【考案の詳細な説明】〔考案の技術分野〕 この考案は、半導体試験装置（ハンドラ）の接
触子の改良に関するものである。[Detailed Description of the Invention] [Technical Field of the Invention] This invention relates to an improvement of a contactor for a semiconductor testing device (handler).
従来のこの種ハンドラの概略を第１図ａ，ｂに
示す。第１図において、１は接触子、２はこの接
触子１を固定する固定治具、３は同じく接触子１
の固定ネジ、４は同じく接触子１の押え治具、５
は被測定ICのモールド部、６は被測定ICのリー
ド部、７はハンドラレールである。 A conventional handler of this type is schematically shown in FIGS. 1a and 1b. In Fig. 1, 1 is a contact, 2 is a fixture for fixing this contact 1, and 3 is also a contact 1.
, 4 is the holding jig for contact 1, and 5 is the fixing screw.
6 is a mold part of the IC to be measured, 6 is a lead part of the IC to be measured, and 7 is a handler rail.
次に作用を説明する。被測定ICのリード部６
のそれぞれと接触子１の位置が合うように被測定
ICを固定した状態で接触子１の押え治具４によ
り、リード部６に接触するように矢印Ａの方向に
押圧し、第２図に示すようにリード部６と接触子
１を接触させる。この状態で、各被測定ICのリ
ード部６は接触子１によりテスト回路と接続さ
れ、テスタ（図示せず）より電気信号を加えて被
測定ICの電気的測定を行うものである。 Next, the effect will be explained. Lead part 6 of the IC under test
Place the object to be measured so that the position of contact 1 is aligned with each of the
With the IC fixed, it is pressed in the direction of arrow A using the holding jig 4 of the contact 1 so as to contact the lead part 6, so that the lead part 6 and the contact 1 are brought into contact as shown in FIG. In this state, the lead portion 6 of each IC to be measured is connected to the test circuit through the contactor 1, and an electrical signal is applied from a tester (not shown) to perform electrical measurement of the IC to be measured.
しかしながら、このようなハンドラにおいては
下記のような欠点がある。 However, such a handler has the following drawbacks.
(1) 従来の接触子１と被測定ICのリード部６と
の接触は点接触となるため、大電流を流して電
気的信号を測定する場合、電気抵抗が大きくな
り易い。(1) Since the contact between the conventional contactor 1 and the lead part 6 of the IC to be measured is a point contact, when measuring an electrical signal by flowing a large current, the electrical resistance tends to increase.
(2) 接触性を良くするために、リード部６に対し
接触子１を強く押え付けると早く摩耗し、かつ
接触子１自体のバネの耐久性も弱くなり、押え
の強さのバラツキが生じ、正常な電圧を印加で
きない。(2) If the contact 1 is strongly pressed against the lead part 6 in order to improve contact, it will wear out quickly, and the durability of the spring of the contact 1 itself will become weak, resulting in variations in the strength of the press. , normal voltage cannot be applied.
また、第３図に示すように、被測定ICのリー
ド部６に接触子１の端部を曲げて接触面積を増大
させることも考えられるが、これでも電気抵抗を
大幅に低減せしめ、かつ耐久性をもたせることは
困難であつた。 Additionally, as shown in Figure 3, it is possible to increase the contact area by bending the end of the contact 1 to the lead part 6 of the IC under test, but this will also greatly reduce the electrical resistance and improve durability. It was difficult to give them sexuality.
この考案は、上記の欠点を除去するためになさ
れたもので、接触子とリード部とを面接触にする
ことで大電流を流した時の電気抵抗を低減するこ
とを目的とするものである。以下この考案につい
て説明する。 This idea was made to eliminate the above-mentioned drawbacks, and aims to reduce the electrical resistance when a large current is passed by making surface contact between the contact and the lead part. . This idea will be explained below.
第４図ａ，ｂはこの考案の一実施例を示すハン
ドラの側面図および正面図で、接触子１の先端部
にリード部６と直接面接触する金属片８を回動自
在に取り付け、常に安定した面接触が得られるよ
うにしたものである。 4a and 4b are a side view and a front view of a handler showing an embodiment of this invention, in which a metal piece 8 which is in direct surface contact with the lead part 6 is rotatably attached to the tip of the contact 1, and This ensures stable surface contact.
次に作用について説明する。接触子１の先端に
取り付けた金属片８を被測定ICのリード部６に
接触させた場合、接触面積が大きく、また、リー
ド部６と接触子１の当たる角度に応じて第５図〜
第８図に示すように可動部８ａが動き無理なくリ
ード部６と接触するので、各リード部６と接触子
１の当たりの強さのバラツキがなくなる。 Next, the effect will be explained. When the metal piece 8 attached to the tip of the contactor 1 is brought into contact with the lead part 6 of the IC to be measured, the contact area is large, and depending on the angle at which the lead part 6 and the contactor 1 come into contact, the contact area is
As shown in FIG. 8, since the movable portion 8a moves smoothly and comes into contact with the lead portion 6, there is no variation in the strength of contact between each lead portion 6 and the contact 1.
