【０００１】[0001]
【産業上の利用分野】本発明はＬＥＤ（発光ダイオー
ド）を光源とする照明に係り、特に主として液晶、文字
盤等のバックライトに使用されるＬＥＤ照明に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an illumination using an LED (light emitting diode) as a light source, and more particularly to an LED illumination mainly used for a backlight of liquid crystal, dial, etc.
【０００２】[0002]
【従来の技術】液晶、文字盤等のバックライト用の光源
にはＥＬ、冷陰極線管、ＬＥＤ等が知られているが、Ｌ
ＥＤは白色光源となる青色光が実現されていなかったの
で、従来では専らＥＬ、冷陰極線管が用いられてきた。
しかしながら、最近、青色ＬＥＤが実用化されたことに
より、ＬＥＤに三原色揃い、白色光源としてのＬＥＤ照
明が注目されてきた。2. Description of the Related Art EL, cold cathode ray tubes, LEDs, etc. are known as light sources for backlights such as liquid crystals and dials.
Since blue light, which is a white light source, has not been realized in the ED, conventionally, an EL and a cold cathode ray tube have been exclusively used.
However, recently, due to the practical use of blue LEDs, LED lighting as a white light source has been attracting attention because LEDs have three primary colors.
【０００３】バックライトのような面光源のＬＥＤ照明
は、通常はＬＥＤ素子が基板に装着されてなる光源を、
導光板の端面に密着させた構造を有する。図４は従来の
ＬＥＤ照明の一構造を示す模式的な断面図であり、図５
はそのＬＥＤ照明の平面図である。図４に示すように従
来のＬＥＤ照明は、基板１１に予め形成された孔２２に
ＬＥＤ素子３３が挿入されてなる光源を、導光板４４の
端面に接着剤７７を介して密着させた構造を有してい
る。LED lighting of a surface light source such as a back light is usually a light source in which an LED element is mounted on a substrate.
It has a structure in which it is in close contact with the end surface of the light guide plate. FIG. 4 is a schematic sectional view showing a structure of a conventional LED illumination.
[Fig. 4] is a plan view of the LED illumination. As shown in FIG. 4, the conventional LED illumination has a structure in which a light source in which an LED element 33 is inserted into a hole 22 formed in the substrate 11 in advance is brought into close contact with the end surface of the light guide plate 44 with an adhesive 77. Have
【０００４】[0004]
【発明が解決しようとする課題】ところが、従来のＬＥ
Ｄ照明は基板１１と導光板４４を接着する際、孔２２に
入りきらない接着剤７７が接着面以外の箇所にはみ出し
てしまうという問題がある。接着剤７７が導光板４４、
基板１１の表面にはみ出すと、後で拭き取らねばならず
生産工程の上で煩わしい。また拭き取った後でも製品の
美観を損ねる恐れがある。さらに、接着剤７７が導光板
４４の平面側にはみ出すと導光板表面に凹凸が発生し、
均一な発光面が得られなくなる恐れがある。However, the conventional LE
When the substrate 11 and the light guide plate 44 are bonded to each other, the D-light has a problem that the adhesive 77 that does not fit in the holes 22 protrudes to a portion other than the bonding surface. The adhesive 77 is the light guide plate 44,
If it sticks out to the surface of the substrate 11, it must be wiped off later, which is troublesome in the production process. In addition, the appearance of the product may be impaired even after it is wiped off. Furthermore, when the adhesive 77 sticks out to the flat side of the light guide plate 44, unevenness is generated on the surface of the light guide plate,
There is a possibility that a uniform light emitting surface may not be obtained.
【０００５】そこで本発明の目的は、ＬＥＤを装着した
基板を導光板の端面に接着するに際し、接着剤が接着面
以外にはみ出さず、導光板平面を汚さないＬＥＤ照明を
実現することにある。SUMMARY OF THE INVENTION Therefore, an object of the present invention is to realize an LED illumination in which the adhesive does not stick out to the end surface of the light guide plate when the substrate on which the LED is mounted is adhered to the end surface of the light guide plate and the flat surface of the light guide plate is not contaminated. .
