【発明の詳細な説明】［産業上の利用分野］この発明は、電子ビームやレーザビームなどのエネルギ
ビームを用いた複合材料の穴あけ方法に間するものであ
る。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a method for drilling holes in composite materials using an energy beam such as an electron beam or a laser beam.
［従来の技術］第２図（ａ）（ｂ）は、従来通常行われている複合材料
の穴あけ方法を工程順に示す模式断面図で、この場合は
物性の違いにより溶融・蒸発速度が異なる材料を積層し
て形成した積層形の複合材料であるプリント基板（１０
）の穴あけ方法について示す。[Prior Art] Figures 2(a) and 2(b) are schematic cross-sectional views showing the conventional method of drilling holes in composite materials in order of process. Printed circuit board (10
) shows how to drill holes.
図において、（１）は電子ビームやレーザビームなどの
エネルギビーム、（２）は銅箔、（３）はガラスエエボ
キシ基板で、プリント基板（１０）はガラスエエボキシ
基板（３）とその表裏面に積層される鋼箔（２）で構成
されている。なお、このガラスエエボキシ基板（３）は
これ自体エポキシ樹脂及びガラス繊維を混合して形成し
た混合形の複合材料である。In the figure, (1) is an energy beam such as an electron beam or laser beam, (2) is a copper foil, (3) is a glass epoxy board, and the printed circuit board (10) is a glass epoxy board (3) and its surface. It consists of a steel foil (2) laminated on the back side. Note that this glass epoxy substrate (3) itself is a mixed type composite material formed by mixing an epoxy resin and glass fiber.
次に動作について説明する。第２図（ａ）において、エ
ネルギビーム（１）は銅箔（２）の表面近傍に焦点を結
ぶように細く紋って照射され、瞬時の内に溶融・蒸発が
生じた結果、第２図（ｂ）に示すようにプリント基板（
１０）、卯ち銅箔（２）及びガラスエエボキシ基板（３
）には穴が形成される。ここで、物理的緒特性が全く異
なる材料を同時に加工することから、一般に穴寸法は銅
箔（２）に対してガラスエエボキシ基板（３）の方が大
きくなる。また、ガラスエエボキシ基板（３）はエポキ
シ樹脂とガラス繊維で構成されているため、上記と同様
の理由でガラス部分が突起して残り、穴内壁に凹凸が生
じる。さらに、プリント基板の場合、後工程で穴部分に
めっきを施すことが必要であり、この様な穴形状ではめ
っきのつきまわりが悪く、重大な欠陥となる可能性が高
い。Next, the operation will be explained. In Figure 2 (a), the energy beam (1) is irradiated in a narrow pattern so as to focus near the surface of the copper foil (2), and as a result, melting and evaporation occur instantaneously, as shown in Figure 2. As shown in (b), the printed circuit board (
10), Uchi copper foil (2) and glass epoxy board (3)
) is formed with a hole. Here, since materials with completely different physical characteristics are processed at the same time, the hole size in the glass epoxy substrate (3) is generally larger than that in the copper foil (2). Further, since the glass epoxy substrate (3) is made of epoxy resin and glass fiber, the glass portion remains protruding for the same reason as above, causing unevenness on the inner wall of the hole. Furthermore, in the case of printed circuit boards, it is necessary to apply plating to the hole portions in a post-process, and such hole shapes have poor plating coverage and are highly likely to result in serious defects.
このような問題を解決するため、例えば特閏昭５９−２
７７９１号公報に、下記のような複数種類の層が積層さ
れた複合材料に穴あけする方法が提案されている。その
方法は各層毎に照射するエネルギビームの出力を変え、
それぞれに最適出力エネルギのビームを照射するという
ものである。ところが、この方法では各層毎に最適出力
エネルギ量を設定しなければならず、また各層の境界を
正確に検知する必要がある。従って実際上、各層毎に最
適出力エネルギ量のエネルギビームを適宜照射する事は
甚だ困難であり、混合形の複合材料には適用できない。In order to solve such problems, for example,
Japanese Patent No. 7791 proposes a method for drilling holes in a composite material in which multiple types of layers are laminated as described below. The method is to change the output of the energy beam for each layer,
The idea is to irradiate each with a beam of optimal output energy. However, with this method, it is necessary to set the optimum output energy amount for each layer, and it is also necessary to accurately detect the boundaries of each layer. Therefore, in practice, it is extremely difficult to appropriately irradiate each layer with an energy beam having an optimal output energy amount, and this cannot be applied to mixed composite materials.
