【発明の詳細な説明】［産業上の利用分野］この発明は電子部品が接続される配線基板を機器ケース
に接着により固定するようにした小型電子機器に関する
。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a small electronic device in which a wiring board to which electronic components are connected is fixed to a device case by adhesive.
［従来の技術］従来、電子式卓上計算機のような小型電子機器は、電子
部品が接続された配！１基板と、これを収容するａｍ器
ケースとから構成され、上記機器ケースの上面には、デ
ータなどを入力したり、計算を行うためのキーボードや
、入力データ及び計算結果を表示する表示部などが設け
られている。[Prior Art] Conventionally, small electronic devices such as electronic desk calculators have been equipped with electronic components connected to them. It consists of one board and an AM device case that houses it, and the top surface of the equipment case includes a keyboard for inputting data and performing calculations, a display section for displaying input data and calculation results, etc. is provided.
また、上記従来の小型電子機器は、予めＩＣチップなど
の電子部品が組込まれた配線基板を機器ケースに組付け
る際に、上記電子部品の電極をはんだ付は或は異方導電
性接着剤により配線基板の接続端子に電気的に接続した
後、この配線基板を通常の接着剤を用いて機器ケースに
接着一体化していた。In addition, when the above-mentioned conventional small electronic devices are assembling the wiring board in which electronic components such as IC chips are pre-installed into the device case, the electrodes of the electronic components are connected by soldering or using an anisotropic conductive adhesive. After electrical connection is made to the connection terminals of the wiring board, the wiring board is integrally bonded to the device case using an ordinary adhesive.
［発明が解決しようとする問届点Ｊしかし上述のように電子部品を配線基板に接続するため
にはんだ付は或は異方導電性接着剤を用い、配線基板を
機器ケースに接着するために通常の接着“剤を用いるも
のでは、電子部品と配線基板の接続、及びこの配線基板
と機器ケースの接着が別工程となり、しかも、同一の配
線基板上で種類の異なる接着剤を使い分けなければなら
ない煩雑さがあり、組立作業能率を低下させる原因にな
っていた。[Question to be solved by the invention J However, as mentioned above, in order to connect electronic components to a wiring board, soldering or an anisotropic conductive adhesive is used, and in order to bond the wiring board to an equipment case. With conventional adhesives, connecting electronic components and wiring boards and bonding these wiring boards to equipment cases are separate processes, and different types of adhesives must be used on the same wiring board. This was complicated and caused a decrease in assembly work efficiency.
この発明は上記事情に鑑みてなされたもので、その目的
は、接着剤の塗布工程を簡略化し、組立作業の能率化を
計った小型電子機器を提供することである。This invention has been made in view of the above circumstances, and its purpose is to provide a small electronic device that simplifies the adhesive application process and improves the efficiency of assembly work.
［問題点を解決するための手段］この発明の小型電子機器は、電子部品が接続される配線
基板を機器ケースに接着に゛より固定する小型電子機器
において、上記配線基板の一面に。[Means for Solving the Problems] A small electronic device according to the present invention is a small electronic device in which a wiring board to which electronic components are connected is fixed to a device case by adhesive, on one side of the wiring board.
電子部品接続用及び機器ケース接着用のホットメルト型
異方導電性接着剤を印刷形成し、上記電子部品の電極を
上記電子部品接続用の異方導電性接着剤により上記配線
基板の接続端子に電気的に接続すると共に、上記配線基
板を上記機器ケース接着剤の異方導電性接着剤により上
記機器ケースに接着させたものである。A hot-melt anisotropic conductive adhesive for connecting electronic components and bonding equipment cases is printed and formed, and the electrodes of the electronic components are connected to connection terminals of the wiring board using the anisotropic conductive adhesive for connecting electronic components. In addition to electrical connection, the wiring board is bonded to the device case using an anisotropically conductive adhesive of the device case adhesive.
［作 用］すなわち、この発明の小型電子機器は、配線基板の一面
に、電子部品接続用及び機器ケース接着用のホットメル
ト型異方導電性接着剤を印刷形成したから、電子部品接
続用及び機器ケース接着用の接着剤の塗布工程が１工程
に簡略化できる上、従来のように同一の配線基板上で二
種類の接着剤を使い分ける煩雑さがなくなり、しかも、
上記電子部品の電極を上記電子部品接続用の異方導電性
接着剤により上記配線基板の接続端子に電気的に接続す
ると共に、上記配線基板を上記機器ケース接着用の異方
導電性接着剤により上記機器ケースに接着したから、組
立作業が悌率化できる。[Function] That is, the small electronic device of the present invention has a hot-melt anisotropic conductive adhesive for connecting electronic components and adhering equipment cases printed on one side of the wiring board. Not only can the process of applying adhesive for bonding equipment cases be simplified to one step, but it also eliminates the complexity of using two different types of adhesive on the same wiring board as in the past.
