【発明の詳細な説明】〔概要〕発熱量の大きな半導体装置やＶＬＳＩを高密度に実装し
た回路基板を高効率に冷却するための強制対流沸騰冷却
装置に関し。[Detailed Description of the Invention] [Summary] The present invention relates to a forced convection boiling cooling device for highly efficiently cooling circuit boards on which semiconductor devices and VLSIs that generate a large amount of heat are densely mounted.
循環系内の冷媒１気気泡を効率良く除去し、かつ冷媒液
体の熱交換を効率良く行えるようにすることを目的とし
。The purpose is to efficiently remove one bubble of refrigerant in a circulation system and to efficiently exchange heat between refrigerant liquids.
冷却容器内に格納された複数個の回路素子を搭載した回
路基板を冷媒液体の強制対流および沸騰により放熱する
冷却装置において、冷却容器の外部に、冷却容器から導
出される冷媒液体を冷却した後に再び冷却容器内に導入
するための熱交換器を設け、熱交換器内の冷媒液体を流
すための管を多孔質材料からなる中空管で形成し１回路
素子の表面から発生し、冷媒液体中に含まれる気泡が多
孔質中空管から浸出して発生する冷媒蒸気を吸引して圧
縮・液化するためのコンプレフサを設けるように構成す
る。In a cooling device that dissipates heat from a circuit board equipped with multiple circuit elements housed in a cooling container by forced convection and boiling of a refrigerant liquid, the refrigerant liquid drawn out from the cooling container is cooled to the outside of the cooling container. A heat exchanger is provided to introduce the refrigerant liquid into the cooling container again, and a tube for flowing the refrigerant liquid in the heat exchanger is formed of a hollow tube made of a porous material. A compressor is provided to suck in the refrigerant vapor generated when the air bubbles contained therein seep out from the porous hollow tube, and compress and liquefy it.
本発明は、冷却装置、特に発熱量の大きな半導体装置や
ＶＬＳ Ｉを高密度に実装した回路基板を高効率に冷却
するための強制対流沸騰冷却装置に関する。The present invention relates to a cooling device, and particularly to a forced convection boiling cooling device for highly efficiently cooling a circuit board on which semiconductor devices and VLSIs that generate a large amount of heat are densely mounted.
近年、大型汎用コンピュータおよびスーパーコンピュー
タに使用される半導体素子の高性能化に伴う消費電力の
増大は著しく、また、素子の高密度実装により１回路基
板の発熱密度の上昇は止まるところを知らない。In recent years, as the performance of semiconductor elements used in large-scale general-purpose computers and supercomputers has improved, power consumption has increased significantly, and the heat density of a single circuit board continues to increase due to high-density mounting of elements.
このため、より効率の良い冷却装置が必要とされている
。Therefore, a more efficient cooling device is needed.
従来、ＬＳＩ等の回路素子を冷却する手段として１回路
素子に放熱フィンを装着したり、ファンにより回路素子
を強制空冷する空冷冷却方式や回路素子を直接冷媒中に
浸漬する冷却方式が採られている。Conventionally, as a means of cooling circuit elements such as LSIs, heat dissipation fins were attached to each circuit element, an air-cooling method in which the circuit elements were forcedly cooled by a fan, and a cooling method in which the circuit elements were directly immersed in refrigerant were adopted. There is.
第３図は、後者に属するプール沸騰型冷却装置を示す図
である。FIG. 3 is a diagram showing a pool boiling type cooling device belonging to the latter category.
第３図において、２０１は回路素子、２０２は実装基板
、２０３は容器、２０４は冷媒液体、２０５は気泡、２
０６は上部空間、２０７は熱交換バイブである。In FIG. 3, 201 is a circuit element, 202 is a mounting board, 203 is a container, 204 is a refrigerant liquid, 205 is a bubble, 2
06 is an upper space, and 207 is a heat exchange vibe.
以下、第３図を用いて、プール沸騰型冷却装置を説明す
る。Hereinafter, the pool boiling type cooling device will be explained using FIG.
