【発明の詳細な説明】産業上の利用分野本発明は，配線基板上の半導体部品設置部が絶縁性樹脂
で封止される半導体装置に関する．従来の技術近年、電子機器の小形・軽量化の要求に応えるために、
配線基板上の半導体部品の実装方法として、半導体チッ
プを裸状態のまま配線基板上にワイヤボンディング法、
ＴＡＢ （テープ・オートメイティッド・ボンデイング
）法、フリツプチップボンディング法などによって直接
接続固定し、その半導体チップ設置部をエボキシ系樹脂
、シリコーン系樹脂などの封止部材によって封止するペ
アチップ実装技術が広く用いられている．こめ４ ．，
！！ｉの封止部材としては、液状の熱硬化性樹脂或いは
加熱溶融したあと熱硬化する性質を持つ固形の樹脂を用
いるのが通例である．とくに後者の封止部材の１％き、
固形であるなめ取扱いが容易であり、しかも常にバラツ
キなく一定量を得ることができるという利点を有する．
この後者の封止部材の一例として、たとえばＥ−ペレッ
ト（日東電気工業《株》製）がある．第５図は、上述した後者の封止部材１を用いて配線基板
２上における半導体チップ３設置部を封止する工程の従
来例を示す平面図であり、第６口は第５図における■−
■矢視断面図を示している．第５図および第６図におい
て、半導体チップ３は、固定材料４によって配線基板２
上に固定されており、半導体チップ３の上面に形成され
ている複数の電極５は配線基板２上の対応ずる配線電極
６にそれぞれワイヤ７を介して電気的に接続されている
．この半導体チップ３の設置部上に、上述した加熱溶融
したあと熱硬化する性質を持つ固形の樹脂からなる封止
部材１が配置され、この封止部材１を適当な加熱手段を
用いて加熱溶融させることによって、半導体チップ３設
置部の封止が行われる．すなわち、加熱溶融で流動化した封止部材１によって半
導本チップ３設置部が覆われ、その被覆状瑯のまま封止
部材１は熱硬化によって凝固する．第７図は、その半導
体チップ３設置部が封止部材１によって封止された状態
を示す断面図である．発明が解決しようとする課題上述した従来の技術では、第７図に示すように加熱溶融
して流動化した封止部材１が半導体チッブ３設置部の外
方へ流れ出してしまうため、封止部材１が硬化してしま
った後の状態ではワイヤ７など部品の一部が露出するこ
とがあり、ワイヤ７の断線の原因となっている．したがって、本発明の目的は、配線基板上の半導体部品
設置部を確実に封止することのできる半導体装置を提供
することである．課題を解決するための手段本発明は、加熱溶融したあと熱硬化する性質を持つ固形
の絶縁性樹脂から成る封止部材を、配線基板上の半導体
部品設置部上に配置した状態で、前記封止部材を加熱溶
融させることによって牛導体部品設置部が前記封止部材
で封止される半導体装置において、前記封止部材の半導体部品設置部とは反対側に．半導体
部品設置部を覆いうる大きさで、かつ少なくとも前記絶
縁性樹脂が液相のときこれに対して大きい親和力をもつ
シートを固着することを特徴とする半導体装置である．作 用本発明に従えば、加熱溶融して流動化した絶縁性樹脂は
シートの親和力によってこのシートに束縛されるため、
半導体部品設置部の外方へ流れ出すことがない．したが
って、このあと熱硬化する絶縁性樹脂によって半導体部
品設置部は完全に封止される．実施例第２図は本発明の一実施例である半導体装置の一製造工
程を示す平面図であり、第１図は第２図におけるｒ−１
矢視断面図を示している．第１図および第２図において
、配線基板１２上には固定材料１４を用いて半導体チッ
プ１３が固定されており、半導体チップ１３の上面に形
成されている複数の電極１５は配線基板１２上の対応す
る配線電極１６にそれぞれワイヤ１７を介して電気的に
接続されている．この半導体チップ１３の設置部上には
、その設置部全本を覆いうる大きさの固形の封止部材１
１が配置される。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a semiconductor device in which a semiconductor component mounting portion on a wiring board is sealed with an insulating resin. Conventional technology In recent years, in order to meet the demand for smaller and lighter electronic devices,
As a method for mounting semiconductor components on a wiring board, wire bonding is used to place the semiconductor chip on the wiring board in a bare state.
Pair chip mounting technology that directly connects and fixes semiconductor chips using the TAB (tape automated bonding) method or flip chip bonding method, and then seals the mounting area of the semiconductor chip with a sealing material such as epoxy resin or silicone resin. Widely used. Kome 4. ，
! ! As the sealing member i, it is customary to use a liquid thermosetting resin or a solid resin that has the property of heating and melting and then thermosetting. In particular, 1% of the latter sealing member,
It has the advantage that it is solid, easy to handle, and can always be obtained in a constant amount without variation.