【０００６】[0006]
【課題を解決するための手段】本発明のＬＥＤ照明は、
基板１に形成された孔２にＬＥＤ素子３を装着してなる
光源が、接着剤７を介して導光板４の端面に接続されて
なるＬＥＤ照明において、基板１の表面には、孔２と接
続された溝５が形成されていることを特徴とするThe LED lighting of the present invention comprises:
In an LED illumination in which a light source in which the LED element 3 is mounted in the hole 2 formed in the substrate 1 is connected to the end surface of the light guide plate 4 via the adhesive 7, in the surface of the substrate 1, the holes 2 and Characterized in that connected grooves 5 are formed
【０００７】さらに、本発明の好ましい態様として、前
記基板１には、溝５に接続されて、その溝５よりも深い
第二の孔６が形成されていることを特徴とする。Further, in a preferred aspect of the present invention, the substrate 1 is formed with a second hole 6 which is connected to the groove 5 and is deeper than the groove 5.
【０００８】さらにまた本発明の好ましい態様は、前記
溝５は基板１の端面を貫通して形成されていることを特
徴とする。但し、この溝５は前記第二の孔６と接続して
いてもよいことはいうまでもない。Furthermore, a preferred aspect of the present invention is characterized in that the groove 5 is formed so as to penetrate the end face of the substrate 1. However, it goes without saying that the groove 5 may be connected to the second hole 6.
【０００９】[0009]
【作用】本発明のＬＥＤ照明では、基板と導光板とを接
着した際に、基板表面に過剰の接着剤が逃げる為の溝
を、ＬＥＤ素子が装着された孔と接続して形成している
ので、接着剤が接着面以外にはみ出すことがない。また
前記溝よりも深い深さで第二の孔を設けることにより、
溝から出る過剰の接着剤をより効果的にプールすること
ができる。さらにまた、基板の端面に貫通して溝を形成
すると、過剰の接着剤は基板の端面にしか出て来ず、導
光板の平面側には出てこないので、美観を損ねることが
ない。In the LED illumination of the present invention, when the substrate and the light guide plate are adhered, a groove for allowing excess adhesive to escape is formed on the surface of the substrate by connecting to the hole in which the LED element is mounted. Therefore, the adhesive does not squeeze out other than the adhesive surface. Further, by providing the second hole at a depth deeper than the groove,
Excess adhesive exiting the groove can be pooled more effectively. Furthermore, if a groove is formed so as to penetrate the end face of the substrate, excess adhesive will only come out to the end face of the substrate and not to the flat surface side of the light guide plate, so that it will not spoil the appearance.
【００１０】[0010]
【実施例】図１に本発明の一ＬＥＤ照明の構造を示す分
解斜視図を示し、図２に図１のＬＥＤ照明の構造を示す
模式断面図を示す。1 is an exploded perspective view showing the structure of one LED illumination of the present invention, and FIG. 2 is a schematic sectional view showing the structure of the LED illumination of FIG.
【００１１】基板１は白色のポリカーボネートよりな
る。その他、基板１にはメラミン、アクリル等の樹脂、
またはアルミナのようなセラミックが使用できる。これ
らの材料を所望の形状に加工して、ＬＥＤ素子を装着す
る基板として利用できる。好ましく白色の材料を選択す
ることにより、ＬＥＤ素子の発光を孔２の内部で反射さ
せて輝度をあげることができる。またＬＥＤ照明を面光
源のバックライトとして用いる場合、その面光源の薄さ
が要求されるので、基板は厚さが５ｍｍ以下の直方体と
することが好ましい。The substrate 1 is made of white polycarbonate. In addition, resin such as melamine and acrylic is used for the substrate 1,
Alternatively, a ceramic such as alumina can be used. These materials can be processed into a desired shape and used as a substrate on which an LED element is mounted. By selecting a preferable white material, the light emitted from the LED element can be reflected inside the hole 2 to increase the brightness. Further, when the LED illumination is used as a backlight of a surface light source, the surface light source is required to be thin, and therefore the substrate is preferably a rectangular parallelepiped having a thickness of 5 mm or less.