複数個の回路素子２０１を搭載した実装基板２０２を容
器２０３中に満たされた冷媒液体２０４の中に浸漬させ
る。A mounting board 202 on which a plurality of circuit elements 201 are mounted is immersed in a refrigerant liquid 204 filled in a container 203.
回路素子２０１が発生する熱は、冷媒液体２０４の沸騰
気化潜熱として吸収される。このとき冷媒液体２０４中
に気泡２０５が発生する。The heat generated by the circuit element 201 is absorbed as latent heat of boiling and vaporization of the refrigerant liquid 204. At this time, bubbles 205 are generated in the refrigerant liquid 204.
気泡２０５は、容器２０３の上部空間２０６に設けられ
た熱交換バイブ２０７により液化される。The air bubbles 205 are liquefied by a heat exchange vibe 207 provided in an upper space 206 of the container 203.
以上９プール沸騰型冷却装置を説明したが、この種の冷
却装置は冷媒液体２０４が容器２０３内に閉じ込められ
ているので、放熱量には限界がある。そこで、より大き
な放熱量を得るために、冷媒液体を強制的に対流させる
１強制対流沸騰冷却装置が提案されている。Although the nine-pool boiling type cooling device has been described above, since the refrigerant liquid 204 is confined within the container 203 in this type of cooling device, there is a limit to the amount of heat radiation. Therefore, in order to obtain a larger amount of heat dissipation, a forced convection boiling cooling device has been proposed in which the refrigerant liquid is forced to undergo convection.
強制対流沸騰冷却装置は、第３図に示したプール沸騰型
冷却装置の容器２０３の外に熱交換器を設け、冷媒液体
を循環ポンプにより、容器２０３と熱交換器との間を循
環させて放熱量を大きくしたものである。A forced convection boiling cooling device is a pool boiling type cooling device shown in FIG. 3, in which a heat exchanger is provided outside the container 203, and a refrigerant liquid is circulated between the container 203 and the heat exchanger using a circulation pump. This increases the amount of heat dissipation.
スがくずれ、安定な冷却を妨げる原因となる脈流が生じ
る。という問題もあった。This causes a pulsating flow that prevents stable cooling. There was also the problem.
高発熱密度の回路基板に対して７強制空冷あるいは伝導
水冷に比べて冷却効率の高い強制対流沸騰冷却を適用す
る際に、最も障害となるのは、流路内で発生する気液２
相流の処理である。When applying forced convection boiling cooling, which has higher cooling efficiency than forced air cooling or conduction water cooling, to circuit boards with high heat generation density, the biggest obstacle is the gas and liquid generated in the flow path.
It is a phase flow process.
本発明は１発熱量の大きな半導体装置やＶＬＳｌを高密
度に実装した回路基板を高効率に冷却することのできる
強制対流沸騰冷却装置を提供することを目的とする。SUMMARY OF THE INVENTION An object of the present invention is to provide a forced convection boiling cooling device that can efficiently cool a semiconductor device that generates a large amount of heat per unit or a circuit board in which VLSI is densely mounted.
従来の強制対流沸騰冷却装置には、熱伝達効率が高い反
面、沸騰により生じた冷媒の蒸気気泡が。Although conventional forced convection boiling cooling equipment has high heat transfer efficiency, it does not produce vapor bubbles of the refrigerant caused by boiling.
循環している冷媒液体に混合し、気液２相流となるため
、冷媒液体に対する蒸気気泡の量が増加するほど熱交換
効率が低下する。という問題があった。Since it mixes with the circulating refrigerant liquid and becomes a gas-liquid two-phase flow, the heat exchange efficiency decreases as the amount of vapor bubbles relative to the refrigerant liquid increases. There was a problem.
