【発明の詳細な説明】〔産業上の利用分野］本発明は、絶縁耐圧に優れた高放熱特性を有するセラミ
ックス回路基板の製造方法に関し、さらに詳しくは銅板
の架橋部分の除去方法に係るものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method for manufacturing a ceramic circuit board having excellent dielectric strength and high heat dissipation characteristics, and more specifically relates to a method for removing a bridged portion of a copper plate. be.
［従来の技術］銅とＡρＮセラミックス焼結体を接合してなるセラミッ
クス回路基板は絶縁耐圧に優れ高放熱特性を有するもの
でその回路形成の方法には次の（１）銅とＡβＮを接合
した後、化学エツチング等により金属部分を腐食、除去
する方法。[Prior art] Ceramic circuit boards made by bonding copper and AβN ceramic sintered bodies have excellent dielectric strength and high heat dissipation properties, and the circuit formation method includes the following (1) bonding of copper and AβN. Afterwards, the metal parts are corroded and removed using chemical etching, etc.
この方法は銅とＡβＮとの接合を活性金属を混入したろ
う材によって行う場合、ろう材層、活性金属窒化物層等
の腐食が困難であり、さらに熱応力等の関係から大型の
接合体に対しては施工できない限界があり、多数個数り
による製造方法を用いるには限界がある。したがって、
回路基板を個別取り方式で製造しなければならず、多（
の作業工数を要するという問題がある。In this method, when copper and AβN are bonded using a brazing filler metal mixed with an active metal, corrosion of the brazing filler metal layer, active metal nitride layer, etc. is difficult, and furthermore, due to thermal stress etc., it is difficult to use a large bonded body. However, there is a limit to the fact that it cannot be used for construction, and there is a limit to the use of a manufacturing method that involves counting a large number of pieces. therefore,
The circuit boards must be manufactured individually, which requires a large number of
There is a problem in that it requires many man-hours.
（２）予め回路形成した銅板をＡａＮ板に接合する方法
。(2) A method of bonding a copper plate on which a circuit has been formed in advance to an AaN plate.
この方法は上記（１）の方法に比べて、接合以外に技術
的な問題はなく、量産も可能で、量産によるコスト低減
を図ることができる方法である。Compared to the method (1) above, this method has no technical problems other than bonding, can be mass-produced, and is a method that can reduce costs through mass-production.
この場合、通常１枚の基板の上の回路は複数の部分より
なり、それらの複数の回路部分は接合途中でその配置に
ズレが生じないように架橋によって互いに連結されてい
る。In this case, the circuit on one substrate usually consists of a plurality of parts, and the plurality of circuit parts are connected to each other by bridges so that the arrangement does not shift during joining.
この架橋を、銅板とＡａＮ板を接合した後除去する方法
として、次の２つかある。There are two methods for removing this bridge after bonding the copper plate and the AaN plate.
（ａ）ニッパ等の工具で架橋を切断する。(a) Cut the bridge using a tool such as nippers.
この手段は作業としては単純容易であるが、パリが残り
やすく、そのパリのために絶縁耐圧が大幅に低下するこ
とが問題であった。Although this method is simple and easy to work with, it has the problem that it tends to leave particles and the insulation voltage is significantly lowered due to the particles.
（ｂ）架橋以外をマスクし、化学エツチング等の方法に
より溶解する。(b) Mask off anything other than crosslinking and dissolve by a method such as chemical etching.
この手段は個別に対応しなければならないのでほぼ前記
回路形成方法（１）に匹敵するような工数を要する。Since this means must be handled individually, it requires a number of man-hours comparable to that of the circuit forming method (1).
［発明が解決しようとする課題１本発明は、上記（２）の回路形成技術によって大量生産
できる技術に改善を加え、架橋を簡易に除去し、この架
橋除去工程も高能率で実現し、全体工程を高能率大量生
産方式とすることができる方法を提供しようとするもの
である。[Problem to be Solved by the Invention 1] The present invention improves the technology that enables mass production using the circuit formation technology described in (2) above, easily removes crosslinks, realizes this crosslink removal process with high efficiency, and improves overall efficiency. The purpose of this invention is to provide a method that allows the process to be carried out in a highly efficient mass production manner.
