JPH0713678A - Input device and electronic equipment - Google Patents

Abstract

PURPOSE:To prevent a failure resulting in the waving of electrode substrates due to an environment stress or the like, and to improve reliability by conducting the electrode terminals for input of the upper and lower electrode substrates by a conductor constituted of an adhesive material suitable to the linear expansion factor of the electrode substrate as a main component. CONSTITUTION:Transparent electrodes 3 are formed on an upper substrate 1 and a lower substrate 2, and a prescribed pattern is formed. Then, terminals 4 for input are formed on those transparent electrodes 3. Next, a double coated adhesive tape 6 and a conductive double coated adhesive tape 7 for upper and lower continuity suitable to the linear expansion factor of the electrode substrate are adhered to one substrate, spacers 5 are spread on the substrate, and those electrode substrates are adhered so as to be opposed to each other. Thus, when the environment stress or the like is added to an inputting device, the failure resulting in the waiving of the electrode substrates can be prevented.

Description

Translated fromJapanese

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明は入力装置および電子機器
に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an input device and electronic equipment.

【０００２】[0002]

【従来の技術】従来、入力装置における上下電極基板の
入力用電極端子間導通は、図７に示す様に導電性の良い
接着剤１１で固定することにより上下入力用電極端子間
導通を行っていた。（例えば、特開平３−２２６８２０
号公報参照）2. Description of the Related Art Conventionally, the conduction between the input electrode terminals of the upper and lower electrode substrates in an input device is performed by fixing the upper and lower input electrode terminals by fixing with an adhesive 11 having good conductivity as shown in FIG. It was (For example, JP-A-3-226820
(See issue)

【０００３】[0003]

【発明が解決しようとする課題】しかし、ガラス基板と
フィルム基板に代表されるような線膨張率の異なった上
下電極基板や、線膨張率の大きい電極基板等を用いて入
力装置を製造した場合以下のような問題点を有する。す
なわち、前記導通接着剤により入力装置の上下電極基板
が接着及び固定されてしまっている為、熱応力等の環境
ストレスが電極基板に加わった時に、前記電極基板が大
きく波うってしまうことに起因する機能不良や、波うち
外観不良になってしまうことが確認されている。However, when an input device is manufactured by using upper and lower electrode substrates having different linear expansion coefficients, such as a glass substrate and a film substrate, or an electrode substrate having a large linear expansion coefficient, etc. It has the following problems. That is, since the upper and lower electrode substrates of the input device have been adhered and fixed by the conductive adhesive, the electrode substrate is greatly undulated when environmental stress such as thermal stress is applied to the electrode substrate. It has been confirmed that there is a malfunction or a wavy appearance.

【０００４】また、その対策として電極基板の線膨張率
に合った粘着剤や両面テープ等を、上下基板のシール材
として使用することにより前記課題の対応策としていた
が、上下導通接着剤により上下基板が固定されているこ
とにより、それだけでは不十分であり早急なる対応が必
要であった。As a countermeasure, an adhesive or double-sided tape suitable for the linear expansion coefficient of the electrode substrate is used as a sealing material for the upper and lower substrates to solve the above problem. Since the substrate was fixed, that was not enough and urgent action was required.

【０００５】そこで本発明はこのような課題を解決する
もので、その目的は入力装置に環境ストレス等が加わっ
た場合、電極基板が波うってしまうことに起因する不良
を防止し、信頼性の高い入力装置を提供するところにあ
る。Therefore, the present invention solves such a problem, and its purpose is to prevent defects caused by undulation of the electrode substrate when environmental stress or the like is applied to the input device, and to improve reliability. It is in the area of providing expensive input devices.

【０００６】[0006]

【課題を解決するための手段】本発明の入力装置は、電
極基板表面に入力用電極端子を形成させ、該電極を内側
にし一対の前記電極基板を対向配置させた入力装置に於
て、前記電極基板の線膨張率に合った粘着性物質を主成
分とする導電体により、上下電極基板の入力用電極端子
間導通を行ったことを特徴とする。The input device of the present invention is an input device in which an input electrode terminal is formed on the surface of an electrode substrate, and a pair of the electrode substrates are arranged to face each other with the electrode inside. It is characterized in that conduction is established between the input electrode terminals of the upper and lower electrode substrates by means of a conductor whose main component is an adhesive substance suitable for the linear expansion coefficient of the electrode substrate.