［発明が解決しようとする課題］従来の穴あけ方法は以上のようになされており、被加工
物である複合材料を構成する物質の物理的諸特性の違い
によって加工寸法に差が生じるため、穴径が均一で、穴
内壁に凹凸がない、真っ直ぐな穴をあけることができな
い、極めて困難であるという問題点があった。[Problem to be solved by the invention] Conventional drilling methods are performed as described above.Differences in processing dimensions occur due to differences in the physical properties of the materials that make up the composite material that is the workpiece. There were problems in that it was extremely difficult to make a straight hole with a uniform diameter and no unevenness on the inner wall of the hole.
この発明は上記のような問題点を解消するためになされ
たもので、物性が大きく異なる複数の材料で形成された
複合材料でも、穴内壁に凹凸のない真っ直ぐな穴を簡便
に加工できる穴あけ方法を提供することを目的とする。This invention was made to solve the above-mentioned problems, and it provides a drilling method that can easily form a straight hole without unevenness on the inner wall of the hole, even in a composite material made of multiple materials with significantly different physical properties. The purpose is to provide
［課題を解決するための手段］この発明の複合材料（物性の違いにより溶融・蒸発速度
が異なる材料を積層または混合して形成したもの）の穴
あけ方法は、複合材料にエネルギビームを照射して穴を
あけ、この穴を単一充填材で穴埋めし、穴埋め部分にエ
ネルギビームを再度照射して穴をあけるようにしたもの
である。[Means for Solving the Problem] The method of drilling a hole in a composite material (formed by laminating or mixing materials with different melting and evaporation rates due to differences in physical properties) of the present invention involves irradiating the composite material with an energy beam. A hole is drilled, the hole is filled with a single filler material, and the filled hole is irradiated with an energy beam again to make the hole.
［作用］この発明の複合材料の穴あけ方法においては、−度加工
された穴を単一充填材で穴埋めし、穴埋め部分に再度穴
をあけるようにしているので、凹凸のない真っ直ぐな穴
があけられる。[Function] In the method for drilling holes in composite materials of the present invention, holes that have been processed to a certain degree are filled with a single filler material, and the filled holes are then drilled again, so that straight holes with no unevenness can be drilled. It will be done.
［実施例コ以下、この発明の一実施例の複合材料の穴あけ方法を図
について説明する。従来例で示したプリント基板の穴あ
けを例に説明する。第１図（ａ）〜（ｄ）はこの発明の
一実施例のプリント基板の穴あけ方法を工程順に示す模
式断面図で、図中、第２図と同一符号は同一のものを示
し、（４）は−度加工された穴を穴埋めする単一充填材
で、この場合はエポキシ樹脂である。[Example 1] Hereinafter, a method for drilling holes in a composite material according to an embodiment of the present invention will be explained with reference to the drawings. This will be explained by taking as an example the drilling of a printed circuit board shown in the conventional example. FIGS. 1(a) to 1(d) are schematic sectional views showing the method of drilling holes in a printed circuit board according to an embodiment of the present invention in the order of steps. In the figures, the same reference numerals as in FIG. ) is a single filler material, in this case epoxy resin, that fills the drilled hole.
次に動作について説明する。まず、エネルギビーム（１
）を銅箔（２）の表面近傍に焦点を結ぶように細く絞っ
て照射する（第１図ａ）。瞬時の内に溶融・蒸発が生じ
た結果、プリント基板（１０）、即ち銅箔（２）及びガ
ラスエエボキシ基板（３）には穴が形成される（第１図
ｂ）。この穴は、従来例で述べたように穴寸法は銅箔（
２）に対してガラスエエボキシ基板（３）の方が大きく
、また穴内壁に凹凸が生じている。この−度加工された
穴をエポキシ樹脂（４）で穴埋めし、穴埋め部分に再び
エネルギビーム（１）を照射する（第１図Ｃ）。瞬時の
内に溶融・蒸発が生じ穴埋め部分に穴が形成される（第
１図ｄ）、この穴は、単一充填材であるエポキシ樹脂（
４）が溶融・蒸発して形成された穴であるので、第１図
（ｄ）に示される如く均一な穴径の凹凸のない真っ直ぐ
なものであった。そのため、後工程で穴部分にめっきを
施したところ、めっきのつきまわりがよくなり、基板と
しての信頼性が著しく向上した。Next, the operation will be explained. First, the energy beam (1
) is narrowly focused and irradiated near the surface of the copper foil (2) (Fig. 1a). As a result of instantaneous melting and evaporation, holes are formed in the printed circuit board (10), ie, the copper foil (2) and the glass epoxy board (3) (FIG. 1b). As mentioned in the conventional example, the hole dimensions are copper foil (
Compared to 2), the glass epoxy substrate (3) is larger, and the inner wall of the hole is uneven. This processed hole is filled with epoxy resin (4), and the filled part is again irradiated with the energy beam (1) (FIG. 1C). Melting and evaporation occur instantaneously, forming a hole in the hole filling area (Fig. 1d). This hole is filled with epoxy resin (
Since the hole 4) was formed by melting and evaporation, the hole was straight with a uniform diameter and no irregularities, as shown in FIG. 1(d). Therefore, when the holes were plated in a post-process, the coverage of the plating was improved and the reliability of the board was significantly improved.
