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JPH0282578U - - Google Patents

Info

Publication number
JPH0282578U
JPH0282578UJP16152288UJP16152288UJPH0282578UJP H0282578 UJPH0282578 UJP H0282578UJP 16152288 UJP16152288 UJP 16152288UJP 16152288 UJP16152288 UJP 16152288UJP H0282578 UJPH0282578 UJP H0282578U
Authority
JP
Japan
Prior art keywords
laminate
input
circuit pattern
case plate
circuit elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16152288U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filedfiledCritical
Priority to JP16152288UpriorityCriticalpatent/JPH0282578U/ja
Publication of JPH0282578UpublicationCriticalpatent/JPH0282578U/ja
Pendinglegal-statusCriticalCurrent

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Description

Translated fromJapanese
【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来カードの説明図、第2図、第3図
は本考案の一実施例の説明図、第4図、第5図は
本考案の他の実施例の説明図である。 1……インターフエース用コネクタ、2……基
板、3……絶縁材のケース、4a,4b……金属
製のカバー板、5……接続用金属ばね、6……積
層板、6a……金属板、6b……絶縁層、6c…
…配線回路パターン、6d……折曲げ部、6e…
…電池交換穴、6f……電池接続具、6g……ラ
イトプロテクトスイツチ穴、7……回路素子、8
……間隔ケース板、8a……素子収容部、9……
相手コネクタ差込み面。
FIG. 1 is an explanatory diagram of a conventional card, FIGS. 2 and 3 are explanatory diagrams of one embodiment of the present invention, and FIGS. 4 and 5 are explanatory diagrams of another embodiment of the present invention. DESCRIPTION OF SYMBOLS 1... Interface connector, 2... Board, 3... Insulating material case, 4a, 4b... Metal cover plate, 5... Metal spring for connection, 6... Laminate board, 6a... Metal Plate, 6b... Insulating layer, 6c...
...Wiring circuit pattern, 6d...Bending portion, 6e...
...Battery replacement hole, 6f...Battery connection tool, 6g...Write protect switch hole, 7...Circuit element, 8
... Spacing case plate, 8a... Element housing section, 9...
Mating connector insertion surface.

Claims (1)

Translated fromJapanese
【実用新案登録請求の範囲】[Scope of utility model registration request] 金属板上に絶縁層を介して配線回路パターンを
形成した積層体の上記配線回路パターン面に、メ
モリ回路素子などの所要回路素子と入出力回路の
接続部とを設けると共に、この積層板を前記入力
回路との接続面を残すように間隔ケース板を挟ん
で2つ折りして間隔ケース板の両面に接着してな
るメモリカード。
Connecting parts for necessary circuit elements such as memory circuit elements and input/output circuits are provided on the wiring circuit pattern surface of a laminate in which a wiring circuit pattern is formed on a metal plate via an insulating layer, and the laminate is A memory card that is made by folding the spacer case plate in half so as to leave the connection surface with the input circuit, and then gluing it to both sides of the spacer case plate.
JP16152288U1988-12-131988-12-13PendingJPH0282578U (en)

Priority Applications (1)

Application NumberPriority DateFiling DateTitle
JP16152288UJPH0282578U (en)1988-12-131988-12-13

Applications Claiming Priority (1)

Application NumberPriority DateFiling DateTitle
JP16152288UJPH0282578U (en)1988-12-131988-12-13

Publications (1)

Publication NumberPublication Date
JPH0282578Utrue JPH0282578U (en)1990-06-26

Family

ID=31444532

Family Applications (1)

Application NumberTitlePriority DateFiling Date
JP16152288UPendingJPH0282578U (en)1988-12-131988-12-13

Country Status (1)

CountryLink
JP (1)JPH0282578U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US7507615B2 (en)1990-11-092009-03-24Semiconductor Energy Laboratory Co., Ltd.Method of manufacturing gate insulated field effect transistors

Cited By (1)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US7507615B2 (en)1990-11-092009-03-24Semiconductor Energy Laboratory Co., Ltd.Method of manufacturing gate insulated field effect transistors

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