An example of the latter sealing member is E-pellet (manufactured by Nitto Electric Industry Co., Ltd.). FIG. 5 is a plan view showing a conventional example of the step of sealing the semiconductor chip 3 mounting portion on the wiring board 2 using the latter sealing member 1 described above, and the sixth opening is −
■Shows a cross-sectional view in the direction of the arrows. 5 and 6, the semiconductor chip 3 is attached to the wiring board 2 by the fixing material 4.
A plurality of electrodes 5 formed on the upper surface of the semiconductor chip 3 are electrically connected to corresponding wiring electrodes 6 on the wiring board 2 via wires 7, respectively. The sealing member 1 made of a solid resin having the property of being thermoset after being heated and melted is placed on the installation part of the semiconductor chip 3, and the sealing member 1 is heated and melted using an appropriate heating means. By doing so, the semiconductor chip 3 installation portion is sealed. That is, the semiconductor chip 3 installation portion is covered with the sealing member 1 fluidized by heating and melting, and the sealing member 1 is solidified by thermosetting while remaining in the covered state. FIG. 7 is a sectional view showing a state in which the semiconductor chip 3 installation portion is sealed with the sealing member 1. Problems to be Solved by the Invention In the conventional technology described above, as shown in FIG. 7, the sealing member 1 that has been melted and fluidized by heating flows out of the semiconductor chip 3 installation area. After the wire 1 has hardened, some parts such as the wire 7 may be exposed, causing the wire 7 to break. Therefore, an object of the present invention is to provide a semiconductor device that can reliably seal a semiconductor component mounting portion on a wiring board. Means for Solving the Problems The present invention provides a method in which a sealing member made of a solid insulating resin that has the property of thermosetting after being heated and melted is placed over a semiconductor component mounting portion on a wiring board. In a semiconductor device in which a conductor component mounting portion is sealed with the sealing member by heating and melting the sealing member, on the opposite side of the sealing member from the semiconductor component mounting portion. This semiconductor device is characterized in that a sheet is fixed to the insulating resin, which has a size that can cover a semiconductor component installation part and has a large affinity for at least the insulating resin when it is in a liquid phase. Function According to the present invention, the insulating resin that has been melted and fluidized by heating is bound to the sheet by the affinity of the sheet.
It does not flow out of the semiconductor component installation area. Therefore, the semiconductor component installation area is completely sealed with the insulating resin that is then thermoset. Embodiment FIG. 2 is a plan view showing one manufacturing process of a semiconductor device according to an embodiment of the present invention, and FIG.
A cross-sectional view as viewed from the arrow is shown. 1 and 2, a semiconductor chip 13 is fixed on the wiring board 12 using a fixing material 14, and a plurality of electrodes 15 formed on the upper surface of the semiconductor chip 13 are fixed on the wiring board 12. They are electrically connected to corresponding wiring electrodes 16 via wires 17, respectively. A solid sealing member 1 having a size that can cover the entire installation part of the semiconductor chip 13 is placed on the installation part of the semiconductor chip 13.
1 is placed.
第４ｌｌ２ｌは上記封止部材１１を示す斜視図である．
すなわち、この封止部材１１はたとえば先述したＥ−ベ
レットと同様に、エボキシ系樹脂を主成分とする樹脂粉
末を圧縮して板状など所定形状に成形した固形状で、加
熱溶融したあと熱硬化する性質を持つ絶縁性樹脂部１８
と、ガラスエボキシ、ガラスポリイミドなどの耐熱性材
料からなり上記絶縁性樹脂部１８の片面に密着固定され
たシート部１９とによって構成される．この封止部材１
１によって半導体チップ１３を封止する際には、そのシ
ート部１つを背にして上記半導体チップ１３設置部上に
封止部材１１が配置される．この封止部材１１の寸法は
封止対象となる半導体チップ〕３の寸法に依存するが、
その固形の絶縁性樹脂部１８の厚さは通常０．５〜ｌ．
Ｏｍｍ、シート部１９の厚さは通常０．０５〜０．１ｍ
ｍ程度とするのが望ましい．また、シート部１９の材料としては、加熱溶融して液相
を呈する上記絶縁性樹脂部１８に対して大きな親和力を
持つものが望ましい．半導体チップ１３設置部上に配置された上記封止部材１
１は、このあと加熱炉などの加熱手段によって所定の温
度に加熱され、その加熱状態が一定時間保たれる．この
加熱によって、封止部材１１の絶縁性樹脂部１８が先ず
溶融し半導体チップ１３搭載領域を被覆するように流動
する．このとき、液相を呈する絶縁性樹脂部１８に対し
てシート部１９の親和力が働くため、絶縁性樹脂部１８
の流動領域はほぼシート部１つの配置領域に制限され、
半導体チップ搭載領域の外方ｌ＼流れ出さない．第３図は、流動化した樹脂１８ａ（加熱溶融後の絶縁性
樹脂１８）の流動領域がシート部１つによって制限され
ている状態を示す断面図であり、樹脂１８ａは半導体チ
ップ１３搭載領域に均一な厚みとなって留まる．この状
態のもとで、さらに継続して加熱が行われ、これによっ
て樹脂１ ８ ＝ｔが硬化し封止が完了する．なお、上記実施例ではワイヤボンディング法によって配
線基板１２上に接続固定した半導体チップ１３に設置部
を封止する場きについて説明したが、これに限らずＴＡ
Ｂ法やフリップチップボンディング法によって実装され
る半導体装置の設置部にも同様に適用することができる
．発明の効果以上のように、本発明は半導体装置によれば、加熱溶融
して流動化する絶縁性樹脂の流動領域をシートの親和力
によって制限し、半導体部品設置部の外方へ絶縁性樹脂
が流れ出さないようにしているので、絶縁性樹脂によっ
て半導体部品設置部を完全に封止することができる．4ll2l is a perspective view showing the sealing member 11.