この発明に係わる単一充填材としては、エネルギビーム
で加工し易く、かつ複合材料に対して密着性やその他の
諸性質が似通った親和性の高い材料が望ましい。例えば
、エポキシ樹脂、ポリイミド樹脂、アクリル樹脂等が用
いられる。As the single filler according to the present invention, it is desirable to use a material that is easy to process with an energy beam and has a high affinity for the composite material with similar adhesion and other properties. For example, epoxy resin, polyimide resin, acrylic resin, etc. are used.
なお、上記実施例では、積層形の複合材料であるプリン
ト基板に適用した場合について示したが、例えば表裏面
に銅箔（２）がない混合形の複合材料であるガラスエポ
キシ基板（３）単独に適用しても、その穴内壁に凹凸が
生じることなく、上記実施例と同様の効果を奏する。In addition, in the above example, the case where it was applied to a printed circuit board which is a laminated composite material was shown. Even when applied to the hole, no unevenness occurs on the inner wall of the hole, and the same effects as in the above embodiment can be achieved.
また、貫通穴形成の場合について説明したが、留め穴で
あってもよい。Moreover, although the case of forming a through hole has been described, a fastening hole may also be used.
［発明の効果］以上のように、この発明によれば、物性の違いにより溶
融・蒸発速度が異なる材料を積層または混合して形成し
た複合材料にエネルギビームを照射して穴をあけ、この
穴を単一充填材で穴埋めし、穴埋め部分にエネルギビー
ムを再度照射して穴をあけるようにしたので、凹凸のな
い真っ直ぐな穴を簡便に形成できる効果がある。[Effects of the Invention] As described above, according to the present invention, an energy beam is irradiated to make a hole in a composite material formed by laminating or mixing materials that have different melting and evaporation rates due to differences in physical properties. Since the hole is filled with a single filler and the hole is made by irradiating the filled hole with an energy beam again, it is possible to easily form a straight hole without unevenness.
第１図（ａ）〜（ｄ）はこの発明の一実施例の複合材料
の穴あけ方法を工程順に示す模式断面図、第２図（ａ）
（ｂ）は、従来の複合材料の穴あけ方法を工程順に示す
模式断面図である。図において、（１）はエネルギビーム、（４）は単一充
填材、（ｌＯ）は複合材料で、ガラスエエボキシ基板（
３）とその表裏面に積層される銅箔（２）で構成されて
いる。なお、図中、同一符号は同一または相当部分を示す。第１図（ａ）第１図（ｂ）第１図（Ｃ）・図Figures 1 (a) to (d) are schematic cross-sectional views showing the method for drilling holes in a composite material according to an embodiment of the present invention in the order of steps; Figure 2 (a)
(b) is a schematic cross-sectional view showing a conventional method for drilling a hole in a composite material in order of steps. In the figure, (1) is the energy beam, (4) is the single filler, (lO) is the composite material, and the glass epoxy substrate (
3) and copper foil (2) laminated on its front and back surfaces. In addition, in the figures, the same reference numerals indicate the same or corresponding parts. Figure 1 (a) Figure 1 (b) Figure 1 (C) ・Figure
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1075487AJPH02255289A (en) | 1989-03-28 | 1989-03-28 | Method for boring composite material |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1075487AJPH02255289A (en) | 1989-03-28 | 1989-03-28 | Method for boring composite material |
| Publication Number | Publication Date |
|---|---|
| JPH02255289Atrue JPH02255289A (en) | 1990-10-16 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1075487APendingJPH02255289A (en) | 1989-03-28 | 1989-03-28 | Method for boring composite material |
| Country | Link |
|---|---|
| JP (1) | JPH02255289A (en) |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103533766A (en)* | 2013-10-22 | 2014-01-22 | 东莞生益电子有限公司 | Manufacturing method of circuit board and circuit board prepared by the method |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103533766A (en)* | 2013-10-22 | 2014-01-22 | 东莞生益电子有限公司 | Manufacturing method of circuit board and circuit board prepared by the method |
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