【０００１】[0001]
【産業上の利用分野】この発明は、電子内視鏡の先端部
などの微小スペース部分に配置されて用いられる、固体
撮像素子とその周辺回路素子からなる固体撮像装置に関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solid-state image pickup device composed of a solid-state image pickup element and its peripheral circuit elements, which is arranged and used in a minute space portion such as a tip portion of an electronic endoscope.
【０００２】[0002]
【従来の技術】従来、電子内視鏡の先端部などの微小ス
ペース部分に配置されて用いられる固体撮像装置として
は、例えば特開昭６３−２８９９４３号には、図５に示
すような構成のものが開示されている。図５において、
101 は固体撮像素子で、該固体撮像素子101 は撮像素子
基板102 上にダイボンディングされており、該撮像素子
基板102 には、固体撮像素子101 がダイボンディングさ
れている面と対向する面に対して垂直方向にリード103
が引き出されている。そして、リード103 の基端部と固
体撮像素子101 とはボンディングワイヤ104 で接続され
ており、また固体撮像素子101 の受光面にはカラーフィ
ルタ105 が配設されており、該カラーフィルタ105 及び
ボンディングワイヤ104 部分を含め表面全体が透光性封
止樹脂106で封止されている。更に、周辺回路107 が搭
載されている回路基板108 が、その長手方向が前記リー
ド103 の引き出し方向と同一になるようにして、その一
端がリード103 の引き出し部に、ハンダ等の導電部材10
9 で接続されている。また、回路基板108 の他端には信
号ケーブル110 が導電部材109 で接続されている。2. Description of the Related Art Conventionally, as a solid-state image pickup device arranged and used in a minute space portion such as a distal end portion of an electronic endoscope, for example, Japanese Patent Laid-Open No. 63-289943 has a structure shown in FIG. Things are disclosed. In FIG.
Reference numeral 101 denotes a solid-state image pickup element, which is die-bonded on an image pickup element substrate 102. The image pickup element substrate 102 has a surface opposite to the surface on which the solid-state image pickup element 101 is die-bonded. Vertical lead 103
Has been pulled out. The base end of the lead 103 and the solid-state image sensor 101 are connected by a bonding wire 104, and a color filter 105 is disposed on the light-receiving surface of the solid-state image sensor 101. The entire surface including the wire 104 is sealed with a translucent sealing resin 106. Further, the circuit board 108 on which the peripheral circuit 107 is mounted is arranged such that the longitudinal direction thereof is the same as the lead-out direction of the lead 103, and one end thereof is placed in the lead-out portion of the lead 103 and the conductive member 10 such as solder.
Connected at 9. A signal cable 110 is connected to the other end of the circuit board 108 by a conductive member 109.
【０００３】このように構成された固体撮像装置におい
ては、固体撮像素子101 の受光面側から見たときの撮像
素子基板102 の面積内に、周辺回路素子を配置すること
が可能であり、電子内視鏡の撮像ユニットとして、その
先端部に組み込まれて使用される場合には、電子内視鏡
の細径化を図ることができる。In the solid-state image pickup device having such a configuration, it is possible to arrange the peripheral circuit elements within the area of the image pickup element substrate 102 as viewed from the light receiving surface side of the solid-state image pickup element 101. When the electronic endoscope is used by being incorporated in the distal end portion thereof as an imaging unit of the endoscope, it is possible to reduce the diameter of the electronic endoscope.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、上記従
来の固体撮像装置においては、固体撮像素子をリード付
きの撮像素子基板に搭載した後、別工程で作成された信
号処理部等の周辺回路素子を搭載した回路基板を接続
し、更に回路基板に信号ケーブルを接続しなければなら
ない。したがって接続工数が増大し、接続点数の増加に
伴う品質の低下を招いていた。また、撮像素子基板と回
路基板との接続部、あるいは回路基板と信号ケーブルの
接続部が、撮像素子基板の側面より突出し、受光面より
見た面積を増大させてしまうおそれもあり、更には、回
路基板が固体撮像素子の受光面に対して垂直方向に接続
されているため、長手方向の寸法が大となり、電子内視
鏡の撮像ユニットとして用いた場合、電子内視鏡の先端
部の硬性部の長さが長くなってしまうという問題点があ
った。However, in the above-mentioned conventional solid-state image pickup device, after mounting the solid-state image pickup element on the image pickup element substrate with leads, the peripheral circuit elements such as the signal processing section created in a separate process are mounted. It is necessary to connect the mounted circuit board and then connect the signal cable to the circuit board. Therefore, the number of connection steps is increased, and the quality is deteriorated as the number of connection points is increased. Further, the connection portion between the image pickup element substrate and the circuit board, or the connection portion between the circuit board and the signal cable may protrude from the side surface of the image pickup element substrate and increase the area viewed from the light receiving surface. Since the circuit board is connected in the direction perpendicular to the light receiving surface of the solid-state image sensor, the size in the longitudinal direction becomes large, and when used as an image pickup unit of an electronic endoscope, the rigidity of the tip part of the electronic endoscope is increased. There was a problem that the length of the section became long.
