠体14と下方に隣
接する熱板 7の上面7aとによって被成形物Ｈの成形空間
Ｓが形成される。Each hot plate 7 is made of steel or the like having a high thermal conductivity and is formed in a substantially rectangular block shape, and a temperature control fluid such as hot oil is circulated therein as a heating means for the object to be molded. A flow path 10 is formed. In addition, this temperature control fluid flow path 10
Alternatively, an electric heater or the like may be provided. In the case of this embodiment, the upper surface 7a of the hot plate 7 is formed smooth and
A film body 12 made of rubber or the like having heat resistance, flexibility and stretchability is arranged on the lower surface 7b of 7 through a sheet-like member 11 having air permeability such as a wire mesh, cloth, and paper, Peripheries of the breathable sheet-like member 11 and the film body 12 are fixed by a frame body 14 attached by bolts 13. A surface facing the upper surface 7a of the adjacent heat plate 7 located below the frame body 14,
That is, a sealing material 15 such as an O-ring is provided on the lower surface. Heat plates vertically adjacent to each other by extension drive of ram 5
When 7 is polymerized with each other, the molding space S of the object to be molded H is formed by the film body 12, the frame body 14 and the upper surface 7a of the hot plate 7 which is adjacent below.
【００１４】各熱板 7はさらに、成形空間Ｓを減圧する
ための吸引通路16が上面7aに開口するように形成され、
また、膜体12を熱板 7に対して密着・離間操作するため
の吸引・加圧通路17が熱板 7の下面7bに開口するように
形成されている。膜体12を密着・離間操作するための作
動流体は、吸引・加圧通路から通気性シート状部材11を
介して膜体12の全面にわたるように供給され、または膜
体12の全面から排出される。なお、最上位置の熱板7A
は、断熱材18を介して上定盤 3に支持され、吸引通路16
の形成が省略されている。また、最下位置の熱板7Bは、
断熱材19を介して可動定盤 6に支持され、通気性シート
状部材11と膜体12と枠体14の取付け、および吸引・加圧
通路17の形成が省略されている。Each hot plate 7 is further formed so that a suction passage 16 for depressurizing the molding space S is opened to the upper surface 7a,
Further, a suction / pressurization passage 17 for closely contacting / separating the film body 12 with respect to the hot plate 7 is formed so as to open to the lower surface 7b of the hot plate 7. The working fluid for closely contacting / separating the membrane body 12 is supplied from the suction / pressurization passage through the breathable sheet-like member 11 so as to cover the entire membrane body 12, or is discharged from the entire membrane body 12. It In addition, the hot plate 7A at the uppermost position
Is supported by the upper surface plate 3 through the heat insulating material 18, and the suction passage 16
Formation is omitted. Also, the hot plate 7B at the lowest position is
The breathable sheet-like member 11, the film body 12, and the frame body 14 are attached to the movable surface plate 6 via the heat insulating material 19, and the suction / pressurization passage 17 is not formed.
【００１５】被成形物の成形空間Ｓを減圧するための手
段としては、以下のように構成されている。すなわち、
各熱板 7の吸引通路16は、脱気管路30と３ポート２位置
型の電磁切替弁31とを介して真空ポンプ32に接続されて
いる。電磁切替弁31にはフィルタ33が接続されており、
吸引通路16は電磁切替弁31が励磁されていないときにフ
ィルタ33を介して大気に連通している。The means for reducing the pressure of the molding space S of the object to be molded is constructed as follows. That is,
The suction passage 16 of each heating plate 7 is connected to a vacuum pump 32 via a degassing pipe 30 and a 3-port 2-position electromagnetic switching valve 31. A filter 33 is connected to the electromagnetic switching valve 31,
The suction passage 16 communicates with the atmosphere via the filter 33 when the electromagnetic switching valve 31 is not excited.