また、蒸気気泡の量が増加すると、循環ポンプで加圧し
て循環させている冷媒液体の圧力バラン〔課題を解決す
るための手段〕上記目的を達成するために１本発明の冷却装置は、冷却
容器内に格納された複数個の回路素子を搭載した回路基
板を冷媒液体の強制対流および沸騰により放熱する冷却
装置において、冷却容器の外部に、冷却容器から導出さ
れる冷却液体を冷却した後に再び冷却容器内に導入する
ための熱交換器を設け、熱交換器内の冷却液体を流すた
めの管を多孔質材料からなる中空管で形成し１回路素子
の表面から発生し、冷却液体中に含まれる気泡が多孔質
中空管から浸出して形成する冷媒蒸気を吸引して圧縮・
液化するためのコンプレッサを設けるように構成する。In addition, when the amount of vapor bubbles increases, the pressure balance of the refrigerant liquid that is pressurized and circulated by the circulation pump [Means for Solving the Problem] In order to achieve the above object, the cooling device of the present invention has the following features: In a cooling device that dissipates heat from a circuit board mounted with multiple circuit elements housed in a container by forced convection and boiling of a refrigerant liquid, the cooling liquid drawn out from the cooling container is cooled and then recirculated to the outside of the cooling container. A heat exchanger is provided to introduce the cooling liquid into the cooling container, and a tube for flowing the cooling liquid in the heat exchanger is formed of a hollow tube made of a porous material. The refrigerant vapor that is formed when the air bubbles in the refrigerant seep out of the porous hollow tube is sucked in and compressed.
A compressor for liquefaction is provided.
本発明の冷却装置、特に強制対流沸騰冷却装置は、熱交
換器内の冷媒液体を流す管を、液体は浸透しにくいが、
気体は通過しやすいような微細な孔を持つ多孔質の材料
により形成するとともにこの多孔質中空管の外に気密壁
を設けて減圧することにより５冷却能力低下の原因とな
る循環系内部の冷媒蒸気気泡を強制的に排除するように
している。つまり、冷媒蒸気気泡は、多孔質中空管を循
環するときに、管に形成された微細な孔を通過して除去
される。The cooling device of the present invention, particularly the forced convection boiling cooling device, is characterized by the fact that the liquid is difficult to penetrate through the pipes in which the refrigerant liquid flows in the heat exchanger.
It is made of a porous material with fine pores that allow gas to easily pass through, and an airtight wall is provided outside the porous hollow tube to reduce the pressure. Refrigerant vapor bubbles are forcibly removed. That is, when the refrigerant vapor bubbles circulate through the porous hollow tube, they pass through the fine pores formed in the tube and are removed.
また、多孔質中空管の表面においても１発熱を奪うこと
により、循環対流している冷媒液体の熱交換を行えるよ
うにして、熱交換効率を高めている。つまり、冷媒液体
の一部を気化・蒸発させることにより、循環させている
冷媒液体の冷却も同時に行うことができる。In addition, by removing one heat generated from the surface of the porous hollow tube, heat exchange between the circulating and convecting refrigerant liquid can be performed, thereby increasing the heat exchange efficiency. That is, by vaporizing and evaporating a portion of the refrigerant liquid, the circulating refrigerant liquid can be cooled at the same time.
第１図は本発明の強制対流沸騰冷却装置の全体構成を示
す図、第２図は熱交換器の詳細を示す図である。FIG. 1 is a diagram showing the overall configuration of a forced convection evaporative cooling device of the present invention, and FIG. 2 is a diagram showing details of a heat exchanger.
第１図および第２図において５１０１は回路素子、１０
２は回路基板、１０３は冷却容器、１０４は熱交換器、
１０５は多孔質中空管、１０６はコンプレッサ、１０７
は冷却水、１０８は循環ポンプ、１０９は冷媒液体、１
１０は細孔、Ｉｌｌは気泡、１１２は冷媒蒸気である。1 and 2, 5101 is a circuit element, 10
2 is a circuit board, 103 is a cooling container, 104 is a heat exchanger,
105 is a porous hollow tube, 106 is a compressor, 107
is cooling water, 108 is a circulation pump, 109 is a refrigerant liquid, 1
10 is a pore, Ill is a bubble, and 112 is a refrigerant vapor.
以下、第１図および第２図を用いて３本発明の１実施例
を説明する。Three embodiments of the present invention will be described below with reference to FIGS. 1 and 2.