【０００５】本発明は、従来の固体撮像装置における上
記問題点を解消するためになされたもので、請求項１記
載の発明は、固体撮像素子の受光面から見た面積を増大
させることなく、信号ケーブルの接続が可能で、且つ接
続部を少なくして組立て工数を低減した高信頼性の固体
撮像装置を提供することを目的とする。また請求項２記
載の発明は、固体撮像素子の受光面に対して垂直方向の
寸法を低減した固体撮像装置を提供することを目的と
し、また請求項３記載の発明は、固体撮像素子の受光面
に対して垂直方向の寸法を低減すると共に、周辺回路素
子を高密度に実装可能な固体撮像装置を提供することを
目的とする。The present invention has been made to solve the above problems in the conventional solid-state image pickup device, and the invention according to claim 1 does not increase the area viewed from the light receiving surface of the solid-state image pickup element. An object of the present invention is to provide a highly reliable solid-state imaging device capable of connecting a signal cable and reducing the number of connecting portions to reduce the number of assembling steps. A second aspect of the invention is to provide a solid-state image pickup device having a reduced size in a direction perpendicular to the light-receiving surface of the solid-state image pickup element. It is an object of the present invention to provide a solid-state imaging device capable of reducing the size in the direction perpendicular to the surface and mounting peripheral circuit elements at high density.
【０００６】[0006]
【課題を解決するための手段及び作用】上記問題点を解
決するため、請求項１記載の発明は、固体撮像素子と、
該固体撮像素子に電気的に接続された周辺回路素子と
を、同一基板上に搭載した固体撮像装置において、前記
基板の固体撮像素子が搭載されている基板面に対して直
角方向の面のうち少なくとも一つの面に段差部を設け、
該段差部に信号ケーブル接続用の電極を配置するもので
ある。In order to solve the above problems, the invention according to claim 1 provides a solid-state image pickup device,
In a solid-state imaging device in which a peripheral circuit element electrically connected to the solid-state imaging device is mounted on the same substrate, among the planes of the substrate in a direction perpendicular to the substrate surface on which the solid-state imaging device is mounted. Provide a step on at least one surface,
An electrode for connecting a signal cable is arranged on the step portion.
【０００７】このように基板に段差部を設けて信号ケー
ブル接続用電極を配置しているので、固体撮像素子の受
光面側から見た面積を増大させることなく、信号ケーブ
ルの接続が可能となり、また固体撮像素子を搭載した同
一基板上に周辺回路素子を搭載し、基板に直接信号ケー
ブルを接続するようにしているので、接続部が少なくな
り組立て工数を低減することが可能となる。Since the signal cable connecting electrodes are arranged by providing the stepped portion on the substrate as described above, the signal cable can be connected without increasing the area viewed from the light receiving surface side of the solid-state image pickup element. Further, since the peripheral circuit element is mounted on the same substrate on which the solid-state image sensor is mounted and the signal cable is directly connected to the substrate, the number of connecting parts is reduced and the number of assembling steps can be reduced.