【００１６】また、成形空間Ｓを真空雰囲気にした際に
膜体14を熱板 7に吸着保持すると共に、膜体 7と隣接す
る熱板 7との間で被成形物Ｈを圧締すべく膜体14を加圧
するための吸引・加圧手段は、以下のように構成されて
いる。すなわち、各熱板 7の吸引・加圧通路17は、加圧
流体供給管路35と２ポート２位置型の電磁切替弁36およ
び加圧圧力調整可能な減圧弁37とを介して加圧流体源38
に接続されると共に、吸引管路39と２ポート２位置型の
電磁切替弁40とを介して真空ポンプ32に接続されてい
る。さらに、各熱板 7の吸引・加圧通路17は、２ポート
２位置型の電磁切替弁41を介して大気に連通するフィル
タ42が接続されている。電磁切替弁36と減圧弁37との間
には加圧流体の圧力、すなわち膜体12の加圧圧力を検知
するための圧力計43が設けられ、電磁切替弁40と真空ポ
ンプ32との間には減圧圧力、すなわち各熱板の膜体の吸
引力を検知するための圧力計44が設けられている。一般
的に加圧流体源38としてはエアコンプレッサが用いられ
る、すなわち膜体12を熱板 7から離間するように加圧す
るための加圧作動流体としては空気が用いられるが、空
気以外の加圧流体として所定温度に調整された水や油を
用いることも可能である。なお、この実施の形態におい
ては、各熱板 7の吸引・加圧通路17に共通の電磁切替弁
36および圧力調整可能な減圧弁37をそれぞれ接続した例
によって説明したが、これに限定されることなく、各成
形空間Ｓ毎に加圧圧力を調整し、各膜体12毎に加圧圧力
を調整することができるように、例えば各熱板 7毎に電
磁切替弁36および圧力調整可能な減圧弁37をそれぞれ接
続することもできる。Further, when the molding space S is set in a vacuum atmosphere, the film body 14 is adsorbed and held on the hot plate 7, and the object H to be molded is clamped between the film body 7 and the adjacent hot plate 7. The suction / pressurizing means for pressurizing the film body 14 is configured as follows. That is, the suction / pressurization passage 17 of each hot plate 7 is supplied with the pressurized fluid via the pressurized fluid supply pipeline 35, the 2-port 2-position electromagnetic switching valve 36 and the pressure reducing valve 37 capable of adjusting the pressure. Source 38
And a vacuum pump 32 via a suction conduit 39 and a 2-port 2-position electromagnetic switching valve 40. Further, the suction / pressurization passage 17 of each hot plate 7 is connected to a filter 42 which communicates with the atmosphere via a 2-port 2-position electromagnetic switching valve 41. Between the electromagnetic switching valve 36 and the pressure reducing valve 37, a pressure gauge 43 for detecting the pressure of the pressurized fluid, that is, the pressure applied to the membrane 12, is provided, and between the electromagnetic switching valve 40 and the vacuum pump 32. A pressure gauge 44 for detecting the depressurized pressure, that is, the suction force of the film body of each hot plate is provided therein. Generally, an air compressor is used as the pressurized fluid source 38, that is, air is used as the pressurized working fluid for pressurizing the film body 12 away from the hot plate 7. It is also possible to use water or oil adjusted to a predetermined temperature as the fluid. In this embodiment, a solenoid switching valve common to the suction / pressurization passages 17 of each hot plate 7 is used.
Although the example in which the pressure control valve 36 and the pressure reducing valve 37 capable of adjusting the pressure are respectively connected has been described, the pressure is not limited to this, the pressure is adjusted for each molding space S, and the pressure is adjusted for each film body 12. In order to be adjustable, for example, an electromagnetic switching valve 36 and a pressure adjustable pressure reducing valve 37 may be connected to each hot plate 7.
