| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP05195330AJP3079512B2 (ja) | 1993-07-12 | 1993-07-12 | 基板の冷却装置 |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP05195330AJP3079512B2 (ja) | 1993-07-12 | 1993-07-12 | 基板の冷却装置 |
| Publication Number | Publication Date |
|---|---|
| JPH0730027Atrue JPH0730027A (ja) | 1995-01-31 |
| JP3079512B2 JP3079512B2 (ja) | 2000-08-21 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP05195330AExpired - Fee RelatedJP3079512B2 (ja) | 1993-07-12 | 1993-07-12 | 基板の冷却装置 |
| Country | Link |
|---|---|
| JP (1) | JP3079512B2 (ja) |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20010067887A (ko)* | 2001-04-04 | 2001-07-13 | 이원재 | 수냉식 cpu 냉각기 |
| KR100434524B1 (ko)* | 1997-11-28 | 2004-09-07 | 삼성에스디아이 주식회사 | 전계방출소자의제조방법 |
| KR100456342B1 (ko)* | 2002-02-08 | 2004-11-12 | 쿨랜스코리아 주식회사 | 반도체 칩의 수냉식 냉각 블록 |
| KR100766938B1 (ko)* | 2006-10-02 | 2007-10-17 | 삼성에스디아이 주식회사 | 발광 장치 및 표시 장치 |
| CN107486556A (zh)* | 2017-06-15 | 2017-12-19 | 西安交通大学青岛研究院 | 一种金属3d打印设备 |
| CN111810457A (zh)* | 2020-08-11 | 2020-10-23 | 芜湖新兴铸管有限责任公司 | 离心空压机空冷器降温水路装置 |
| WO2024190282A1 (ja)* | 2023-03-16 | 2024-09-19 | 株式会社Kelk | 除熱板及び熱電発電ユニット |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5796557A (en)* | 1980-12-08 | 1982-06-15 | Toshiba Corp | Cooling supporting base for semiconductor substrate |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5796557A (en)* | 1980-12-08 | 1982-06-15 | Toshiba Corp | Cooling supporting base for semiconductor substrate |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100434524B1 (ko)* | 1997-11-28 | 2004-09-07 | 삼성에스디아이 주식회사 | 전계방출소자의제조방법 |
| KR20010067887A (ko)* | 2001-04-04 | 2001-07-13 | 이원재 | 수냉식 cpu 냉각기 |
| KR100456342B1 (ko)* | 2002-02-08 | 2004-11-12 | 쿨랜스코리아 주식회사 | 반도체 칩의 수냉식 냉각 블록 |
| KR100766938B1 (ko)* | 2006-10-02 | 2007-10-17 | 삼성에스디아이 주식회사 | 발광 장치 및 표시 장치 |
| CN107486556A (zh)* | 2017-06-15 | 2017-12-19 | 西安交通大学青岛研究院 | 一种金属3d打印设备 |
| CN111810457A (zh)* | 2020-08-11 | 2020-10-23 | 芜湖新兴铸管有限责任公司 | 离心空压机空冷器降温水路装置 |
| WO2024190282A1 (ja)* | 2023-03-16 | 2024-09-19 | 株式会社Kelk | 除熱板及び熱電発電ユニット |
| Publication number | Publication date |
|---|---|
| JP3079512B2 (ja) | 2000-08-21 |
| Publication | Publication Date | Title |
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