【０００８】また請求項２記載の発明は、請求項１記載
の固体撮像装置において、周辺回路素子を、基板の固体
撮像素子が搭載されている基板面と反対側の基板面に搭
載するものである。このように周辺回路素子を搭載する
ことにより、固体撮像素子の受光面から見た面積を増大
させず、また受光面に対して垂直方向の寸法も低減する
ことが可能となる。According to a second aspect of the present invention, in the solid-state imaging device according to the first aspect, the peripheral circuit element is mounted on the substrate surface of the substrate opposite to the substrate surface on which the solid-state imaging element is mounted. is there. By mounting the peripheral circuit element in this manner, the area viewed from the light receiving surface of the solid-state imaging device can be prevented from increasing, and the dimension in the direction perpendicular to the light receiving surface can be reduced.
【０００９】また請求項３記載の発明は、請求項１又は
２記載の固体撮像装置において、基板の固体撮像素子が
搭載されている基板面に凹部を設け、該凹部内に周辺回
路素子を配設するものである。このように周辺回路素子
を配設することにより、固体撮像素子の受光面から見た
面積を増大させず、また受光面に対して垂直方向の寸法
も低減しながら、なお且つ周辺回路素子を高密度に実装
することが可能となる。According to a third aspect of the present invention, in the solid-state image pickup device according to the first or second aspect, a concave portion is provided on the surface of the substrate on which the solid-state image pickup element is mounted, and the peripheral circuit element is arranged in the concave portion. Is to be set up. By arranging the peripheral circuit elements in this way, the area viewed from the light receiving surface of the solid-state imaging device is not increased, and the dimension in the direction perpendicular to the light receiving surface is reduced, while the peripheral circuit elements are made high in height. It becomes possible to mount it at a high density.
【００１０】[0010]
【実施例】次に実施例について説明する。図１の（Ａ）
は、本発明に係る固体撮像装置の基本的な実施例の周辺
回路素子の搭載を省略して示す断面図で、図１の（Ｂ）
はその側面図である。図において、１は固体撮像素子
で、該固体撮像素子１は撮像素子基板２の表面にダイボ
ンディングされている。撮像素子基板２の固体撮像素子
搭載面と垂直な面（以下基板側面という）には、段差部
３が形成されていて、段差部３の底部３ａが、基板２の
固体撮像素子搭載面とは反対側の面（以下裏面という）
に連なるような形態となっている。そして段差部３の底
部３ａには、固体撮像装置と他の電気装置とを接続する
信号ケーブルを接続するための電極４が設けられてい
る。EXAMPLES Next, examples will be described. Figure 1 (A)
FIG. 1B is a sectional view showing the basic embodiment of the solid-state imaging device according to the present invention with the peripheral circuit elements not shown, and FIG.
Is a side view thereof. In the figure, 1 is a solid-state image sensor, and the solid-state image sensor 1 is die-bonded to the surface of an image sensor substrate 2. A step portion 3 is formed on a surface of the image pickup element substrate 2 that is perpendicular to the solid-state image pickup element mounting surface (hereinafter referred to as a substrate side surface). Opposite side (hereinafter referred to as back side)
It has a form that is continuous with. An electrode 4 for connecting a signal cable for connecting the solid-state imaging device to another electric device is provided on the bottom portion 3a of the step portion 3.
【００１１】このように基板側面下部に段差部３を設
け、該段差部３の底部３ａに電極４を形成しているの
で、該電極４へ信号ケーブルを接続しても、その接続部
の基板側面から飛び出しを吸収し、固体撮像装置の小型
化を図ることができる。Since the step portion 3 is provided on the lower portion of the side surface of the substrate and the electrode 4 is formed on the bottom portion 3a of the step portion 3 as described above, even if a signal cable is connected to the electrode 4, the substrate of the connection portion is formed. The protrusion from the side surface can be absorbed, and the size of the solid-state imaging device can be reduced.
