【発明の詳細な説明】〔産業上の利用分野〕本発明は発光素子と受光素子とを結合されたホトカプラ
に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a photocoupler that combines a light emitting element and a light receiving element.
ホトカプラは、入力側すなわち発光素子の光を出力側す
なわち受光素子で受けて信号を伝達する装置であり、従
って入力側と出力側とが電気的に完全に分離しているこ
とが利点であり、また要求される。A photocoupler is a device that receives light from an input side, that is, a light emitting element, at an output side, that is, a light receiving element, and transmits a signal.Therefore, the advantage of a photocoupler is that the input side and output side are completely electrically separated. Also required.
第４図は従来のホトカプラの第１の例の断面図である。FIG. 4 is a sectional view of a first example of a conventional photocoupler.
発光素子ペレット１と、ホトダイオード２ａとその出力
信号を増幅する回路とを有する受光素子２とが間隔をお
いて配置され、発光素子１がらの光を受ける発光素子２
との間に透明なシリコン樹脂３が充填され、これによっ
て発光素子２に至る光経路が形成され、その外周を黒色
のエポキシ樹脂７でモールドされる。A light-emitting element pellet 1 and a light-receiving element 2 having a photodiode 2a and a circuit for amplifying its output signal are arranged at intervals, and the light-emitting element 2 receives light from the light-emitting element 1.
A transparent silicone resin 3 is filled between the light emitting element 2 and the light emitting element 2, thereby forming an optical path leading to the light emitting element 2, and its outer periphery is molded with a black epoxy resin 7.
第５図は従来のホトカプラの第２の例の断面図である。FIG. 5 is a sectional view of a second example of a conventional photocoupler.
発光素子１と受光素子とを透明エポキシ樹脂８でモール
ドして光経路を形成し、更にその外周を黒色エポキシ樹
脂７でモールドする。The light emitting element 1 and the light receiving element are molded with transparent epoxy resin 8 to form an optical path, and the outer periphery thereof is further molded with black epoxy resin 7.
上述した従来のホトカプラは、第６図に等価回路を示す
様に、発光素子１と受光素子２とが向い合っているので
、入力側と出力側との間に寄生容量Ｃが形成されてしま
う。従って、入力側に入った電気的ノイズがこの寄生容
量Ｃを通して出力側すなわちホトダイオードに伝達され
て等測的な光電流が流れ、該光電流が増幅回路２ｂで増
幅されその出力端子に該信号を発生させるという結果を
招く。In the conventional photocoupler described above, as the equivalent circuit is shown in FIG. 6, the light emitting element 1 and the light receiving element 2 face each other, so a parasitic capacitance C is formed between the input side and the output side. . Therefore, the electrical noise that has entered the input side is transmitted to the output side, that is, the photodiode, through this parasitic capacitance C, and an isometric photocurrent flows.The photocurrent is amplified by the amplifier circuit 2b and the signal is sent to its output terminal. resulting in the occurrence of
特に、ホトダイオードとその出力信号を増幅する増幅回
路とを１チツプに内蔵する受光素子を用いたホトカプラ
においては、微小ノイズによるホトダイオードの微小光
電流でも後段の増幅回路２ｂで増幅されてしまうので、
微小な電気的ノイズに対してもより敏感に反応してしま
う。In particular, in a photocoupler that uses a photodetector in which a photodiode and an amplifier circuit for amplifying its output signal are built into one chip, even a minute photocurrent of the photodiode due to minute noise is amplified by the subsequent amplifier circuit 2b.
It reacts more sensitively to minute electrical noises.
前述の様に、ホトカプラは入力側と出力側が電気的に完
全に分離されていることを要求されているのであるから
、この寄生容量によって発生する誤動作はホトカプラの
利点を損うという問題点が存在する。As mentioned above, photocouplers are required to have their input and output sides completely electrically separated, so there is a problem in that malfunctions caused by this parasitic capacitance will undermine the advantages of photocouplers. do.
本発明は、発光素子と、該発光素子を搭載し電気的接続
して前記発光素子に電気信号を与える発光素子用リード
と、前記発光素子と間隔をあけて配置され前記発光素子
からの光を受ける受光素子と、該受光素子を搭載し電気
的接続して該受光素子の出力信号を外部に引出す受光素
子用リードと前記発光素子と受光素子との間の光路を形
成する透明樹脂と、前記発光素子、受光素子を包む遮光
性樹脂とを含むホトカプラにおいて、前記受光素子がホ
トダイオードと該ホトダイオードの出力信号を増幅する
ものから成り、少なくとも断面の一部が鉤の手形状を有
する透光性導電板が前記ホトダイオードの上を覆いかつ
該透光性電板の少くとも一端が前記受光素子用リードに
電気的に接続されることによって構成される。The present invention provides a light emitting element, a light emitting element lead that mounts the light emitting element and electrically connects it to supply an electric signal to the light emitting element, and a lead for the light emitting element that is arranged at a distance from the light emitting element and that emits light from the light emitting element. a transparent resin that forms an optical path between the light emitting element and the light receiving element; A photocoupler including a light-emitting element and a light-shielding resin enclosing a light-receiving element, wherein the light-receiving element is composed of a photodiode and something that amplifies the output signal of the photodiode, and at least a part of a cross section has a hooked hand shape. A plate covers the photodiode, and at least one end of the light-transmitting electric plate is electrically connected to the light-receiving element lead.