【００１７】次に、上述のように構成された本発明に係
る真空多段積層装置の作動を、被成形物Ｈとして図４に
示すような階段状の窪みを有する基板を成形する場合に
よって、図に基づいて説明する。成形開始前の熱板 7
は、図１に示すように、互いに所定の間隔を有するよう
に支持されている。最初に、膜体12が被成形物Ｈに接触
しないように、電磁切替弁40を励磁して真空ポンプ32に
よって吸引・加圧通路17を介して膜体12を吸引して熱板
7に密着させる。この状態で各熱板 7間に被成形物Ｈを
挿入してラム 5を伸長駆動し、各熱板 7を上昇させて互
いに重合させる。上下に隣接する熱板 7が互いに重合さ
れると、熱板 7の下面7aの下方に設けられた枠体14のシ
ール材15が下方に隣接する熱板 7の上面7aに当接するこ
とによって、密閉された成形空間Ｓが形成される。Next, the operation of the vacuum multi-stage laminating apparatus according to the present invention configured as described above will be described depending on the case where a substrate having stepwise depressions as shown in FIG. It will be described based on. Hot plate before forming 7
Are supported so as to have a predetermined distance from each other, as shown in FIG. First, in order to prevent the film body 12 from coming into contact with the object H to be molded, the electromagnetic switching valve 40 is excited and the vacuum pump 32 sucks the film body 12 through the suction / pressurization passage 17 to heat the hot plate.
Stick to 7. In this state, the object H to be molded is inserted between the hot plates 7 to drive the ram 5 to extend, and the hot plates 7 are raised to be polymerized with each other. When the vertically adjacent hot plates 7 are overlapped with each other, the sealing material 15 of the frame 14 provided below the lower surface 7a of the hot plate 7 comes into contact with the upper surface 7a of the hot plate 7 adjacent to the lower side, A closed molding space S is formed.
【００１８】成形空間Ｓが形成されると、図２の矢印で
示すように、電磁切替弁31を励磁して真空ポンプ32によ
って吸引通路16を介して各成形空間Ｓ内を減圧する。こ
の減圧状態は所定時間保持され、被成形物Ｈを収容した
成形空間Ｓ内は充分脱気される。When the molding space S is formed, the electromagnetic switching valve 31 is excited to depressurize the inside of each molding space S via the suction passage 16 by the vacuum pump 32, as shown by the arrow in FIG. This depressurized state is maintained for a predetermined time, and the interior of the molding space S containing the molding target H is sufficiently deaerated.
【００１９】成形空間Ｓ内が充分脱気されると、図３に
示すように、電磁切替弁40を解磁して熱板 7への膜体12
の密着を解除すると共に電磁切替弁41を励磁して吸引・
加圧通路17を大気に接続する。膜体12は、成形空間Ｓに
作用する減圧力によって、被成形物Ｈの階段状の窪みに
適合して密着し、被成形物Ｈを圧締する。さらに高い圧
締力を必要とする場合には、図３に矢印で示すように、
電磁切替弁41を解磁すると共に電磁切替弁36を励磁し、
減圧弁37を介してエアコンプレッサ38からの圧縮空気を
所定の圧力で各熱板 7の吸引・加圧通路17に供給し、膜
体12に加圧力を作用させる。被成形物Ｈは、圧締される
と同時に各熱板 7の内部に形成された加熱手段10によっ
て加熱され、積層成形される。When the inside of the forming space S is sufficiently degassed, as shown in FIG. 3, the electromagnetic switching valve 40 is demagnetized and the film 12 on the heating plate 7 is demagnetized.
Is released and the electromagnetic switching valve 41 is excited to
The pressure passage 17 is connected to the atmosphere. The film body 12 conforms to the step-like depression of the molding target H and is brought into close contact with the molding space S by the depressurizing force, and presses the molding target H. When a higher clamping force is required, as shown by the arrow in FIG. 3,
Demagnetize the electromagnetic switching valve 41 and excite the electromagnetic switching valve 36,
Compressed air from the air compressor 38 is supplied to the suction / pressurization passage 17 of each hot plate 7 through the pressure reducing valve 37 at a predetermined pressure, and a pressure is applied to the film body 12. The object to be molded H is pressed and simultaneously heated by the heating means 10 formed inside each hot plate 7 to be laminated and molded.