［課題を解決するための手段］本発明は、予め回路形成した回路同士が架橋により連結
された銅板をＡｆｆＮセラミックスに接合した後、架橋
を除去するに当り、架橋を電流供給ラインとして用いて
電解研磨し、架橋を除去することを特徴とする。[Means for Solving the Problems] The present invention provides that after bonding a copper plate in which pre-formed circuits are connected by cross-linking to AffN ceramics and then removing the cross-links, electrolysis is performed using the cross-links as a current supply line. It is characterized by polishing and removing crosslinks.
［作用］本発明は銅板に架橋を通る電気回路を形成して陽極とし
、別に陰極を設けて電解研磨すると、細く形成されてい
る架橋は真先に消滅するので、この原理によって架橋を
除去しようとするものである。この場合、銅板に架橋を
通るどのような電気回路を設けるかは実情に応じて当業
者が適切な回路設計を行うことができ、最適条件下で架
橋除去を達成することができる。[Function] In the present invention, when an electric circuit is formed on a copper plate through a bridge to serve as an anode, and a cathode is separately provided and electropolishing is performed, the thin bridge formed will disappear first, so the bridge can be removed using this principle. That is. In this case, a person skilled in the art can appropriately design an electric circuit that passes through the bridges on the copper plate depending on the actual situation, and remove the bridges under optimal conditions.
第１図は本発明の詳細な説明するための銅板１の模式平
面図である。銅板ｌは枠２の内側に電子回路を形成した
回路板３が多数の架橋４によって連結支持されている。FIG. 1 is a schematic plan view of a copper plate 1 for explaining the present invention in detail. A copper plate 1 has a circuit board 3 on which an electronic circuit is formed inside a frame 2 and is connected and supported by a large number of bridges 4.
ＡｌＮ基板５は破線で示しである。枠２から各回路板３
を直列に結ぶ架橋のみ残してその他はニッパ等で切断し
て、電解研磨用の電気回路を形成してもよい。また、予
め、枠２に連結していな・い架橋を細く形成しておき、
枠を陽極として電解研磨すれば、細い架橋が先に除去さ
れる。このようにして順次設計通りの順序で除去するこ
とができる。The AlN substrate 5 is indicated by a broken line. From frame 2 to each circuit board 3
An electric circuit for electrolytic polishing may be formed by leaving only the bridges connecting the two in series and cutting the rest using nippers or the like. In addition, a thin bridge that is not connected to the frame 2 is formed in advance,
If electrolytic polishing is performed using the frame as an anode, the thin crosslinks will be removed first. In this way, they can be removed one after another in the designed order.
［実施例］実施例１回路のすべての個別部分を通って開開路が形成されるの
に必要な架橋を残して、その他すべての架橋をニッパで
切断した後、銅板の枠に電源をつなぎ込んで陽極とし、
陰極としてＴｉ板を陽極より５〜２０ｍｍ離して設置し
、５０％リン酸水溶液中で直流４〜５■、６Ａの通電を
１５分行った。ニッパ切断後に出ていたパリが溶解し、
次いで架橋が溶解した。[Example] Example 1 After cutting all the bridges with nippers, leaving only the bridges necessary to form an open circuit through all the individual parts of the circuit, a power supply is connected to the frame of the copper plate. as an anode,
A Ti plate was placed as a cathode at a distance of 5 to 20 mm from the anode, and a DC current of 4 to 5 μm and 6 A was applied for 15 minutes in a 50% phosphoric acid aqueous solution. The paris that came out after cutting with the nippers dissolves,
The crosslinks were then dissolved.