【０００７】[0007]

【実施例】【Example】

〔実施例１〕図１に本実施例の評価に用いた入力装置の
断面図を示す。ここで１は上基板で厚み１２５μｍのＰ
ＥＴ（ポリエチレンテレフタレート）フィルムを、２は
下基板で厚さ１．１ｍｍのソーダガラスを用いた。３は
透明電極、４は厚さ１０μｍの入力用電極端子、５はス
ペーサー、６は両面接着テープ、７は導電性両面接着テ
ープである。[Embodiment 1] FIG. 1 shows a sectional view of an input device used for evaluation of the present embodiment. Here, 1 is an upper substrate, which is P having a thickness of 125 μm.
An ET (polyethylene terephthalate) film and a lower substrate 2 were made of soda glass having a thickness of 1.1 mm. 3 is a transparent electrode, 4 is an input electrode terminal having a thickness of 10 μm, 5 is a spacer, 6 is a double-sided adhesive tape, and 7 is a conductive double-sided adhesive tape.

【０００８】本入力装置の製造方法はＰＥＴフィルムか
らなる上基板１，ソーダガラスからなる下基板２上に低
温スパッタリング法により透明電極３を形成しフォトリ
ソグラフィー法により所定のパターンを形成する。その
上に入力用電極端子４をスクリーン印刷し、焼成するこ
とにより形成させる。次に一方の基板に両面接着テープ
６及び上下導通用導電性両面接着テープ７を貼りつけ、
基板上へスペーサー５を湿式スプレー法により散布し、
それぞれの電極基板が対向配置される様に接着した。ス
ペーサーの散布密度は５０コ／ｍｍ²とした。In the manufacturing method of the present input device, a transparent electrode 3 is formed on an upper substrate 1 made of a PET film and a lower substrate 2 made of soda glass by a low temperature sputtering method, and a predetermined pattern is formed by a photolithography method. The input electrode terminal 4 is formed by screen-printing and baking the input electrode terminal 4 thereon. Next, the double-sided adhesive tape 6 and the conductive double-sided adhesive tape 7 for vertical conduction are attached to one substrate,
Spread the spacers 5 on the substrate by a wet spray method,
The respective electrode substrates were adhered so that they were arranged facing each other. The spraying density of the spacer was 50 co / mm² .

【０００９】そこで、上述のように上基板の線膨張率に
追従可能な導電性両面接着テープ７による端子間導通を
行った入力装置を、６０゜Ｃ−９０％ＲＨの環境下に投
入したところ、２００時間経過しても図８に示すような
電極基板の波うち不良は発生しなかった。Therefore, when the input device having the conduction between terminals by the conductive double-sided adhesive tape 7 capable of following the linear expansion coefficient of the upper substrate as described above is placed in an environment of 60 ° C.-90% RH. Even after 200 hours, the wavy defect of the electrode substrate as shown in FIG. 8 did not occur.

【００１０】〔比較例〕上下入力用電極端子間の導通を
図７に示すように上下導通接着剤１１を用いて接着固定
させた入力装置を、６０゜Ｃ−９０％ＲＨの環境下に投
入したところ、２時間ほどで図８に示すような電極基板
の波うち不良が発生してしまった。[Comparative Example] An input device in which the conduction between the upper and lower input electrode terminals is fixed by using a vertical conduction adhesive 11 as shown in FIG. 7 is put in an environment of 60 ° C.-90% RH. As a result, a wavy defect of the electrode substrate as shown in FIG. 8 occurred in about 2 hours.

【００１１】〔実施例２〕実施例１の製造方法にて入力
装置を製造し、図２に示すように導電粒子８例えば、ミ
クロパールＮＩ−２０９５（積水ファインケミカル社
製）を含有させた粘着剤９を上下電極基板の入力用電極
端子間に配置させた。この場合も実施例１と同様な結果
が得られた。Example 2 An input device was manufactured by the manufacturing method of Example 1, and as shown in FIG. 2, an adhesive containing conductive particles 8 such as Micropearl NI-2095 (manufactured by Sekisui Fine Chemical Co., Ltd.). 9 was placed between the input electrode terminals of the upper and lower electrode substrates. Also in this case, the same result as in Example 1 was obtained.

【００１２】〔実施例３〕実施例１の製造方法にて入力
装置を製造し、図３に示すようにＡｇフィラー１０及び
スペーサー５を含有させた粘着剤９を上下電極基板の入
力用電極端子間に配置させた。この場合も実施例１と同
様な結果が得られた。[Embodiment 3] An input device is manufactured by the manufacturing method of Embodiment 1, and as shown in FIG. 3, an adhesive 9 containing an Ag filler 10 and a spacer 5 is added to the input electrode terminals of the upper and lower electrode substrates. Placed in between. Also in this case, the same result as in Example 1 was obtained.

【００１３】〔実施例４〕実施例１の製造方法にて入力
装置を製造し、図４に示すように導電性両面接着テープ
７を上下電極基板の入力用電極端子間及び上下電極基板
の外周部に配置した。この場合も実施例１と同様な結果
が得られた。[Embodiment 4] An input device is manufactured by the manufacturing method of Embodiment 1, and the conductive double-sided adhesive tape 7 is used between the input electrode terminals of the upper and lower electrode substrates and the outer periphery of the upper and lower electrode substrates as shown in FIG. Placed in the section. Also in this case, the same result as in Example 1 was obtained.

【００１４】〔実施例５〕実施例１の製造方法にて入力
装置を製造し、図５に示すように樹脂球の外周に金属被
膜が形成された導電粒子ＤＥＢ（積水ファインケミカル
製）８を含有させた粘着剤９を、上下電極基板の入力用
電極端子間及び上下電極基板の外周部に配置した。この
場合も実施例１と同様な結果が得られた。[Example 5] An input device was manufactured by the manufacturing method of Example 1 and contained conductive particles DEB (manufactured by Sekisui Fine Chemical Co., Ltd.) 8 in which a metal coating was formed on the outer periphery of a resin sphere as shown in FIG. The pressure-sensitive adhesive 9 was placed between the input electrode terminals of the upper and lower electrode substrates and on the outer peripheral portion of the upper and lower electrode substrates. Also in this case, the same result as in Example 1 was obtained.

【００１５】〔実施例６〕実施例１の製造方法にて入力
装置を製造し、図６に示すようにＡｇフィラー１０及び
スペーサー５を含有させた粘着剤９を上下電極基板の入
力用電極端子間及び上下電極基板の外周部に配置した。
この場合も実施例１と同様な結果が得られた。[Embodiment 6] An input device is manufactured by the manufacturing method of Embodiment 1, and as shown in FIG. 6, an adhesive 9 containing an Ag filler 10 and a spacer 5 is applied to the input electrode terminals of the upper and lower electrode substrates. And the upper and lower electrode substrates.
Also in this case, the same result as in Example 1 was obtained.

【００１６】上述の実施例４から６までのように、入力
用電極端子間及び上下電極基板の外周部に粘着剤を配置
することにより、一工程での加工で同時に形成できる。
また、粘着剤の接触面積の増加に伴い上下基板間の接着
力も向上するという効果を有している。As in the fourth to sixth embodiments described above, by disposing the adhesive between the input electrode terminals and on the outer peripheral portions of the upper and lower electrode substrates, it is possible to form them simultaneously in a single process.
Further, there is an effect that the adhesive force between the upper and lower substrates is improved as the contact area of the pressure-sensitive adhesive is increased.

【００１７】〔実施例７〕上記各実施例により製造され
た入力装置を、ハンディーターミナル，電子手帳，パー
ソナルコンピュータ，液晶表示装置，プラズマ表示装置
等の電子機器に搭載した。したがって、信頼性の高い電
子機器が提供できた。[Embodiment 7] The input device manufactured according to each of the above-described embodiments is mounted on electronic equipment such as a handy terminal, an electronic notebook, a personal computer, a liquid crystal display device, and a plasma display device. Therefore, a highly reliable electronic device can be provided.

【００１８】また、上記実施例では上基板にフィルム、
下基板にガラスを用いているが、下基板がフィルムであ
ってもよい。In the above embodiment, a film is formed on the upper substrate,
Although glass is used for the lower substrate, the lower substrate may be a film.

【００１９】[0019]

【発明の効果】以上述べたように本発明によれば、電極
基板の線膨張率に合った粘着性物質を主成分とする導電
体により、上下電極基板の入力用電極端子間導通を行っ
たことにより、環境ストレス等が加わった場合、電極基
板が波うってしまうことに起因する不良を防止し、信頼
性の高い入力装置を提供できるという効果を有する。As described above, according to the present invention, the electrical connection between the input and output electrode terminals of the upper and lower electrode substrates is performed by the conductor containing the adhesive material as the main component, which is suitable for the linear expansion coefficient of the electrode substrate. Thus, when environmental stress or the like is applied, it is possible to prevent a defect due to the wave of the electrode substrate and provide an input device with high reliability.

【００２０】更に、前記粘着性導電物質により上下導通
及び上下基板の接着（粘着）を行った時にも、同様の効
果を有する。Further, the same effect is obtained when the above-mentioned adhesive conductive material is used for vertical conduction and for adhering (adhering) the upper and lower substrates.

【図面の簡単な説明】[Brief description of drawings]

【図１】 本発明の入力装置及び実施例１を示す図。FIG. 1 is a diagram showing an input device and a first embodiment of the present invention.

【図２】 本発明の実施例２を示す図。FIG. 2 is a diagram showing a second embodiment of the present invention.

【図３】 本発明の実施例３を示す図。FIG. 3 is a diagram showing Embodiment 3 of the present invention.

【図４】 本発明の実施例４を示す図。FIG. 4 is a diagram showing Embodiment 4 of the present invention.

【図５】 本発明の実施例５を示す図。FIG. 5 is a diagram showing Embodiment 5 of the present invention.

【図６】 本発明の実施例６を示す図。FIG. 6 is a diagram showing Embodiment 6 of the present invention.

【図７】 従来の入力装置の入力用電極を示す図。FIG. 7 is a diagram showing an input electrode of a conventional input device.

【図８】 従来の入力装置を示す図。FIG. 8 is a diagram showing a conventional input device.

【符号の説明】[Explanation of symbols]

１ ． 上基板 ２ ． 下基板 ３ ． 透明電極 ４ ． 入力用電極端子 ５ ． スペーサー ６ ． 両面接着テープ ７ ． 導電性両面接着テープ ８ ． 導電粒子 ９ ． 粘着剤 １０ ． Ａｇフィラー １１ ． 上下導通接着剤 1. Upper substrate 2. Lower substrate 3. Transparent electrode 4. Input electrode terminal 5. Spacer 6. Double-sided adhesive tape 7. Conductive double-sided adhesive tape 8. Conductive particles 9. Adhesive 10. Ag filler 11. Vertical conduction adhesive

Claims (3)

Translated fromJapanese

【特許請求の範囲】[Claims]【請求項１】電極基板表面に入力用電極端子を形成さ
せ、該電極を内側にし一対の前記電極基板を対向配置さ
せた入力装置に於て、前記電極基板の線膨張率に合った
粘着性物質を主成分とする導電体により、上下電極基板
の入力用電極端子間導通を行ったことを特徴とする入力
装置。1. An input device in which an input electrode terminal is formed on the surface of an electrode substrate, and a pair of the electrode substrates are arranged so as to face each other with the electrodes inside, and an adhesive property suitable for the linear expansion coefficient of the electrode substrate. An input device characterized in that conduction is established between input electrode terminals of upper and lower electrode substrates by a conductor whose main component is a substance.【請求項２】請求項１に示した粘着性導電物質により上
下導通及び上下電極基板の接着（粘着）を行ったことを
特徴とする入力装置。2. An input device characterized in that vertical conduction and adhesion (adhesion) of upper and lower electrode substrates are carried out by the adhesive conductive material according to claim 1.【請求項３】請求項１または２記載の入力装置を搭載し
たことを特徴とする電子機器。3. An electronic device equipped with the input device according to claim 1 or 2.