【発明の詳細な説明】〔概要〕金型のキャビティに熱硬化性樹脂を圧送して封止成形を
行う樹脂封止型半導体装置の製造方法に関し、キャビテ
ィまでの圧送経路で熱硬化して廃棄される封止成形用樹
脂を少な（し、封止成形用樹脂と分離して再利用可能な
樹脂を用いて樹脂の利用効率の向上を図ることができる
ようにすることを目的とし、角型のポットに熱硬化性の
封止成形用樹脂及び熱硬化性のない弾性の圧送補助用樹
脂を供給し、該封止成形用樹脂とプランジャーの間に圧
送補助用樹脂を介在させて該プランジャーにより該封止
成形用樹脂をキャビティに圧送して熱硬化させて封止成
形し、熱硬化した該封止成形用樹脂より該圧送補助用樹
脂を分離するように構成する。[Detailed Description of the Invention] [Summary] A method for manufacturing a resin-sealed semiconductor device in which a thermosetting resin is pressure-fed into a mold cavity to perform sealing molding. The aim is to reduce the amount of resin used for sealing molding (and to improve resin usage efficiency by using resin that can be separated from the resin used for sealing molding and reused). A thermosetting sealing molding resin and a non-thermosetting elastic pressure feeding assisting resin are supplied to the pot, and the pumping assisting resin is interposed between the sealing molding resin and the plunger. The resin for sealing molding is pumped into the cavity by a jar, and the molding resin is thermally cured to perform sealing molding, and the resin for assisting pressure feeding is separated from the thermoset resin for sealing molding.
本発明は、金型のキャビティに熱硬化性樹脂を圧送して
封止成形を行う樹脂封止型半導体装置の製造方法に関す
る。The present invention relates to a method for manufacturing a resin-sealed semiconductor device, which performs sealing molding by pumping a thermosetting resin into a mold cavity.
樹脂封止型半導体装置は、加熱された金型のボット内ニ
、予め加熱された樹脂タブレットを供給し、そレヲプラ
ンジャーにより徐々に加圧して、カルからランナー、ゲ
ート、キャビティへと圧送して、キャビティに配置した
半導体素子搭載のリードフレームを封止成形するトラン
スファーモールド方法により製造される。In the resin-sealed semiconductor device, a pre-heated resin tablet is supplied into the heated mold bot, which is then gradually pressurized with a plunger and then forcedly fed from the cull to the runner, gate, and cavity. It is manufactured by a transfer molding method in which a lead frame mounted with a semiconductor element placed in a cavity is sealed and molded.
この方法により封止成形を完了すると金型内の樹脂は、
キャビティ内に充填される以外に、カル、ランナー、ゲ
ートに残留する。この残留樹脂は廃棄処分となるので、
樹脂封止型半導体装置の封止成形に用いられる高価な樹
脂が残留樹脂として多く廃棄処分になると、コスト的に
無駄が多いため、第３図のように残留樹脂となる部分を
安価な樹脂１２にすることが提案されている（特開昭６
１−３５９２０号公報）。これは第３図（ａ）のように
、ポット６内に封止成形用樹脂１１と安価な樹脂１２を
供給し、プランジャー５により徐々に加圧して、カル１
ｏからランナー９、ゲート８、キャビティ７へと圧送し
て、第３図（ｂ）のように封止成形する。When sealing molding is completed using this method, the resin inside the mold will
In addition to filling the cavity, it remains in the cull, runner, and gate. This residual resin will be disposed of, so
If a large amount of the expensive resin used for encapsulation molding of resin-encapsulated semiconductor devices is disposed of as residual resin, there is a lot of waste in terms of cost. It has been proposed that the
1-35920). As shown in FIG. 3(a), the molding resin 11 and the inexpensive resin 12 are supplied into the pot 6, and pressure is gradually applied using the plunger 5.
o, to the runner 9, gate 8, and cavity 7, and is sealed and molded as shown in FIG. 3(b).
しかし第３図（ｂ）の封止成形で熱硬化した樹脂１１．
１２は、金型３，４を開いて取り出され、キャビティ７
部の樹脂以外は廃棄処分となるので、安価な樹脂１２を
用いても廃棄樹脂の量が多く、製造コストを安くするに
は限界があった。However, the resin 11 that was thermoset during the sealing molding shown in FIG.
12 is taken out by opening the molds 3 and 4 and placed in the cavity 7.
Since all resins other than those listed above are discarded, even if the inexpensive resin 12 is used, the amount of waste resin is large, and there is a limit to reducing manufacturing costs.
本発明は、キャビティまでの圧送経路で熱硬化して廃棄
される封止成形用樹脂を少なくし、封止成形用樹脂と分
離して再利用可能な樹脂を用いて樹脂の利用効率の向上
を図ることができるようにすることを目的とする。The present invention reduces the amount of sealing resin that is discarded by heat curing in the pressure feeding route to the cavity, and improves resin usage efficiency by using a resin that can be separated from the sealing resin and reused. The purpose is to make it possible to achieve this goal.