【００１２】ＬＥＤ素子３を挿入する孔２は図１に示す
ような楕円形の他、円、矩形どのような形状でも基板１
に形成可能である。またＬＥＤ素子３は、図１に示すよ
うな発光チップをカップ状のリードフレームに載置した
ものの他、発光チップ単独でも挿入可能である。但し、
発光チップ単独で挿入する際には、孔２の中に予め電極
を形成しておく必要があることはいうまでもない。さら
にまた、ＬＥＤ素子３は孔２に挿入された状態で、ある
いは挿入される前に、例えばエポキシ樹脂のような封止
材料８でモールドしてもよい。図２は孔２に挿入された
ＬＥＤ素子３をエポキシ樹脂よりなる封止材料８でモー
ルドした状態を示している。The hole 2 into which the LED element 3 is inserted is not limited to an elliptical shape as shown in FIG.
Can be formed into. The LED element 3 can be inserted not only by mounting the light emitting chip as shown in FIG. 1 on a cup-shaped lead frame but also by using the light emitting chip alone. However,
Needless to say, when inserting the light emitting chip alone, it is necessary to form an electrode in the hole 2 in advance. Furthermore, the LED element 3 may be molded with a sealing material 8 such as an epoxy resin in the state of being inserted into the hole 2 or before being inserted. FIG. 2 shows a state in which the LED element 3 inserted in the hole 2 is molded with a sealing material 8 made of epoxy resin.
【００１３】導光板４はアクリル樹脂よりなる。その
他、導光板４に、ＬＥＤの発光波長を変換する目的で蛍
光顔料、蛍光染料を混入したり、前記蛍光物質を導光板
表面に塗布してもよい。また別に、均一な面状光源を得
る目的で導光板４の表面にアルミナ粉末のような光拡散
物質を塗布してもよい。また、導光板４と基板１とを接
着する接着剤７には、ＬＥＤの発光を減衰させないよう
に無色透明の接着剤を使用している。The light guide plate 4 is made of acrylic resin. In addition, a fluorescent pigment or fluorescent dye may be mixed in the light guide plate 4 for the purpose of converting the emission wavelength of the LED, or the fluorescent substance may be applied to the surface of the light guide plate. Alternatively, a light diffusing substance such as alumina powder may be applied to the surface of the light guide plate 4 for the purpose of obtaining a uniform planar light source. A colorless and transparent adhesive is used as the adhesive 7 for bonding the light guide plate 4 and the substrate 1 so as not to attenuate the light emission of the LED.
【００１４】次に本発明の特徴である溝４は、図１のよ
うなＶ字形の他、矩形、円形どのような形状で形成して
もよい。溝４をＬＥＤ素子３を挿入する孔２と接続する
ように形成したことにより、孔２から溢れ出る接着剤７
を溝４に逃がすことができる。Next, the groove 4, which is a feature of the present invention, may be formed in any shape such as a rectangle or a circle in addition to the V shape shown in FIG. Since the groove 4 is formed so as to be connected to the hole 2 into which the LED element 3 is inserted, the adhesive 7 overflowing from the hole 2 is formed.
Can be released into the groove 4.
【００１５】図１および図２に示すように、本発明では
さらに好ましい例として、溝５と接続して、溝５よりも
深い深さで第二の孔６を基板１に形成している。この第
二の孔６の作用は図２に示すように、導光板４と基板１
との接着時に、溝５からさらに溢れ出た接着剤７を第二
の孔６に逃がすことで、接着剤７が導光板４と基板１と
の接着面からはみ出さないようにしている。As shown in FIGS. 1 and 2, as a more preferable example in the present invention, the second hole 6 is formed in the substrate 1 so as to be connected to the groove 5 and have a depth deeper than the groove 5. The action of the second hole 6 is as shown in FIG.
The adhesive 7 overflowing from the groove 5 is allowed to escape to the second hole 6 at the time of adhering with each other, so that the adhesive 7 is prevented from protruding from the adhering surface between the light guide plate 4 and the substrate 1.
