【発明の詳細な説明】〔産業上の利用分野〕本発明は、液体を噴射し、記録を行なう液体噴射装置の
製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method of manufacturing a liquid ejecting device that ejects liquid and performs recording.
液体噴射装置の従来例を第６図〜１１図に示す。第６図
は、基板１上に吐出機能部２及び中継基板３を搭載した
液体噴射装置を示す。インクはインク供給系（不図示）
からフィルター２−２を通って吐出機能部２内の共通液
室（不図示）を経て、ノズル（不図示）を通り、電気−
圧力交換手段（不図示）によフて圧力を加えられ、オリ
フィス２−１より吐出される。ここで、電気−圧力変換
手段に印加される駆動信号はプリンタ側からコネクタ（
小国７ＪＯによって、中継基板３のコネクタ電極３−１
で接続され、中継基板３と吐出機能部２をワイアホンテ
インク等て接続することにより、伝送される。５はワイ
アホンテインク部の封１Ｆ剤である。このような装置に
おいては、中継基板３は基板１に加締めにより貼り合わ
されている。加締めについては、第１図のＢ−Ｂ断面を
示す第７．８図で説明する。Conventional examples of liquid ejecting devices are shown in FIGS. 6 to 11. FIG. 6 shows a liquid ejecting device in which an ejection function section 2 and a relay board 3 are mounted on a substrate 1. Ink is supplied by the ink supply system (not shown)
The electricity flows through the filter 2-2, the common liquid chamber (not shown) in the discharge function section 2, and the nozzle (not shown).
Pressure is applied by a pressure exchange means (not shown), and the fluid is discharged from the orifice 2-1. Here, the drive signal applied to the electric-pressure conversion means is transmitted from the printer side to the connector (
Connector electrode 3-1 of relay board 3 by Oguni 7JO
The data is transmitted by connecting the relay board 3 and the ejection function section 2 with a wire or the like. 5 is the sealant 1F of the Waiahonte ink section. In such a device, the relay board 3 is bonded to the board 1 by crimping. The caulking will be explained with reference to FIG. 7.8, which shows the BB cross section of FIG. 1.
第７図で中継基板３は、穴３−３が開いており、この穴
３−３を基板１のエンホス１−１にはめ込む。次に、第
８図のようにエンホス１−１を加締め１−１″の形状と
し、中継基板３を基板１に貼り合わせる。In FIG. 7, the relay board 3 has a hole 3-3, and this hole 3-3 is fitted into the enhancer 1-1 of the board 1. Next, as shown in FIG. 8, the enhancer 1-1 is crimped into the shape 1-1'', and the relay board 3 is bonded to the board 1.
しかし、この方法では、エンボスと穴の位置精度及びは
め合い精度等か重要で、高い寸法精度を要求するためコ
スト高になフてしまう。また、加締めにより基板１に歪
みか発生したり、基板１カ）加締め安い材料に限定され
る等の問題があった。However, in this method, the positional accuracy and fitting accuracy of the embossing and the hole are important, and high dimensional accuracy is required, resulting in high costs. Further, there were problems such as distortion occurring in the substrate 1 due to crimping, and the substrate 1 being limited to materials that are cheap to crimp.
第９図は、基板１と中継基板３の間に接着剤７を塗布し
、こわにより貼り合わされた液体噴射装置の例である。FIG. 9 shows an example of a liquid ejecting device in which an adhesive 7 is applied between the substrate 1 and the relay substrate 3, and the substrate 1 and the relay substrate 3 are bonded together by stiffening.
そのＣ−Ｃ断面を第１０図に示す。The CC cross section is shown in FIG.
この場合、部品精度等には、前例のような厳しい精度は
要求されないか、中継基板３はカラスエポキシ基板等て
てきているのか一般的であり、コネクタ（不図示）と中
継基板３の接続時にかかる力やこじり等で基板１と中継
基板３が破壊しないように接合強度を上げるために、強
力な接着剤の使用や接着面積の拡大等を行っても、中継
基板表面にコートしである、レジストと中継基板３の強
度はあまり犬きくなく、中継基板３の裏面のレジストか
はかれてしまうため、充分な接着強度を確保することは
むずかしい。In this case, the precision of parts etc. is not required to be as strict as in the previous example, or the relay board 3 is generally made of a glass epoxy board, etc., and when connecting the connector (not shown) and the relay board 3, In order to increase the bonding strength so that the substrate 1 and the relay board 3 will not be destroyed by such force or prying, even if a strong adhesive is used or the bonding area is expanded, the surface of the relay board will not be coated. The strength of the resist and the relay board 3 is not very strong, and the resist on the back side of the relay board 3 will peel off, making it difficult to ensure sufficient adhesive strength.