本発明によれば、上記目的は、金型のポットに熱硬化性
の封止成形用樹脂及び熱硬化性のない弾性の圧送補助用
樹脂を供給し、該封止成形用樹脂とプランジャーの間に
圧送補助用樹脂を介在させて該プランジャーにより該封
止成形用樹脂をキャビティに圧送して熱硬化させて封止
成形し、熱硬化した該封止成形用樹脂より該圧送補助用
樹脂を分離することを特徴とする樹脂封止型半導体装置
の製造方法により達成される。According to the present invention, the above object is to supply a thermosetting sealing resin and a non-thermosetting elastic pressure feeding assisting resin to a pot of a mold, and to mix the sealing resin and a plunger. The sealing molding resin is pumped into the cavity by the plunger with a pressure feeding auxiliary resin interposed between the two, and the sealing molding resin is thermoset and sealed, and the pressure feeding auxiliary resin is transferred from the thermoset sealing resin to the cavity. This is achieved by a method for manufacturing a resin-sealed semiconductor device, which is characterized by separating the two.
本発明では、封止成形用樹脂１をキャビティ７に圧送す
るための圧送補助用の樹脂２として熱硬化性のない弾性
の樹脂を用いることにより、その圧送補助用の樹脂２は
封止成形後、熱硬化した封止成形用樹脂１より分離して
封止成形のために再利用できる。In the present invention, by using a non-thermosetting elastic resin as the pressure-feeding aid resin 2 for pressure-feeding the sealing molding resin 1 into the cavity 7, the pressure-feeding aid resin 2 can be used after the sealing molding. It can be separated from the thermoset sealing molding resin 1 and reused for sealing.
第１図は本発明の実施例の樹脂封止型半導体装置の製造
方法に係る断面図である。以下、図面を参照して本発明
の詳細な説明する。FIG. 1 is a cross-sectional view of a method of manufacturing a resin-sealed semiconductor device according to an embodiment of the present invention. Hereinafter, the present invention will be described in detail with reference to the drawings.
まず第１図（ａ）のように、金型３のポット６内に、フ
ェノール等の熱硬化剤を含有させた熱硬化性のエポキシ
樹脂等よりなる封止成形用樹脂１のタブレットと、シリ
コンゴム等の可とう性に優れた材料よりなる圧送補助用
樹脂２を供給する。First, as shown in FIG. 1(a), a tablet of sealing resin 1 made of thermosetting epoxy resin containing a thermosetting agent such as phenol and silicone are placed in a pot 6 of a mold 3. A pumping aid resin 2 made of a material with excellent flexibility such as rubber is supplied.
次に封止成形用樹脂１を、圧送補助用樹脂２を介してプ
ランジャー５により徐々に加圧し、封止成形用樹脂１を
カル１０からランナー９、ゲート８、キャビティ７へ圧
送して、第１図（ｂ）のようにキャビティ７への封止成
形用樹脂１の充填を完了させ、熱硬化させて封止成形す
る。キャビティ７には、予め半導体素子１４が搭載され
、半導体素子１４とリード間でワイヤー接続がされたリ
ードフレーム１３を、上型３と下型４で挟んで配置して
おく。Next, the sealing molding resin 1 is gradually pressurized by the plunger 5 via the pressure feeding assisting resin 2, and the sealing molding resin 1 is pressure-fed from the cull 10 to the runner 9, the gate 8, and the cavity 7. As shown in FIG. 1(b), the filling of the sealing resin 1 into the cavity 7 is completed, and the resin 1 is thermally cured to perform sealing. A semiconductor element 14 is mounted in advance in the cavity 7, and a lead frame 13 with wire connections made between the semiconductor element 14 and the leads is placed between an upper mold 3 and a lower mold 4.
次に圧送補助用樹脂２を熱硬化した封止成形、用樹脂１
より分離して、再利用する。Next, sealing molding is carried out by thermosetting resin 2 for pressure feeding assistance, resin 1 for
Separate and reuse.
封止成形樹脂１の圧送の過程において、圧送補助用樹脂
１は容易に変形するため、封止成形用樹脂ｌへの圧力が
不足することはなく、金型を破損する心配もない、封止
成形後は、延ばされた圧送補助用樹脂２は熱硬化せず、
封止成形用樹脂２と混ざらず、離型性があり、圧送前の
形に復帰するように、封止成形用樹脂１より容易に分離
できる。なお、圧送補助用樹脂２がランナー９の途中ま
で長く延びてポット６に入らなくなったら、ポットに入
る形状に成形して再利用する。In the process of pressure feeding the sealing molding resin 1, the pressure feeding assisting resin 1 is easily deformed, so there is no shortage of pressure on the sealing resin 1, and there is no fear of damaging the mold. After molding, the stretched pressure-feeding aid resin 2 is not thermoset;
It does not mix with the sealing molding resin 2, has releasability, and can be easily separated from the sealing molding resin 1 so as to return to the shape before pressure feeding. In addition, when the pressure-feeding assisting resin 2 extends to the middle of the runner 9 and cannot fit into the pot 6, it is molded into a shape that can fit into the pot and is reused.