【００１６】図３は本願の他の実施例のＬＥＤ照明の構
造を示す模式断面図である。図１及び図２と異なるとこ
ろは、基板１に第二の孔６を形成していないことであ
る。このＬＥＤ照明は孔２より溢れ出た接着剤７が溝５
を通って、基板１の端面を貫通した溝５からはみ出して
いることを示している。このように、溝５を基板１の端
面を貫通して形成することにより、過剰の接着剤７が出
ていく箇所が基板１の端面に限定されるので、面光源と
なる導光板の平面を汚すことがない。FIG. 3 is a schematic sectional view showing the structure of an LED illumination according to another embodiment of the present application. The difference from FIGS. 1 and 2 is that the second hole 6 is not formed in the substrate 1. In this LED lighting, the adhesive 7 overflowing from the hole 2 has the groove 5
Through the groove 5 penetrating the end face of the substrate 1. By thus forming the groove 5 through the end face of the substrate 1, the portion where the excess adhesive 7 is exposed is limited to the end face of the substrate 1, so that the flat surface of the light guide plate serving as a surface light source is formed. It doesn't get dirty.
【００１７】[0017]
【発明の効果】以上説明したように、本発明のＬＥＤ照
明は基板側に接着剤を逃がすための溝が設けられている
ので、導光板と基板とを接着しても、接着剤が導光板表
面にはみ出すことがない。特に基板に複数個形成された
孔にそれぞれＬＥＤを装着して直線的に並べた光源と、
導光板とを接着した構造のＬＥＤ照明を実現した場合、
基板表面に形成した溝はＬＥＤを装着した孔と孔とを直
線的に繋ぐので、溝を伝わる接着剤の流れが非常にスム
ースになり、余分な部分にはみ出すことない。従って生
産性に優れ、外観もよいＬＥＤ照明が実現できる。As described above, since the LED lighting of the present invention is provided with the groove for allowing the adhesive to escape on the substrate side, even if the light guide plate and the substrate are adhered, the adhesive does not affect the light guide plate. It does not protrude to the surface. In particular, a light source in which LEDs are mounted linearly in a plurality of holes formed in a substrate,
When LED lighting with a structure that adheres to the light guide plate is realized,
Since the groove formed on the surface of the substrate connects the hole in which the LED is mounted and the hole in a straight line, the flow of the adhesive along the groove is very smooth, and the adhesive does not overflow. Therefore, it is possible to realize the LED lighting with excellent productivity and good appearance.
【図１】 本発明の一実施例のＬＥＤ照明の構造を示す
部分的な分解斜視図。FIG. 1 is a partial exploded perspective view showing a structure of an LED illumination according to an embodiment of the present invention.
【図２】 図１のＬＥＤ照明の構造を示す部分模式断面
図。FIG. 2 is a partial schematic cross-sectional view showing the structure of the LED illumination shown in FIG.
【図３】 本発明の他の実施例のＬＥＤ照明の構造を示
す部分模式断面図。FIG. 3 is a partial schematic cross-sectional view showing the structure of an LED illumination according to another embodiment of the present invention.
【図４】 従来のＬＥＤ照明の構造を示す部分模式断面
図。FIG. 4 is a partial schematic sectional view showing the structure of a conventional LED illumination.
【図５】 図４のＬＥＤ照明の外観を示す部分平面図。5 is a partial plan view showing the appearance of the LED illumination shown in FIG.
１・・・・基板 ２・・・・孔 ３・・・・ＬＥＤ素子 ４・・・・導光板 ５・・・・溝 ６・・・・第二の孔 ７・・・・接着剤 ８・・・・封止材料 1 ... Substrate 2 ... Hole 3 ... LED element 4 ... Light guide plate 5 ... Groove 6 ... Second hole 7 ... Adhesive 8. ... Encapsulation materials
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6266467AJPH08130329A (en) | 1994-10-31 | 1994-10-31 | LED lighting |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6266467AJPH08130329A (en) | 1994-10-31 | 1994-10-31 | LED lighting |
| Publication Number | Publication Date |
|---|---|
| JPH08130329Atrue JPH08130329A (en) | 1996-05-21 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6266467APendingJPH08130329A (en) | 1994-10-31 | 1994-10-31 | LED lighting |
| Country | Link |
|---|---|
| JP (1) | JPH08130329A (en) |
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