【００１２】なお、撮像素子基板２に搭載された固体撮
像素子１は従来例と同様に、ボンディングワイヤ５によ
り撮像素子基板２との電気的な接続が行われ、受光面に
はカラーフィルタ６が載置され、そしてカラーフィルタ
６並びに接続部を含む全表面が透光性封止樹脂７で封止
されている。The solid-state image pickup device 1 mounted on the image pickup device substrate 2 is electrically connected to the image pickup device substrate 2 by the bonding wire 5 as in the conventional example, and the color filter 6 is provided on the light receiving surface. The entire surface including the color filter 6 and the connecting portion is mounted and is sealed with a translucent sealing resin 7.
【００１３】図２は、図１に示した構成の固体撮像素子
１を搭載した撮像素子基板２に、周辺回路素子８を搭載
すると共に信号ケーブル９を接続してなる具体的な固体
撮像装置の第１実施例を示す図である。この実施例にお
いては、周辺回路素子８は撮像素子基板２の裏面に搭載
されている。この周辺回路素子８は、固体撮像素子１を
動作させるのに必要な、また出力信号の処理に必要なＩ
Ｃ，抵抗，コンデンサ等からなる。段差部３に設けた電
極４に接続される信号ケーブル９は、ハンダ，導電性接
着剤等の導電部材10により接着される。FIG. 2 shows a concrete solid-state image pickup device in which a peripheral circuit element 8 is mounted and a signal cable 9 is connected to an image pickup element substrate 2 on which the solid-state image pickup element 1 having the structure shown in FIG. 1 is mounted. It is a figure which shows a 1st Example. In this embodiment, the peripheral circuit element 8 is mounted on the back surface of the image pickup element substrate 2. The peripheral circuit element 8 is necessary for operating the solid-state image sensor 1 and for processing an output signal.
It consists of C, resistance, capacitor, etc. The signal cable 9 connected to the electrode 4 provided on the step portion 3 is adhered by a conductive member 10 such as solder or a conductive adhesive.
【００１４】この実施例においては、固体撮像素子１の
受光面にカラーフィルタ６を貼り付けたものを示してい
るが、固体撮像素子自体の表面にカラーフィルタが内蔵
されている場合、あるいはカラー化が不要な場合等にお
いては、カラーフィルタ６は必ずしも必要ではなく省く
ことができる。また、この実施例では透光性封止樹脂７
で、固体撮像素子１の周辺部、カラーフィルタ６の上
面、ボンディングワイヤ５の接続部等を封止するように
したものを示しているが、固体撮像素子１，カラーフィ
ルタ６，ボンディングワイヤ５の周辺に空間を設けて封
止する気密封止態様をとることもできる。In this embodiment, the color filter 6 is attached to the light receiving surface of the solid-state image pickup device 1, but when the color filter is built in the surface of the solid-state image pickup device itself, or when the solid-state image pickup device is colored. In the case where is unnecessary, the color filter 6 is not always necessary and can be omitted. In addition, in this embodiment, the translucent sealing resin 7
In the figure, the peripheral portion of the solid-state image sensor 1, the upper surface of the color filter 6, the connection portion of the bonding wire 5 and the like are shown sealed. It is also possible to adopt an airtight sealing mode in which a space is provided around the periphery for sealing.