【００２０】成形を完了した後は、膜体12による被成形
物Ｈの圧締を解除すべく、電磁切替弁36を解磁すると共
にフィルタ42が接続された電磁切替弁41を励磁して各熱
板 7の吸引・加圧通路17を大気に接続し、膜体12を加圧
している圧縮空気を放出する。その後、電磁切替弁40を
励磁して膜体12を熱板 7に密着させる。またこれと同時
に、電磁切替弁31を解磁してフィルタ33を介して減圧さ
れていた成形空間Ｓを大気に連通する。そして、ラム 5
を退縮駆動して熱板 7を互いに離間させ、積層された被
成形物Ｈを取り出す。After the molding is completed, the electromagnetic switching valve 36 is demagnetized and the electromagnetic switching valve 41 to which the filter 42 is connected is excited to release the pressure of the object H to be molded by the film body 12. The suction / pressurization passage 17 of the heating plate 7 is connected to the atmosphere, and the compressed air that pressurizes the film body 12 is discharged. Then, the electromagnetic switching valve 40 is excited to bring the film body 12 into close contact with the hot plate 7. At the same time, the electromagnetic switching valve 31 is demagnetized and the molding space S, which has been depressurized through the filter 33, communicates with the atmosphere. And ram 5
Is driven to retreat to separate the hot plates 7 from each other, and the stacked objects H to be molded are taken out.
【００２１】なお、この実施の形態においては、熱板 7
の上面7aを平滑に形成し、下面7bに膜体12を配置した例
によって説明したが、これに限定されることなく、熱板
7の下面7bを平滑に形成し、上面7aに膜体12を配置する
こともできる。また、熱板 7の膜体12が配置される面と
反対面は、平滑面に形成されることに限定されることな
く、被成形物Ｈに対応した形状に形成してもよく、さら
に、被成形物に応じた型を設けることもできる（図示は
省略した）。In this embodiment, the hot plate 7
Although the upper surface 7a is formed to be smooth and the film body 12 is arranged on the lower surface 7b, the heat plate is not limited to this.
It is also possible to form the lower surface 7b of 7 smooth and arrange the film body 12 on the upper surface 7a. Further, the surface of the heat plate 7 opposite to the surface on which the film body 12 is arranged is not limited to be formed as a smooth surface, and may be formed in a shape corresponding to the molding target H. It is also possible to provide a mold according to the object to be molded (not shown).
【００２２】さらに、この実施の形態においては、被成
形物Ｈを真空雰囲気下で加熱・圧締するために、枠体14
に設けられたシール材15によって、下方に隣接する熱板
7の上面7aとの間に密閉された成形空間Ｓを形成し、こ
の成形空間Ｓに開口する吸引通路16を介して成形空間Ｓ
内を減圧する例によって説明したが、これに限定される
ことなく、装置全体を収容するチャンバを設け、このチ
ャンバ内に開口するように脱気管路30を接続してもよ
い。Further, in this embodiment, in order to heat and press the article H to be molded in a vacuum atmosphere, the frame 14
By the sealing material 15 provided on the
A molding space S that is closed is formed between the upper surface 7a of the molding space 7 and the molding space S through a suction passage 16 that opens into the molding space S.
Although an example of depressurizing the inside has been described, the present invention is not limited to this, and a chamber for accommodating the entire apparatus may be provided, and the degassing pipeline 30 may be connected so as to open in the chamber.