上述の実施例では、圧送補助用樹脂２を封止成形用樹脂
１と同様にポット６内に供給したが・第２図のように圧
送補助用樹脂２をプランジャー５の先端に取付け、繰り
返し使用するようにしてもよい。In the above embodiment, the pressure feeding assisting resin 2 was supplied into the pot 6 in the same manner as the sealing molding resin 1, but the pressure feeding assisting resin 2 was attached to the tip of the plunger 5 as shown in FIG. You may also use it.
なお、本発明の圧送補助用樹脂２は、シリコンゴムの他
にシリコンオイル、テフロン等でもよい。また、金型は
、シングル・ブラジャ一方式だけでなく、比較的、樹脂
効率の高いマルチ、プランジャ一方式％式％〔発明の効果〕本発明によれば、キャビティまでの圧送経路で熱硬化し
て廃棄される封止成形用樹脂を少なくし、封止成形用樹
脂と分離して再利用可能な樹脂を用いて樹脂の利用効率
の向上を図ることができ、樹脂封止型半導体装置の製造
に係るコストを安価にできる。In addition, the pressure feeding assisting resin 2 of the present invention may be silicone oil, Teflon, etc. in addition to silicone rubber. In addition, the mold is not only a single brass type but also a multi-type mold with relatively high resin efficiency and a single plunger type. This makes it possible to reduce the amount of encapsulating resin that is discarded and improve resin usage efficiency by using a resin that can be separated from the encapsulating resin and reused. The costs associated with this can be reduced.
第１図は本発明の実施例の樹脂封止型半導体装置の製造
方法に係る断面図、第２図は本発明の別の実施例の樹脂封止型半導体装置の
製造方法に係る断面図、第３図は従来の樹脂封止型半導体装置の製造方法を示す
断面図である。図中、１・・・２・・・３・・・４・・・５・・・６・・・７・・・８・・・９・・・ｌＯ・・・１３・・・１４・・・封止成形用樹脂圧送補助用樹脂金型・上型金型・下型プランジャーポットキャビティゲートランナーカルリードフレーム半導体素子。（α）１２ 記（しン′１忙果のｍ腸月′止型牛３４柿装置の製造方５或Σ示
１〕野面記劣 ３ 記FIG. 1 is a cross-sectional view of a method of manufacturing a resin-sealed semiconductor device according to an embodiment of the present invention, FIG. 2 is a cross-sectional view of a method of manufacturing a resin-sealed semiconductor device of another embodiment of the present invention, FIG. 3 is a cross-sectional view showing a conventional method for manufacturing a resin-sealed semiconductor device. In the figure, 1... 2... 3... 4... 5... 6... 7... 8... 9... lO... 13... 14... - Resin molds for assisting resin pumping for sealing molding, upper molds, lower plunger pots, cavities, gate runners, lead frames, semiconductor devices. (α) 12 Notes (Shin'1 Engagement's M Intestinal Moon' Stop Type Cow 34 How to Manufacture Persimmon Device 5 or Σ Show 1) Nomenki 3 Notes
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21584489AJPH0379045A (en) | 1989-08-22 | 1989-08-22 | Manufacture of resin-sealed semiconductor device |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21584489AJPH0379045A (en) | 1989-08-22 | 1989-08-22 | Manufacture of resin-sealed semiconductor device |
| Publication Number | Publication Date |
|---|---|
| JPH0379045Atrue JPH0379045A (en) | 1991-04-04 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21584489APendingJPH0379045A (en) | 1989-08-22 | 1989-08-22 | Manufacture of resin-sealed semiconductor device |
| Country | Link |
|---|---|
| JP (1) | JPH0379045A (en) |
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|---|---|---|---|---|
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| EP0681897A1 (en)* | 1994-03-25 | 1995-11-15 | Texas Instruments Incorporated | Resin sealing method and device |
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| US11660693B2 (en) | 2020-04-13 | 2023-05-30 | Sodick Co., Ltd. | Electric discharge machine |
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|---|---|---|---|---|
| JPH05228735A (en)* | 1992-02-17 | 1993-09-07 | Mitsubishi Electric Corp | Machining liquid supply device for wire electric discharge machine |
| EP0681897A1 (en)* | 1994-03-25 | 1995-11-15 | Texas Instruments Incorporated | Resin sealing method and device |
| US5882692A (en)* | 1994-07-06 | 1999-03-16 | Sony Corporation | Resin molding apparatus |
| JPH08243314A (en)* | 1995-03-13 | 1996-09-24 | N Ii:Kk | Filter element |
| JPH0945712A (en)* | 1995-07-28 | 1997-02-14 | Nec Corp | Resin tablet for sealing semiconductor device |
| JP2010193418A (en)* | 2009-01-22 | 2010-09-02 | Sony Corp | Speaker mounting member for display device |
| US11660693B2 (en) | 2020-04-13 | 2023-05-30 | Sodick Co., Ltd. | Electric discharge machine |
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