第１図は本発明の第１の実施例の断面図、第２図は第１
図に示す受光素子と透光性導電板近傍の部分斜視図であ
る。FIG. 1 is a sectional view of the first embodiment of the present invention, and FIG. 2 is a sectional view of the first embodiment of the present invention.
FIG. 3 is a partial perspective view of the vicinity of the light-receiving element and the transparent conductive plate shown in the figure.
まず、受光素子用リード５に受光素子２をマウントする
。そして、受光素子とリードとの間をワイヤボンディン
グする。但し、ボンディングワイヤは省略しである。次
に、受光素子２のホトダイオード２ａとリード５との両
方に接続する様に、断面が鉤の手形状を有する透光性導
電板６を装着する。この際、透光性導電板６と、受光素
子２とは電気的に導通させてはいけないが透光性導電板
６とリード５とは電気的に導通させる必要がある。この
透光性導電板６はガラスやプラスチックなど透明な高絶
縁性の板の片面あるいは両面に酸化インジウム等の透明
導電膜を塗布したものが適している。次に、従来の方法
で、透明シリコン樹脂３により光経路を形成し外周を黒
色のエポキシ樹脂７でモールドしてホトカプラを完成さ
せる。First, the light receiving element 2 is mounted on the lead 5 for the light receiving element. Then, wire bonding is performed between the light receiving element and the lead. However, the bonding wire is omitted. Next, a translucent conductive plate 6 having a hook-shaped cross section is attached so as to be connected to both the photodiode 2a of the light receiving element 2 and the lead 5. At this time, the light-transmitting conductive plate 6 and the light receiving element 2 must not be electrically connected to each other, but the light-transmitting conductive plate 6 and the leads 5 must be electrically connected to each other. This transparent conductive plate 6 is suitably a transparent highly insulating plate such as glass or plastic coated with a transparent conductive film such as indium oxide on one or both sides. Next, using a conventional method, an optical path is formed using transparent silicone resin 3, and the outer periphery is molded with black epoxy resin 7 to complete the photocoupler.
上記第１の実施例は透明シリコン樹脂３で光経路を形成
する構造の例であるが、第５図に示す構造あるいは他の
構造のホトカプラに対しても本発明は同様に適用できる
。Although the first embodiment described above is an example of a structure in which the optical path is formed using the transparent silicone resin 3, the present invention can be similarly applied to a photocoupler having the structure shown in FIG. 5 or other structures.
次に、透光性導電板の設置方法について説明する。Next, a method for installing the transparent conductive plate will be explained.
第１図及び第２図に示すように、その断面の少くとも一
部が鉤の手形状有し、受光素子の厚さ分だけ段差を有す
る透光性導電板６をその一部が受光素子２のホトダイオ
ード２ａに密着させ、かつその他の一部が受光素子搭載
リード５に、例えば、銀ペースト等の導電性樹脂を接着
剤として密着して配置する。受光素子２を搭載しである
り一部５は通常接地電位に接続して用いるので、受光素
子２のホトダイオード２ａの表面に接地電位に接続され
た透光性導電板６が配置されたことになる。また、受光
素子表面は通常酸化膜あるいは窒化膜等でパシベーショ
ンを行なっているので、透光導電板６を受光素子の表面
に密着して配置してもホトダイオード２ａあるいは増幅
回路２ｂの各部と透光性導電板と電気的に短絡すること
ない。As shown in FIGS. 1 and 2, at least a part of its cross section has a hook-shaped shape and a translucent conductive plate 6 has a step equal to the thickness of the light receiving element. 2, and the other part is placed in close contact with the photodiode mounting lead 5 using a conductive resin such as silver paste as an adhesive. Since the light-receiving element 2 is mounted and the part 5 is normally connected to the ground potential, a transparent conductive plate 6 connected to the ground potential is arranged on the surface of the photodiode 2a of the light-receiving element 2. Become. Furthermore, since the surface of the light-receiving element is usually passivated with an oxide film or a nitride film, even if the light-transmitting conductive plate 6 is placed in close contact with the surface of the light-receiving element, the light-transmitting conductive plate 6 may be connected to each part of the photodiode 2a or the amplifier circuit 2b. There will be no electrical short circuit with the conductive plate.
第３図は本発明の第２の実施例の受光素子と透光性導電
板近傍の斜視図である。FIG. 3 is a perspective view of the light receiving element and the vicinity of the transparent conductive plate according to the second embodiment of the present invention.