【００２３】[0023]
【発明の効果】第１の発明に係る真空多段積層装置によ
れば、窪みを有するような平坦でない被成形物のよう
に、その形状に影響されることなく積層成形を均一かつ
確実に行うことができる。また、階段状の窪みを有する
ような被成形物を積層成形する場合においても、一工程
で積層成形を行うことができ、真空多段積層装置の成形
効率の向上を図ることができる。According to the vacuum multi-stage laminating apparatus according to the first aspect of the present invention, it is possible to perform the laminating and molding uniformly and surely without being influenced by the shape of a non-flat molded object having a depression. You can In addition, even in the case of laminating a molded object having a stepped depression, the laminating molding can be performed in one step, and the molding efficiency of the vacuum multistage laminating apparatus can be improved.
【００２４】また、第２の発明に係る真空多段積層装置
によれば、被成形物を真空雰囲気下で積層成形するため
の構造や付帯設備の簡略化を図ると共に、減圧に要する
時間の短縮化を図り、真空多段積層装置の稼働効率の向
上を図ることができる等の効果を奏することができる。Further, according to the vacuum multi-stage laminating apparatus of the second invention, the structure and auxiliary equipment for laminating and molding an object to be molded in a vacuum atmosphere can be simplified and the time required for decompression can be shortened. Therefore, it is possible to achieve the effect that the operation efficiency of the vacuum multi-stage laminating apparatus can be improved.
【図１】本発明に係る真空多段積層装置を示す概略断面
図である。FIG. 1 is a schematic sectional view showing a vacuum multi-stage laminating apparatus according to the present invention.
【図２】本発明に係る真空多段積層装置において、ラム
を上昇させて隣接する熱板を当接して成形空間を形成し
た状態を示す部分拡大断面図である。FIG. 2 is a partially enlarged cross-sectional view showing a state in which a ram is raised and adjacent hot plates are brought into contact with each other to form a molding space in the vacuum multi-stage laminating apparatus according to the present invention.
【図３】図２の状態から膜体を加圧して被成形品を加圧
・圧締する状態を示す説明図である。FIG. 3 is an explanatory diagram showing a state in which the film body is pressed from the state of FIG. 2 to press and clamp the molded product.
【図４】階段状の窪みを有する基板を示す概略断面図で
ある。FIG. 4 is a schematic cross-sectional view showing a substrate having stepped depressions.
3 上定盤 6 可動定盤 7 熱板 12 膜体 14 枠体 15 シール材 32 真空ポンプ 38 エアコンプレッサ 3 Upper surface plate 6 Movable surface plate 7 Heat plate 12 Membrane body 14 Frame body 15 Sealant 32 Vacuum pump 38 Air compressor
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｂ２９Ｌ 31:34─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl.6 Identification code Internal reference number FI technical display location B29L 31:34
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23609995AJP3243594B2 (en) | 1995-08-22 | 1995-08-22 | Vacuum multi-stage laminating equipment |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23609995AJP3243594B2 (en) | 1995-08-22 | 1995-08-22 | Vacuum multi-stage laminating equipment |
| Publication Number | Publication Date |
|---|---|
| JPH0957779Atrue JPH0957779A (en) | 1997-03-04 |
| JP3243594B2 JP3243594B2 (en) | 2002-01-07 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23609995AExpired - Fee RelatedJP3243594B2 (en) | 1995-08-22 | 1995-08-22 | Vacuum multi-stage laminating equipment |
| Country | Link |
|---|---|
| JP (1) | JP3243594B2 (en) |
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| US8746311B1 (en) | 2005-08-30 | 2014-06-10 | Rockwell Collins, Inc. | System and method for completing lamination of rigid-to-rigid substrate by the controlled application of pressure |
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| US9573327B2 (en) | 2008-01-18 | 2017-02-21 | Rockwell Collins, Inc. | Planarization treatment of pressure sensitive adhesive for rigid-to-rigid substrate lamination |
| US8118075B2 (en) | 2008-01-18 | 2012-02-21 | Rockwell Collins, Inc. | System and method for disassembling laminated substrates |
| US7814676B2 (en) | 2008-01-18 | 2010-10-19 | Rockwell Collins, Inc. | Alignment system and method thereof |
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| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |