【発明の詳細な説明】〔産業上の利用分野〕本発明は電子装置の実装方法に関し、特にフレキシビリ
ティの有る回路基板とフレキシビリティの無い回路基板
の一体化された回路基板を用いた電子装置の実装方法に
関する。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a method for mounting an electronic device, and particularly to an electronic device using a circuit board that is an integrated circuit board of a flexible circuit board and a non-flexible circuit board. Regarding the implementation method.
従来の電子装置におけるフレキシビリティの有る第１の
回路基板とフレキシビリティの無い第２の回路基板とが
一体化された回路基板の組み立て方法は、第４図（ａ）
、（ｂ）に示す如く、別々に回路部品６を搭載して用意
された複数個の第２の回路基板２をたがいに第１の回路
基板１により半田付あるいはコネクタ等々の手段にて接
続する実装方法をとっていた。A method of assembling a circuit board in which a flexible first circuit board and a non-flexible second circuit board are integrated in a conventional electronic device is shown in FIG. 4(a).
, as shown in (b), a plurality of second circuit boards 2 prepared with separately mounted circuit components 6 are connected to each other by means such as soldering or connectors using the first circuit board 1. I was using an implementation method.
この従来の電子装置の実装方法によると、別々に回路部
品を搭載した回路基板を用意する必要があるため複数の
製造ラインを必要とし、かつ、各回路基板毎に検査工程
を必要としていた。加えて、複数個の基板を接続するた
め工程が複雑になり、かつ、品質低下の要因ともなって
いた。According to this conventional electronic device mounting method, it is necessary to prepare circuit boards on which circuit components are mounted separately, which requires multiple manufacturing lines and requires an inspection process for each circuit board. In addition, connecting a plurality of substrates complicates the process and causes quality to deteriorate.
本発明の目的は、製造工程と検査工程を単純にすること
ができ、品質低下の要因を排除できる電子装置の実装方
法を提供することにある。An object of the present invention is to provide a method for mounting an electronic device that can simplify the manufacturing process and inspection process and eliminate factors that cause quality deterioration.
本発明の電子装置の実装方法は、フレキシビリティを有
する第１の回路基板と、フレキシビリティの無い第２の
回路基板とを構成要素として前記第１の回路基板と前記
第２の回路基板との間に非接合部位を設けて接合−像化
し、前記第２の回路基板の前記非接合部位と対応する位
置に切断部位を設けな回路基板の第１の回路基板上に回
路部品を搭載した後、前記切断部位にて前記第２の回路
基板を分割して電子装置に組み込まれる。The electronic device mounting method of the present invention includes a flexible first circuit board and a non-flexible second circuit board, and the first circuit board and the second circuit board are connected to each other. After mounting the circuit component on the first circuit board of the circuit board, the circuit board is bonded and imaged with a non-bonded part provided in between, and a cut part is provided at a position corresponding to the non-bonded part of the second circuit board. , the second circuit board is divided at the cutting site and assembled into an electronic device.
次に、本発明の実施例について図面を参照して説明する
。Next, embodiments of the present invention will be described with reference to the drawings.
第１図（ａ）、（ｂ）は本発明の第１の実施例を説明す
る断面図である。FIGS. 1(a) and 1(b) are cross-sectional views illustrating a first embodiment of the present invention.
第１の実施例は、第１図（ａ）、（ｂ）に示すように、
所定の回路パターンを有し、かつ、フレキシビリティの
有る第１の回路基板１と、フレキシビリティの無い第２
の回路基板２を接合部位３で一体化する。第１の回路基
板１は、ポリイミドフィルムを用いて形成し、第２の回
路基板２は、■字形切欠きの切断部位５を有するガラス
エポキシ系の回路基板を用いた。第２の回路基板２は、
第１の回路基板１の補強作用を持たせるものであるが、
回路を形成すれば第１の回路基板１とで多層基板と同様
な効果を得ることができる。接合部位３は、熱硬化形の
エポキシ系の接着剤を用い、非接合部位４を形成して第
１の回路基板１と第２の回路基板２を接合−像化した。The first embodiment, as shown in FIGS. 1(a) and (b),
A first circuit board 1 having a predetermined circuit pattern and having flexibility, and a second circuit board 1 having no flexibility.
The circuit boards 2 are integrated at the joint portion 3. The first circuit board 1 was formed using a polyimide film, and the second circuit board 2 was a glass epoxy circuit board having a cut portion 5 in the form of a square cutout. The second circuit board 2 is
Although it has a reinforcing effect on the first circuit board 1,
If a circuit is formed, the same effect as a multilayer board can be obtained with the first circuit board 1. For the bonding area 3, a thermosetting epoxy adhesive was used to form a non-bonding area 4, and the first circuit board 1 and the second circuit board 2 were bonded and imaged.
この後、回路部品６を第１の回路基板１上に搭載し、半
田付にて接合して回路基板を完成させ、しかる後に、切
断部位５で第２の回路基板２を屈折９分離させ、電子装
置内に直角に実装させたものである。After this, the circuit component 6 is mounted on the first circuit board 1 and joined by soldering to complete the circuit board, and after that, the second circuit board 2 is bent by 9 parts at the cutting part 5, It is mounted at right angles within an electronic device.
本実施例においては、第１の回路基板１は、ポリイミド
フィルムを用いた０、２ｍｍ厚の基板第２の回路基板２
は、ガラスエポキシを用いた１、２ｍｍ厚を使用した。In this embodiment, the first circuit board 1 is made of a polyimide film with a thickness of 0.2 mm and the second circuit board 2 is made of polyimide film.
used glass epoxy with a thickness of 1 or 2 mm.
第２図（ａ＞、（ｂ）は本発明の第２の実施例を説明す
る断面図である。FIGS. 2(a) and 2(b) are cross-sectional views illustrating a second embodiment of the present invention.
第２の実施例は、第１の実施例と同一方法をとるが、第
２図（ａ）、（ｂ）に示す如く、非接合部位４の領域内
に２ケ所以上の切断部位５を有し、回路部品６を搭載完
了後に切断部位５から第２の回路基板２ａの部分を切り
落し、電子装置内に組み込んだものである。The second embodiment uses the same method as the first embodiment, but has two or more cutting parts 5 within the region of the non-joining part 4, as shown in FIGS. 2(a) and 2(b). After the circuit components 6 have been mounted, a portion of the second circuit board 2a is cut off from the cutting portion 5 and incorporated into the electronic device.
第３図は本発明に使用する回路基板の切断部位の他の例
の底面図である。FIG. 3 is a bottom view of another example of the cut portion of the circuit board used in the present invention.
切断部位は、第１図に示す如くＶ字形を有するもの、第
３図に示す如く第２の回路基板１２に１列に並んだスリ
ットを設け、第２の回路基板１２の一部でつながった形
状の切断部位１５を有するものであってもさしつかえな
い。The cutting portion was V-shaped as shown in FIG. 1, and slits were arranged in a row in the second circuit board 12 as shown in FIG. 3, and the slits were connected by a part of the second circuit board 12. There is no problem even if the cutting portion 15 has a shaped cut portion 15.
以上説明したように本発明は、フレキシビリティの有る
回路基板とフレキシビリティの無い回路基板を接合−像
化させた回路基板を用い、この回路基板に部品を搭載さ
せた後、切断部位でフレキシビリティの無い回路基板を
屈折１分離して電子装置に組み込む方法をとるので、回
路基板間の接続部が不要となり、かつ、従来複数個に分
割された回路基板を一枚の基板として製造可能となるた
め、製造ラインを単純にすることができるので原価低減
が可能となり、かつ、組み立ての品質を向上させること
ができる効果がある。As explained above, the present invention uses a circuit board in which a flexible circuit board and a non-flexible circuit board are bonded and imaged, and after parts are mounted on this circuit board, flexibility is removed at the cutting site. Since this method uses a method of bending a circuit board that does not have a single part and incorporating it into an electronic device, there is no need for connections between circuit boards, and it is now possible to manufacture circuit boards that were conventionally divided into multiple pieces as a single board. Therefore, it is possible to simplify the production line, thereby reducing costs and improving the quality of assembly.
第１図（ａ）、（ｂ）は本発明の第１の実施例を説明す
る断面図、第２図（ａ）、（ｂ）は本発明の第２の実施
例を説明する断面図、第３図は本発明に使用する回路基
板の切断部位の他の例の底面図、第４図（ａ＞、（ｂ）
は従来の電子装置の実装方法の一例を説明する断面図で
ある。１・・・第１の回路基板、２，１２・・・第２の回路基
板、３・・・接合部位、４・・・非接合部位、５．１５
・・・切断部位、６・・・回路部品、７・・・半田。FIGS. 1(a) and (b) are cross-sectional views explaining the first embodiment of the present invention, FIGS. 2(a) and (b) are cross-sectional views explaining the second embodiment of the present invention, FIG. 3 is a bottom view of another example of the cut portion of the circuit board used in the present invention, and FIG. 4 (a>, (b))
1 is a cross-sectional view illustrating an example of a conventional electronic device mounting method. DESCRIPTION OF SYMBOLS 1... First circuit board, 2, 12... Second circuit board, 3... Joining site, 4... Non-joining site, 5.15
... Cutting part, 6... Circuit component, 7... Solder.
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21558390AJPH0497586A (en) | 1990-08-15 | 1990-08-15 | Electronic device mounting method |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21558390AJPH0497586A (en) | 1990-08-15 | 1990-08-15 | Electronic device mounting method |
| Publication Number | Publication Date |
|---|---|
| JPH0497586Atrue JPH0497586A (en) | 1992-03-30 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21558390APendingJPH0497586A (en) | 1990-08-15 | 1990-08-15 | Electronic device mounting method |
| Country | Link |
|---|---|
| JP (1) | JPH0497586A (en) |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0720419A1 (en)* | 1994-12-28 | 1996-07-03 | Asahi Glass Company Ltd. | A circuit board for liquid crystal display, a circuit module, a liquid crystal display device using them, and a method for producing the same |
| DE10319509A1 (en)* | 2003-03-03 | 2004-09-23 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Circuit module and production process for semiconductor elements especially for solar cells and clothing has carrier which can bend flexibly between the cells |
| DE102006041866A1 (en)* | 2006-09-06 | 2008-03-27 | Siemens Home And Office Communication Devices Gmbh & Co. Kg | Circuit board has conductive path layout and single electrical contact point, which is accessible far from circuit board, is arranged above surface of circuit board at free end of guided piece |
| JP2015046439A (en)* | 2013-08-27 | 2015-03-12 | アンデン株式会社 | Electric apparatus and manufacturing method therefor |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0720419A1 (en)* | 1994-12-28 | 1996-07-03 | Asahi Glass Company Ltd. | A circuit board for liquid crystal display, a circuit module, a liquid crystal display device using them, and a method for producing the same |
| KR100247259B1 (en)* | 1994-12-28 | 2000-03-15 | 다니구찌 이찌로오, 기타오카 다카시 | Circuit board, driving circuit module, liquid crystal display device using same and manufacturing method thereof |
| US6104464A (en)* | 1994-12-28 | 2000-08-15 | Mitsubishi Denki Kabushiki Kaisha | Rigid circuit board for liquid crystal display including cut out for providing flexibility to said board |
| DE10319509A1 (en)* | 2003-03-03 | 2004-09-23 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Circuit module and production process for semiconductor elements especially for solar cells and clothing has carrier which can bend flexibly between the cells |
| DE102006041866A1 (en)* | 2006-09-06 | 2008-03-27 | Siemens Home And Office Communication Devices Gmbh & Co. Kg | Circuit board has conductive path layout and single electrical contact point, which is accessible far from circuit board, is arranged above surface of circuit board at free end of guided piece |
| JP2015046439A (en)* | 2013-08-27 | 2015-03-12 | アンデン株式会社 | Electric apparatus and manufacturing method therefor |
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