第１１図に中継基板３の端面を利用して上から接着剤で
固めた例を示１−０この場合では、部品精度の問題、レ
ジストのはかれの問題はクリヤできるか、基板１の外部
はプリンタ本体への搭載時の位置決め等に使われる場合
か多く、それに支障をきたさないように塗布するのは、
塗布量のコントロール、塗布位置のコントロール等困難
な場合か多々あり、また、装置寸法を極力小さくする流
れから塗布スペースの確保はむずかしくなるばかりであ
る。Fig. 11 shows an example in which the end face of the relay board 3 is used and fixed with adhesive from above. is often used for positioning when installing it in the printer body, and it is important to apply it so that it does not interfere with the process.
There are many cases where it is difficult to control the amount of coating and the position of coating, and it is becoming increasingly difficult to secure coating space due to the trend of reducing device dimensions as much as possible.
第１２図は、基板１に穴１−５を開け、基板裏面より、
接着剤を塗布接着した液体噴射装置の例である。第１３
図にその断面を示す。この場合、部品精度、塗布粒度ス
ペースの問題等はクリヤされるか、裏面からの塗布作業
にはワークを裏返しにしなけれはならず、作業上非常に
行ないにくいものである。また、自動化に対しても装置
対応を困難にしている。In Figure 12, holes 1-5 are made in the board 1, and from the back of the board,
This is an example of a liquid ejecting device coated with an adhesive. 13th
The cross section is shown in the figure. In this case, problems such as parts precision and coating particle size and space may not be solved, but the work must be turned over to coat from the back side, which is extremely difficult to perform. Furthermore, it is difficult to adapt the device to automation.
本発明の目的は、従来の問題点、即ち、（１）部品の高
い寸法精度の要請に伴うコストの問題（２）接着強度に関する問題（３）塗布量、塗布位置の精度に関する問題（４）塗布
スペース確保の問題（５）作業性、自動化対処に関する問題を解決し、高い
品質の液体噴射記録装置を製造てきる方法を提供するこ
とにある。The purpose of the present invention is to solve the conventional problems, namely: (1) Cost problems due to the requirement for high dimensional accuracy of parts (2) Problems related to adhesive strength (3) Problems related to accuracy of coating amount and coating position (4) Problem (5) of securing coating space The object of the present invention is to provide a method for manufacturing a high quality liquid jet recording device by solving problems related to workability and automation.
本発明は、インクを吐出するためのノズル、該ノズルに
接続する共通液室、および該ノズル内のインクに圧力を
加える電気−圧力変換手段を有するインク吐出機能部と
、該インク吐出機能部に外部からの駆動電気信号を印加
するため、その信号を中継する中継基板とを基板上に搭
載して成る液体噴射記録装置の製造方法において、前記
中継基板に１つまたは複数の穴を開け、該穴上面より接
着材を基板に向けて塗布し、中継基板を、基板に貼り合
わせ固定したことを特徴とし、これによって、上記の目
的を達成できる。以下、図面を参照しつつ本発明をより
詳細に説明する。The present invention provides an ink discharge function section having a nozzle for discharging ink, a common liquid chamber connected to the nozzle, and an electric-pressure conversion means for applying pressure to the ink within the nozzle, and the ink discharge function section. In a method for manufacturing a liquid jet recording device comprising a relay board mounted on a substrate to which a drive electric signal is applied from the outside and which relays the signal, the relay board is provided with one or more holes; The present invention is characterized in that an adhesive is applied toward the substrate from the top surface of the hole, and the relay substrate is bonded and fixed to the substrate, thereby achieving the above object. Hereinafter, the present invention will be explained in more detail with reference to the drawings.
第１図は、本発明の一実施例の斜視図である。FIG. 1 is a perspective view of one embodiment of the present invention.
従来技術で示した装置における部材、材料、部分と同一
のものは同一番号で示しである。Components, materials, and parts that are the same as those in the apparatus shown in the prior art are designated by the same numbers.
本実施例では、中継基板３に４個の穴３−１がおいてお
り、その上方より接着剤６を塗布しである。In this embodiment, four holes 3-1 are provided in the relay board 3, and the adhesive 6 is applied from above.
１−記構酸のＡ−Ａ断面を、第２図に示す。この図に示
すように、接着剤６は中継基板３の上面に広い範囲で塗
布されかつ中継基板３の穴３−１を通って基板１と接着
している。FIG. 2 shows an A-A cross section of the 1-styl structural acid. As shown in this figure, the adhesive 6 is applied over a wide area on the upper surface of the relay board 3 and is bonded to the board 1 through the hole 3-1 of the relay board 3.
中継基板３と基板１の接着強度は接着剤６と基板１の接
着面積即ち中継基板３の穴３−１の大きさとその数及び
接着剤６自体の強度と塗布量で決り中継基板のレジスト
層の強度の影響を受けることはなく、部品精度、塗布粒
度面でもラフでよく、信頼性か高く、且つ作業性の良い
組み立て方法か実現できる。The adhesive strength between the relay board 3 and the board 1 is determined by the adhesive area between the adhesive 6 and the board 1, that is, the size and number of holes 3-1 in the relay board 3, and the strength and application amount of the adhesive 6 itself. It is not affected by the strength of the coating, and can be used even if it is rough in terms of part accuracy and coating particle size, making it possible to realize an assembly method that is highly reliable and has good workability.