第１の実施例とは透光性導電板６ａ及び受光素子搭載リ
ード５ａの形状が異っている。透光性導電板６ａの取付
は方向は、第１の実施例と比べて９０度ずれている。こ
のような形にしても良い。The shapes of the light-transmitting conductive plate 6a and the light-receiving element mounting lead 5a are different from the first embodiment. The mounting direction of the transparent conductive plate 6a is shifted by 90 degrees compared to the first embodiment. It may also be shaped like this.
以上説明した様に、本発明は、受光素子のダイオード部
に接地電位に接続された透光性導電板を設置したので、
受光素子の電気的シールドが施され、入力側の電気的ノ
イズによる誤動作の極めて発生しにくいホトカプラが得
られるという効果を有する。As explained above, in the present invention, since a transparent conductive plate connected to the ground potential is installed in the diode part of the light receiving element,
This has the effect of providing a photocoupler in which the light-receiving element is electrically shielded and is extremely unlikely to malfunction due to electrical noise on the input side.
斜視図、第３図は本発明の第２の実施例の受光素子と透
光性導電板部分の斜視図、第４図及び第５図は従来のホ
トカプラの第１及び第２の例の断面図、第６図は従来の
ホトカプラの等価回路図である。FIG. 3 is a perspective view of a light-receiving element and a translucent conductive plate portion of a second embodiment of the present invention, and FIGS. 4 and 5 are cross-sections of first and second examples of conventional photocouplers. 6 are equivalent circuit diagrams of a conventional photocoupler.
１・・・発光素子、２・・・受光素子、２ａ・・・ホト
ダイオード、２ｂ・・・増幅回路、３・・・透明シリコ
ン樹脂、４・・・発光素子用リード、５，５ａ・・・受
光素子用リード、６，６ａ・・・透光性導電板、７・・
・黒色エポキシ樹脂、８・・・透明エポキシ樹脂。DESCRIPTION OF SYMBOLS 1... Light emitting element, 2... Light receiving element, 2a... Photodiode, 2b... Amplifying circuit, 3... Transparent silicon resin, 4... Lead for light emitting element, 5, 5a... Lead for light receiving element, 6, 6a...Transparent conductive plate, 7...
・Black epoxy resin, 8...Transparent epoxy resin.
第１図は本発明の第１の実施例の断面図、第２図は第１
図に示す受光素子と透光性導電板部分の第 １ 園ｌｎ蔦 ２ ■第 ５ 「第 ６ 回FIG. 1 is a sectional view of the first embodiment of the present invention, and FIG. 2 is a sectional view of the first embodiment of the present invention.
Part 1 of the light-receiving element and transparent conductive plate shown in the figure.
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63291337AJPH02137275A (en) | 1988-11-17 | 1988-11-17 | Photo coupler |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63291337AJPH02137275A (en) | 1988-11-17 | 1988-11-17 | Photo coupler |
| Publication Number | Publication Date |
|---|---|
| JPH02137275Atrue JPH02137275A (en) | 1990-05-25 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63291337APendingJPH02137275A (en) | 1988-11-17 | 1988-11-17 | Photo coupler |
| Country | Link |
|---|---|
| JP (1) | JPH02137275A (en) |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1078247A4 (en)* | 1998-05-11 | 2002-12-04 | Igen Int Inc | Improved apparatus and methods for carrying out electrochemiluminescence test measurements |
| AU2003200956B2 (en)* | 1998-05-11 | 2006-01-19 | Bioveris Corporation | Improved Apparatus and Methods for Carrying Out Electrochemiluminescence Test Measurements |
| AU2006201608B2 (en)* | 1998-05-11 | 2007-06-07 | Bioveris Corporation | Improved Apparatus and Methods for Carrying Out Electrochemiluminescence Test Measurements |
| JP2007173708A (en)* | 2005-12-26 | 2007-07-05 | Ricoh Co Ltd | Optical sensor device |
| JP2011228339A (en)* | 2010-04-15 | 2011-11-10 | Renesas Electronics Corp | Optical coupler |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1078247A4 (en)* | 1998-05-11 | 2002-12-04 | Igen Int Inc | Improved apparatus and methods for carrying out electrochemiluminescence test measurements |
| AU2003200956B2 (en)* | 1998-05-11 | 2006-01-19 | Bioveris Corporation | Improved Apparatus and Methods for Carrying Out Electrochemiluminescence Test Measurements |
| AU2006201608B2 (en)* | 1998-05-11 | 2007-06-07 | Bioveris Corporation | Improved Apparatus and Methods for Carrying Out Electrochemiluminescence Test Measurements |
| JP2007173708A (en)* | 2005-12-26 | 2007-07-05 | Ricoh Co Ltd | Optical sensor device |
| JP2011228339A (en)* | 2010-04-15 | 2011-11-10 | Renesas Electronics Corp | Optical coupler |
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