【００１５】このように構成した第１実施例において
は、一般に電極と信号ケーブルの接続個所においては必
ず厚みのある接続部が形成されるが、撮像素子基板２の
側面下部に段差部３を形成して、その底部３ａに電極４
を設けて信号ケーブル９を接続するようにしているの
で、接続部が段差部３内に収納され、撮像素子基板２の
表面から見た面積の増加を防止することができる。ま
た、周辺回路素子８を撮像素子基板２の裏面に搭載して
いるので、別途回路基板を接続した従来例に比べ、固体
撮像素子１の受光面に対する垂直方向の寸法を短くする
ことができる。更に、周辺回路素子を搭載する回路基板
を不要とするため、接続個所が低減し作業性の向上及び
信頼性の向上が図れる。したがって、電子内視鏡の撮像
ユニットとして用いた場合、細径化並びに先端部の硬性
部の長さの短縮化を図ることが可能となる。In the first embodiment constructed as described above, generally, a thick connecting portion is always formed at the connecting portion between the electrode and the signal cable, but the step portion 3 is formed on the lower side surface of the image pickup device substrate 2. Then, the electrode 4 is provided on the bottom portion 3a.
Since the signal cable 9 is connected by providing the connection portion, the connection portion is housed in the step portion 3, and it is possible to prevent an increase in the area viewed from the surface of the image pickup element substrate 2. Further, since the peripheral circuit element 8 is mounted on the back surface of the image pickup element substrate 2, the dimension of the solid-state image pickup element 1 in the direction perpendicular to the light receiving surface can be shortened as compared with the conventional example in which a separate circuit board is connected. Further, since the circuit board on which the peripheral circuit element is mounted is not required, the number of connection points can be reduced, and the workability and the reliability can be improved. Therefore, when it is used as an image pickup unit of an electronic endoscope, it is possible to reduce the diameter and shorten the length of the rigid portion at the distal end.
【００１６】次に、具体的な第２実施例を図３に基づい
て説明する。この実施例は、撮像素子基板２の両側面下
部に段差部３−１，３−２を形成し、その底部に電極４
−１，４−２を設けて、それぞれ信号ケーブル９−１，
９−２を接続するように構成したもので、他の構成は図
２に示した第１実施例と同一である。Next, a concrete second embodiment will be described with reference to FIG. In this embodiment, step portions 3-1 and 3-2 are formed on the lower portions of both side surfaces of the image pickup device substrate 2, and an electrode 4 is formed on the bottom portion thereof.
-1, 4-2 are provided, and the signal cables 9-1,
9-2 is connected, and the other structure is the same as that of the first embodiment shown in FIG.
【００１７】このように構成した第２実施例において
は、撮像素子基板２の両側面より信号ケーブルを取り出
せるようにしているので、数多くの信号ケーブルの接続
が可能であり、また段差部底部に設ける電極のサイズピ
ッチを大きくすることができるため、作業効率を改善す
ることができる。なお、段差部は撮像素子基板２の両側
面だけでなく、更に他の側面にも設けることができる。In the second embodiment constructed as described above, since the signal cables can be taken out from both side surfaces of the image pickup device substrate 2, many signal cables can be connected, and the signal cables can be provided at the bottom of the step portion. Since the size pitch of the electrodes can be increased, work efficiency can be improved. The step portion can be provided not only on both side surfaces of the image pickup element substrate 2 but also on other side surfaces.
【００１８】次に、第３実施例を図４に基づいて説明す
る。この実施例は、撮像素子基板２の表面に凹部２ａを
形成し、該凹部２ａ内に周辺回路素子８を搭載し、該凹
部２ａの縁部をベースにして固体撮像素子１を搭載する
ようにしたものであり、他の構成は図２に示した第１実
施例と同様である。この実施例においては、周辺回路素
子８がＩＣチップの場合であっても、撮像素子基板２の
凹部２ａ内は固体撮像素子１により気密性が保たれるの
で、凹部２ａ内の空間には必ずしも封止樹脂の充填は必
要ではない。Next, a third embodiment will be described with reference to FIG. In this embodiment, the concave portion 2a is formed on the surface of the image pickup element substrate 2, the peripheral circuit element 8 is mounted in the concave portion 2a, and the solid-state image pickup element 1 is mounted based on the edge of the concave portion 2a. The other structure is the same as that of the first embodiment shown in FIG. In this embodiment, even when the peripheral circuit element 8 is an IC chip, the solid-state image sensor 1 keeps the airtightness inside the recess 2a of the image sensor substrate 2, so that the space inside the recess 2a is not always required. No filling of the sealing resin is necessary.