ｉｓｏ禦曹角の回路基板１０２に１０１角のＬＳＩなど
の回路素子をｌｏＸＩＯ個搭載し、これを幅１４龍、高
さ８龍の多孔質の流路で、１０個。LoXIO circuit elements such as 101 square LSIs are mounted on a circuit board 102 made of ISO Sojiao, and 10 of them are arranged in a porous channel with a width of 14 mm and a height of 8 mm.
１列に隔翻した。Separated in one row.
そして、それぞれの流路に熱交換器１０４と循環ポンプ
１０８を介して、フッ化炭素（Ｃ６Ｆ＋４ ）などの冷
媒液体１０９を流速１ ｍ ／ ｓで強制対流させた。Then, a refrigerant liquid 109 such as fluorocarbon (C6F+4) was forced into convection at a flow rate of 1 m/s in each flow path via a heat exchanger 104 and a circulation pump 108.
外交換器１０４の熱交換チューブは２分画分子が５００
０以下のポリスルホン系樹脂製で直径１〜３ ｎの多孔
質中空管１０５により形成し、さらに、これらの多孔質
中空管１０５を束ねて外部気密壁（図示上ず）で覆い、
多孔質中空管１０５と外部気密壁との間をコンプレッサ
１０６で減圧吸引した。コンプレッサ１０６は、冷却水
１０７により水冷し、吐出側には室温の冷媒液体１０９
が流れ出すようにした。The heat exchange tube of the external exchanger 104 has 500 2-fraction molecules.
It is formed of porous hollow tubes 105 made of polysulfone resin of 0 or less and having a diameter of 1 to 3 nm, and further, these porous hollow tubes 105 are bundled and covered with an external airtight wall (not shown),
A compressor 106 vacuum-suctioned between the porous hollow tube 105 and the external airtight wall. The compressor 106 is water-cooled with cooling water 107, and on the discharge side there is a refrigerant liquid 109 at room temperature.
was made to flow out.
回路素子１０１に電力を印加すると回路素子１０１は発
熱し、冷媒液体１０９の沸騰が開始し。When power is applied to the circuit element 101, the circuit element 101 generates heat, and the refrigerant liquid 109 starts to boil.
回路素子１０１は気化熱を奪われて冷却される。The circuit element 101 is cooled by being deprived of vaporization heat.
このとき発生した冷媒の蒸気気泡は、熱交換器１０４に
流れ込み、多孔質中空管１０５の管壁の細孔１１０から
冷媒蒸気として除去される。このとき、同時に多孔質中
空管１０５の管壁で蒸発熱が奪われることにより、効率
良く冷却が行われる。The refrigerant vapor bubbles generated at this time flow into the heat exchanger 104 and are removed as refrigerant vapor from the pores 110 in the tube wall of the porous hollow tube 105 . At this time, the heat of evaporation is simultaneously removed by the wall of the porous hollow tube 105, thereby efficiently cooling the tube.
本発明に係る強制対流沸騰冷却装置によれば。According to the forced convection boiling cooling device according to the present invention.
冷媒液体の流路内に滞留した冷媒の蒸気気泡を効率良く
除去することができるので０強制滞留沸騰方式木来の高
効率冷却が可能となる。Since vapor bubbles of the refrigerant stagnant in the flow path of the refrigerant liquid can be efficiently removed, high-efficiency cooling of the 0 forced retention boiling system is possible.
１例を挙げると、従来の装置では循環させている冷媒液
体の１路下流の回路素子が先に沸騰状態になるため３回
路素子の単位面積あたりの冷却能力が６０ Ｗ ／ ｃ
ｄ程度であったが２本発明に係る強制対流沸騰冷却装置
では、約２倍の１１０ Ｗ／ｃｉ程度まで冷却すること
ができるようになった。To give one example, in a conventional device, the circuit elements downstream of the circulating refrigerant liquid in one path reach a boiling state first, so the cooling capacity per unit area of the three circuit elements is 60 W/c.
However, with the forced convection boiling cooling device according to the present invention, it has become possible to cool down to about 110 W/ci, which is about twice that.