また、接触子１とリード部６との接触が強固な
ため、大電流を流した時十分電気抵抗を低く抑え
ることができ、安定な電圧条件が得られる。ま
た、面接触が得られることからサージによる突発
的な大電流に対しても接触子の劣化も少ない。 Furthermore, since the contact between the contactor 1 and the lead portion 6 is strong, the electrical resistance can be kept sufficiently low when a large current is passed, and stable voltage conditions can be obtained. Furthermore, since surface contact is achieved, there is little deterioration of the contactor even in the event of sudden large currents caused by surges.
〔考案の効果〕 以上説明したように、この考案は、被測定IC
の各リード部にそれぞれ接触子を接触せしめて電
気信号を加えて電気的測定を行う半導体試験装置
において、前記接触子の先端に回動自在に面接触
が得られるように金属片を取り付けたので、被測
定ICのリード部の形状、すなわちリード部に接
触子が接触する角度に応じて金属片が回動し常に
安定した面接触が得られる。したがつて、大電流
を流しても電気抵抗を低く抑えることができ、安
定した電気的測定が実現できる。しかも従来のよ
うにばね力等を利用していないので、長期に亙る
使用によつても疲労による接触不良等が発生しな
い利点がある。[Effects of the invention] As explained above, this invention
In a semiconductor testing device that performs electrical measurements by applying electrical signals to each lead by contacting each lead, a metal piece is attached to the tip of the contact so that it can rotate freely and make surface contact. The metal piece rotates according to the shape of the lead part of the IC to be measured, that is, the angle at which the contact contacts the lead part, and stable surface contact is always obtained. Therefore, even when a large current is passed, the electrical resistance can be kept low, and stable electrical measurements can be achieved. In addition, since spring force or the like is not used as in the conventional case, there is an advantage that poor contact due to fatigue does not occur even after long-term use.
第１図ａ，ｂは従来の半導体試験装置の概略を
示す側面図および正面図、第２図は従来のリード
部と接触子との接触状態を示す側面図、第３図は
従来の他の接触状態を示す側面図、第４図ａ，ｂ
はこの考案の一実施例を示す半導体試験装置の側
面図および正面図、第５図〜第８図はこの考案に
よるリード部と接触子との接触態様を示す図であ
る。 図中、１は接触子、２は固定治具、３は固定ネ
ジ、４は押え治具、５はモールド部、６はリード
部、７はハンドラレール、８は金属片、８ａは可
動部である。なお、図中の同一符号は同一または
相当部分を示す。 Figures 1a and b are side and front views showing an outline of a conventional semiconductor testing device, Figure 2 is a side view showing the contact state between a conventional lead and a contact, and Figure 3 is a side view and a front view showing an outline of a conventional semiconductor testing device. Side view showing the contact state, Figure 4 a, b
5 is a side view and a front view of a semiconductor testing device showing an embodiment of this invention, and FIGS. 5 to 8 are diagrams showing the manner of contact between a lead portion and a contactor according to this invention. In the figure, 1 is a contact, 2 is a fixing jig, 3 is a fixing screw, 4 is a holding jig, 5 is a mold part, 6 is a lead part, 7 is a handler rail, 8 is a metal piece, and 8a is a movable part. be. Note that the same reference numerals in the figures indicate the same or corresponding parts.
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7207384UJPS60183879U (en) | 1984-05-15 | 1984-05-15 | Semiconductor test equipment contacts |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7207384UJPS60183879U (en) | 1984-05-15 | 1984-05-15 | Semiconductor test equipment contacts |
| Publication Number | Publication Date |
|---|---|
| JPS60183879U JPS60183879U (en) | 1985-12-06 |
| JPH0428067Y2true JPH0428067Y2 (en) | 1992-07-07 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7207384UGrantedJPS60183879U (en) | 1984-05-15 | 1984-05-15 | Semiconductor test equipment contacts |
| Country | Link |
|---|---|
| JP (1) | JPS60183879U (en) |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008031742A (en)* | 2006-07-28 | 2008-02-14 | Raiteku:Kk | Avalanche, rock fall, and other protective props and manufacturing aids |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5385234B2 (en)* | 2010-09-21 | 2014-01-08 | 富士通テレコムネットワークス株式会社 | Contact probe and charge / discharge device |
| WO2013001910A1 (en)* | 2011-06-27 | 2013-01-03 | Ｊｘ日鉱日石エネルギー株式会社 | Solar cell measurement jig |
| JPWO2013001911A1 (en)* | 2011-06-27 | 2015-02-23 | Ｊｘ日鉱日石エネルギー株式会社 | Solar cell measurement jig |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4957370A (en)* | 1972-10-04 | 1974-06-04 | ||
| JPS5040753A (en)* | 1973-08-13 | 1975-04-14 | ||
| JPS5733416Y2 (en)* | 1977-05-13 | 1982-07-23 | ||
| JPS58180953A (en)* | 1982-04-15 | 1983-10-22 | Mitsubishi Electric Corp | measuring device |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008031742A (en)* | 2006-07-28 | 2008-02-14 | Raiteku:Kk | Avalanche, rock fall, and other protective props and manufacturing aids |
| Publication number | Publication date |
|---|---|
| JPS60183879U (en) | 1985-12-06 |
| Publication | Publication Date | Title |
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