【００１９】このように構成した第３実施例において
は、周辺回路素子を撮像素子基板表面に形成した凹部内
に搭載するようにしているので、より小型化が図られ
る。また周辺回路素子の数が多い場合には、撮像素子基
板裏面も周辺回路素子の搭載面として利用可能であり、
小型で高密度実装の固体撮像装置が実現できる。In the third embodiment thus constructed, the peripheral circuit element is mounted in the recess formed on the surface of the image pickup element substrate, so that the size can be further reduced. When the number of peripheral circuit elements is large, the back surface of the image pickup element substrate can also be used as a mounting surface for the peripheral circuit elements.
A compact and high-density mounting solid-state imaging device can be realized.
【００２０】[0020]
【発明の効果】以上実施例に基づいて説明したように、
請求項１記載の発明によれば、固体撮像素子の受光面側
から見た面積を増大させることなく信号ケーブルの接続
が可能で、しかも周辺回路素子搭載用の回路基板が不要
であり、小型で信頼性の高い固体撮像装置が得られる。
また請求項２記載の発明によれば、固体撮像素子の受光
面に対して垂直方向の寸法を低減した固体撮像装置が得
られ、また請求項３記載の発明によれば、周辺回路素子
を高密度に実装可能な固体撮像装置が得られる。As described above on the basis of the embodiments,
According to the invention described in claim 1, the signal cable can be connected without increasing the area viewed from the light receiving surface side of the solid-state image pickup element, and the circuit board for mounting the peripheral circuit element is not required, which is small in size. A solid-state imaging device with high reliability can be obtained.
According to the invention described in claim 2, a solid-state imaging device having a reduced size in the direction perpendicular to the light receiving surface of the solid-state imaging device can be obtained. A solid-state imaging device that can be mounted at high density can be obtained.
【図１】本発明に係る固体撮像装置の基本的な実施例を
示す断面図及び側面図である。FIG. 1 is a sectional view and a side view showing a basic embodiment of a solid-state imaging device according to the present invention.
【図２】本発明の具体的な第１実施例を示す断面図であ
る。FIG. 2 is a sectional view showing a concrete first embodiment of the present invention.
【図３】本発明の第２実施例を示す断面図である。FIG. 3 is a sectional view showing a second embodiment of the present invention.
【図４】本発明の第３実施例を示す断面図である。FIG. 4 is a sectional view showing a third embodiment of the present invention.
【図５】従来の固体撮像装置の構成例を示す断面図であ
る。FIG. 5 is a cross-sectional view showing a configuration example of a conventional solid-state imaging device.
１ 固体撮像素子 ２ 撮像素子基板 ２ａ 凹部 ３，３−１，３−２ 段差部 ３ａ 底部 ４，４−１，４−２ 電極 ５ ボンディイグワイヤ ６ カラーフィルタ ７ 透光性封止樹脂 ８ 周辺回路素子 ９，９−１，９−２ 信号ケーブル 10 導電部材 DESCRIPTION OF SYMBOLS 1 Solid-state image sensor 2 Image sensor substrate 2a Recessed part 3,3-1,3-2 Step part 3a Bottom part 4,4-1,4-2 Electrode 5 Bonding wire 6 Color filter 7 Translucent sealing resin 8 Peripheral circuit Element 9, 9-1, 9-2 Signal cable 10 Conductive member
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6308437AJPH08146310A (en) | 1994-11-18 | 1994-11-18 | Solid-state image pickup device |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6308437AJPH08146310A (en) | 1994-11-18 | 1994-11-18 | Solid-state image pickup device |
| Publication Number | Publication Date |
|---|---|
| JPH08146310Atrue JPH08146310A (en) | 1996-06-07 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6308437AWithdrawnJPH08146310A (en) | 1994-11-18 | 1994-11-18 | Solid-state image pickup device |
| Country | Link |
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| JP (1) | JPH08146310A (en) |
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