That is, the sealing member 11 is, for example, similar to the above-mentioned E-vellet, a solid shape made by compressing resin powder mainly composed of epoxy resin and molding it into a predetermined shape such as a plate shape. The insulating resin part 18 has the property of
and a sheet portion 19 made of a heat-resistant material such as glass epoxy or glass polyimide and closely fixed to one side of the insulating resin portion 18. This sealing member 1
1, the sealing member 11 is placed on the semiconductor chip 13 mounting portion with one of the sheet portions as its back. The dimensions of this sealing member 11 depend on the dimensions of the semiconductor chip [3] to be sealed;
The thickness of the solid insulating resin portion 18 is usually 0.5 to 1.5 l.
Omm, the thickness of the sheet part 19 is usually 0.05-0.1m
It is desirable to set it to about m. The material for the sheet portion 19 is preferably one that has a high affinity for the insulating resin portion 18, which exhibits a liquid phase when heated and melted. The sealing member 1 placed on the semiconductor chip 13 installation part
1 is then heated to a predetermined temperature by a heating means such as a heating furnace, and the heated state is maintained for a certain period of time. By this heating, the insulating resin portion 18 of the sealing member 11 first melts and flows to cover the semiconductor chip 13 mounting area. At this time, since the sheet part 19 has an affinity for the insulating resin part 18 exhibiting a liquid phase, the insulating resin part 18
The flow area is almost limited to the arrangement area of one seat part,
Does not flow outside the semiconductor chip mounting area. FIG. 3 is a cross-sectional view showing a state in which the flow area of the fluidized resin 18a (insulating resin 18 after heating and melting) is restricted by one sheet part, and the resin 18a is placed in the semiconductor chip 13 mounting area. It stays at a uniform thickness. Under this state, heating is further continued, whereby the resin 1 8 =t is cured and sealing is completed. In addition, although the above embodiment describes the case where the installation part is sealed on the semiconductor chip 13 connected and fixed on the wiring board 12 by the wire bonding method, the TA is not limited to this.
It can be similarly applied to the mounting area of semiconductor devices mounted by the B method or flip-chip bonding method. Effects of the Invention As described above, according to the semiconductor device of the present invention, the flow area of the insulating resin that is melted and fluidized by heating is restricted by the affinity of the sheet, and the insulating resin is directed outward from the semiconductor component installation area. Since the insulating resin is prevented from flowing out, the area where the semiconductor components are installed can be completely sealed.
【図面の簡単な説明】[Brief explanation of drawings]第１図は本発明の一実施例である半導体装置のＩＪ造工
程を示す断面図、第２図はその工程の平面図、第３図は
その工程による封止完了の状態を示す断面図、第４図は
その工程に用いられる封止部材を示す斜視図、第５図は
従来の半導体装置の封止方法の工程を示す平面図、第６
図はその工程の断面図、第７図はその工程による封止完
了の状芯を示す断面図である．１１・・・封止部材、１２・・・配線基板、１３・一・
半導体チップ、１８・・・絶縁性樹脂、１９・・・シー
ト第１図第３図第２図第図FIG. 1 is a cross-sectional view showing the IJ manufacturing process of a semiconductor device according to an embodiment of the present invention, FIG. 2 is a plan view of the process, and FIG. 3 is a cross-sectional view showing the state of completion of sealing in the process. FIG. 4 is a perspective view showing the sealing member used in the process, FIG. 5 is a plan view showing the process of the conventional semiconductor device sealing method, and FIG.
The figure is a cross-sectional view of the process, and FIG. 7 is a cross-sectional view showing the core after the sealing process is completed. 11... Sealing member, 12... Wiring board, 13.1.
Semiconductor chip, 18... Insulating resin, 19... Sheet Figure 1 Figure 3 Figure 2 Figure