第３〜５図に他の実施例を示す。各図はすべて第１図の
断面Ａ−Ａの相当部について示しである。ここで、第３
図は基板１の中継基板３の穴３−１と合わされる部分に
くぼみ１−２を設けたものである。このくぼみ１−２を
設けることは、中継基板３の穴３−１の数や大きさを増
せない場合に貼り合わせ強度を上げるには良い方法であ
る。第３図は第２図の例とは逆に穴３−１に合う基板部
分に凸部１−３を設けたものである。これも同様に穴の
数や大きさを増やせない場合にイ１効である。Other embodiments are shown in FIGS. 3-5. Each figure shows a portion corresponding to the section AA in FIG. 1. Here, the third
In the figure, a recess 1-2 is provided in the portion of the board 1 that is aligned with the hole 3-1 of the relay board 3. Providing the recesses 1-2 is a good method for increasing the bonding strength when the number and size of the holes 3-1 in the relay board 3 cannot be increased. In FIG. 3, a convex portion 1-3 is provided on the part of the substrate that fits into the hole 3-1, contrary to the example shown in FIG. 2. This is also effective when it is not possible to increase the number or size of holes.
第５図は穴３−１に合う位置に、基板の穴１４を設けた
例である。FIG. 5 shows an example in which the hole 14 of the substrate is provided at a position that matches the hole 3-1.
また、以上述べた例において、接着剤６がワイヤー封止
剤５と共通化可能であれば、同時工程で塗布し、同時に
硬化することも可能となり、工程の簡略化にもつなかる
。たたし、この場合、中継基板３を基板１に仮止めの形
て軽く接着して工程を進める必要がある。Furthermore, in the example described above, if the adhesive 6 can be used in common with the wire sealant 5, it will be possible to apply and cure in the same process, which will also lead to simplification of the process. However, in this case, it is necessary to temporarily adhere the relay board 3 to the board 1 and proceed with the process.
以十詳細に説明したように、中継基板に穴を開け、その
穴を通して基板と中継基板を接着剤で固定する本発明は
、（１）部品に高度な寸法精度を要さずコストが高くつか
１−１（２）中継基板の接着強度を大きくでき、（３）接着剤
の塗布量、塗布位置に高い精度を要さず、（４）接着剤の塗布スペース確保の問題か生ぜず、（５）作業性、自動化対処に適し、（６）工程の簡略化をも可能にする、液体噴射記録装置の製造方法である。As explained in detail above, the present invention, which involves drilling a hole in the relay board and fixing the board and relay board through the hole with adhesive, has the following advantages: (1) It does not require a high degree of dimensional accuracy for the parts and is costly; 1-1 (2) The adhesive strength of the relay board can be increased, (3) High accuracy is not required in the amount and position of adhesive applied, (4) There is no problem of securing adhesive application space, ( 5) It is a manufacturing method for a liquid jet recording device that is suitable for workability and automation, and (6) also enables process simplification.
第１図は本発明の一実施例を示す斜視図、第２図はその
断面図、第３図、第４図、第５図は各々他の実施例の断
面図、第６〜第１３図は各々従来例を示ず図である。１・基板 ２：吐出機能部 ３：中継基板３−１・中継
基板の穴 ４：ワイヤーボンデインク５：ワイヤー封止剤 ６：接着剤Fig. 1 is a perspective view showing one embodiment of the present invention, Fig. 2 is a sectional view thereof, Figs. 3, 4, and 5 are sectional views of other embodiments, and Figs. 6 to 13. These figures do not show conventional examples. 1. Substrate 2: Discharge function section 3: Relay board 3-1/Hole of relay board 4: Wire bonding ink 5: Wire sealant 6: Adhesive
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18031488AJPH0230541A (en) | 1988-07-21 | 1988-07-21 | Manufacturing method of liquid injection device |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18031488AJPH0230541A (en) | 1988-07-21 | 1988-07-21 | Manufacturing method of liquid injection device |
| Publication Number | Publication Date |
|---|---|
| JPH0230541Atrue JPH0230541A (en) | 1990-01-31 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18031488APendingJPH0230541A (en) | 1988-07-21 | 1988-07-21 | Manufacturing method of liquid injection device |
| Country | Link |
|---|---|
| JP (1) | JPH0230541A (en) |
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| US8800147B2 (en)* | 2006-09-14 | 2014-08-12 | Seiko Epson Corporation | Alignment method of liquid-jet head unit |
| US7735225B2 (en)* | 2007-03-30 | 2010-06-15 | Xerox Corporation | Method of manufacturing a cast-in place ink feed structure using encapsulant |
| US8235500B2 (en) | 2007-03-30 | 2012-08-07 | Xerox Corporation | Cast-in place ink feed structure using encapsulant |
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