実施例２架橋のうち銅板の枠に直接連結していない架橋の幅を直
接連結している架橋よりも細い寸法に設計しておく。Example 2 Among the bridges, the width of the bridges that are not directly connected to the frame of the copper plate is designed to be narrower than the width of the bridges that are directly connected.
銅板の枠に電源をつなぎこんで陽極とし、陰極としてＴ
１板を陽極より５〜２０ｍｍ離して設置し５０％リン酸
水溶液中で直流４〜５■、６Ａの通電を１０分間行った
ところ、細い寸法にしてあった架橋が溶解された。続い
てさらに１０分間通電したところ残っていた架橋もすべ
て溶解された。A power source is connected to the copper plate frame as an anode, and T is used as a cathode.
When one plate was placed 5 to 20 mm apart from the anode and energized with a direct current of 4 to 5 amps and 6 A for 10 minutes in a 50% phosphoric acid aqueous solution, the thin crosslinks were dissolved. Subsequently, when electricity was applied for another 10 minutes, all remaining crosslinks were dissolved.
［発明の効果］本発明によれば、予め回路形成した銅板をＡ℃Ｎセラミ
ックス焼結体に接合して形成した、絶縁耐圧に優れ、高
放熱性を有するセラミックス回路基板の架橋除去を大量
生産可能な高能率で施工することができ、貢献するとこ
ろが大である。[Effects of the Invention] According to the present invention, it is possible to mass-produce the removal of crosslinks from a ceramic circuit board having excellent dielectric strength and high heat dissipation, which is formed by bonding a copper plate on which a circuit has been formed in advance to an ACN ceramic sintered body. It can be constructed with the highest possible efficiency, which makes a major contribution.
第１図はセラミックス回路基板の銅板の架橋された状態
の平面図である。１・・・銅板 ２・・・枠３・・回路 ４・・架橋５・・・セラミックスFIG. 1 is a plan view of a cross-linked copper plate of a ceramic circuit board. 1...Copper plate 2...Frame 3...Circuit 4...Bridge 5...Ceramics
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29357690AJPH04168789A (en) | 1990-11-01 | 1990-11-01 | Manufacture of ceramic circuit board |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29357690AJPH04168789A (en) | 1990-11-01 | 1990-11-01 | Manufacture of ceramic circuit board |
| Publication Number | Publication Date |
|---|---|
| JPH04168789Atrue JPH04168789A (en) | 1992-06-16 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29357690APendingJPH04168789A (en) | 1990-11-01 | 1990-11-01 | Manufacture of ceramic circuit board |
| Country | Link |
|---|---|
| JP (1) | JPH04168789A (en) |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002022916A1 (en)* | 2000-09-18 | 2002-03-21 | Obducat Aktiebolag | Method of etching, as well as frame element, mask and prefabricated substrate element for use in such etching |
| US6656341B2 (en) | 2000-09-18 | 2003-12-02 | Obducat Aktiebolag | Method of etching, as well as frame element, mask and prefabricated substrate element for use in such etching |
| WO2018110104A1 (en)* | 2016-12-16 | 2018-06-21 | Ｊｘ金属株式会社 | Metal plate for circuit board, circuit board, power module, metal plate molded article, method for manufacturing circuit board |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002022916A1 (en)* | 2000-09-18 | 2002-03-21 | Obducat Aktiebolag | Method of etching, as well as frame element, mask and prefabricated substrate element for use in such etching |
| US6656341B2 (en) | 2000-09-18 | 2003-12-02 | Obducat Aktiebolag | Method of etching, as well as frame element, mask and prefabricated substrate element for use in such etching |
| WO2018110104A1 (en)* | 2016-12-16 | 2018-06-21 | Ｊｘ金属株式会社 | Metal plate for circuit board, circuit board, power module, metal plate molded article, method for manufacturing circuit board |
| JP2018098467A (en)* | 2016-12-16 | 2018-06-21 | Ｊｘ金属株式会社 | Circuit board metal plate, circuit board, power module, metal plate molded component and circuit board manufacturing method |
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