第１図は本発明の強制対流沸騰冷却装置の全体構成を示
す図第２図は熱交換器の詳細を示す図。第３図は従来のプール沸騰型冷却装置を示す図である。第１図および第２図において：回路素子：回路基板：冷却容器：熱交換器：多孔質中空管：コンプレッサ：冷却水：′＃１環ポンプ：冷媒液体：細孔：気泡二冷媒蒸気FIG. 1 shows the overall configuration of the forced convection evaporative cooling device of the present invention, and FIG. 2 shows details of the heat exchanger. FIG. 3 is a diagram showing a conventional pool boiling type cooling device. In Figures 1 and 2: Circuit elements: Circuit board: Cooling vessel: Heat exchanger: Porous hollow tube: Compressor: Cooling water: '#1 ring pump: Refrigerant liquid: Pores: Bubbles Two refrigerant vapor
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20908488AJPH0258296A (en) | 1988-08-23 | 1988-08-23 | Cooling system |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20908488AJPH0258296A (en) | 1988-08-23 | 1988-08-23 | Cooling system |
| Publication Number | Publication Date |
|---|---|
| JPH0258296Atrue JPH0258296A (en) | 1990-02-27 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20908488APendingJPH0258296A (en) | 1988-08-23 | 1988-08-23 | Cooling system |
| Country | Link |
|---|---|
| JP (1) | JPH0258296A (en) |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04265498A (en)* | 1990-10-30 | 1992-09-21 | Carrier Corp | Centrifugal compressor |
| KR100623641B1 (en)* | 2004-08-18 | 2006-09-19 | 주식회사 써멀포스 | Cooling apparatus of looped heat pipe structure |
| WO2017047151A1 (en)* | 2015-09-14 | 2017-03-23 | 三菱電機株式会社 | Cooler, power conversion device and cooling system |
| JP2021527922A (en)* | 2018-05-28 | 2021-10-14 | コリア・インスティテュート・オブ・マシナリー・アンド・マテリアルズＫｏｒｅａ Ｉｎｓｔｉｔｕｔｅ Ｏｆ Ｍａｃｈｉｎｅｒｙ ＆ Ｍａｔｅｒｉａｌｓ | Phase change cooling module and battery pack using it |
| JPWO2021240631A1 (en)* | 2020-05-26 | 2021-12-02 | ||
| JP2023518671A (en)* | 2020-03-27 | 2023-05-08 | ザイリンクス インコーポレイテッド | Heterogeneous integrated module with thermal management device |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04265498A (en)* | 1990-10-30 | 1992-09-21 | Carrier Corp | Centrifugal compressor |
| KR100623641B1 (en)* | 2004-08-18 | 2006-09-19 | 주식회사 써멀포스 | Cooling apparatus of looped heat pipe structure |
| WO2017047151A1 (en)* | 2015-09-14 | 2017-03-23 | 三菱電機株式会社 | Cooler, power conversion device and cooling system |
| JPWO2017047151A1 (en)* | 2015-09-14 | 2018-02-01 | 三菱電機株式会社 | Cooler, power conversion device, and cooling system |
| DE112016004166B4 (en)* | 2015-09-14 | 2024-01-18 | Mitsubishi Electric Corporation | COOLING DEVICE, ENERGY CONVERSION DEVICE AND COOLING SYSTEM |
| JP2021527922A (en)* | 2018-05-28 | 2021-10-14 | コリア・インスティテュート・オブ・マシナリー・アンド・マテリアルズＫｏｒｅａ Ｉｎｓｔｉｔｕｔｅ Ｏｆ Ｍａｃｈｉｎｅｒｙ ＆ Ｍａｔｅｒｉａｌｓ | Phase change cooling module and battery pack using it |
| JP2023518671A (en)* | 2020-03-27 | 2023-05-08 | ザイリンクス インコーポレイテッド | Heterogeneous integrated module with thermal management device |
| JPWO2021240631A1 (en)* | 2020-05-26 | 2021-12-02 | ||
| WO2021240631A1 (en)* | 2020-05-26 | 2021-12-02 | 三菱電機株式会社 | Cooling device |
| Publication | Publication Date | Title |
|---|---|---|
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