The electrodes of the electronic components are electrically connected to the connection terminals of the wiring board using an anisotropic conductive adhesive for connecting the electronic components, and the wiring board is connected to the connection terminals of the wiring board using an anisotropic conductive adhesive for bonding the equipment case. Since it is glued to the equipment case, the assembly work can be done more quickly.
［実施例］この発明を電子式卓上計算機に適用した一実施例につい
て図面を参照して詳述する。[Embodiment] An embodiment in which the present invention is applied to an electronic desktop calculator will be described in detail with reference to the drawings.
第１図はこの発明を適用した電子式卓上計算機の分解斜
視図で、この図においてｌは、機器ケース、２は配線基
板、３は液晶表示パネル、４は上面板、５は底面板を示
す。FIG. 1 is an exploded perspective view of an electronic desktop calculator to which the present invention is applied. In this figure, l indicates an equipment case, 2 indicates a wiring board, 3 indicates a liquid crystal display panel, 4 indicates a top plate, and 5 indicates a bottom plate. .
上記機器ケースｌは硬質プラスチックにより成形されて
いて、上面及び下面に上記上面板４及び底面板５がそれ
ぞれ嵌合する凹段部１ａ、１ｂが形成されている。この
機器ケースｌには、上面板４の表面に印刷されたキーボ
ード４ａの各表示キーと対応させてカーボンインクを転
写することにより形成された多数の固定接点６と、配線
基板２に取付けられた液晶表示パネル３を収容するため
の収容凹部１ｃ、電池端子部材７．．７２を組込むため
の収納部１ｄ＋ 、ｌｄｚ 、電池８の上面電極（陰極
）８ａを臨ませるための開口部１ｅ、この開口部１ｄｘ
の裏側に電池８を組込むために形成された電池収納部１
ｆ、配線基板２に取付けられたＩＣチップ９を収容する
ための収容口８８１ ｇ及びａＳケースｌに配線基板２
を組込む際、後述する位置決め治具ｌＯの２本のピン１
０ａを挿入するんめの位置決め用ピン孔１ｈなどが形成
されている。The device case 1 is molded from hard plastic, and has recessed portions 1a and 1b formed on the top and bottom surfaces, into which the top plate 4 and bottom plate 5 fit, respectively. This equipment case l has a large number of fixed contacts 6 formed by transferring carbon ink in correspondence with each display key of the keyboard 4a printed on the surface of the top plate 4, and a number of fixed contacts 6 attached to the wiring board 2. A housing recess 1c for housing the liquid crystal display panel 3, a battery terminal member 7. ．． 72, an opening 1e for exposing the upper surface electrode (cathode) 8a of the battery 8, and this opening 1dx.
A battery storage section 1 formed to incorporate a battery 8 on the back side of the
f, accommodating opening 881 for accommodating the IC chip 9 attached to the wiring board 2 g, and aS case l with the wiring board 2
When assembling the two pins 1 of the positioning jig
A positioning pin hole 1h for inserting the hole 0a is formed.
また配線基板２は上記機器ケースｌの上面に重ね合わせ
て配置される。この配！！基板２は、例えばポリエステ
ル樹脂等の柔軟なシートからなるフレキシブル基板によ
り形成されていて、下面２ｊには液晶表示パネル３の電
極３ａやＩＣチップ９の電極９ａを接続する位置に、こ
れら電極３ａ、９ａと対応するように接続端子２ａ、２
ｂが形成されていると共に、機器ケースｌに形成された
固定接点６と対向する位置に可！！＆接点パターン２Ｇ
が形成されている。この配線基板２には、ａ器ケースｌ
の収納部１ｄ＋、ｌｄ２側へ延出部２ｄ、２ｅが延出形
成され、その一方の延出部２ｄの下面には、導電性金属
（導電性部材）で形成された電池端子部材７１．７２が
それぞれ接続される接点パターン２ｆ＋ 、２ｆ２が、
さらに他方の延出部２ｅの上面には後述する接点板１２
のリセット用接片１２ｂとの間でリセットスイッチＡを
構成するリセット用スイッチ接点部２ｇがそれぞれ形成
されている。なお、この配線基板２には、機器ケースｌ
の各位置決め用ピン孔ｉｈと対向する位置に位置決めよ
うピン孔２ｈが形成されている。Further, the wiring board 2 is placed overlappingly on the upper surface of the equipment case l. This distribution! ! The substrate 2 is formed of a flexible substrate made of a flexible sheet such as polyester resin, and the lower surface 2j has electrodes 3a, 3a and 9a of the IC chip 9 connected to the electrodes 3a of the liquid crystal display panel 3 and the electrodes 9a of the IC chip 9, respectively. Connection terminals 2a, 2 correspond to 9a.
b is formed and can be placed at a position facing the fixed contact 6 formed on the equipment case l! ! &Contact pattern 2G
is formed. This wiring board 2 has a case l.
Extending portions 2d and 2e are formed to extend toward the storage portions 1d+ and ld2, and on the lower surface of one of the extending portions 2d, battery terminal members 71 and 72 formed of conductive metal (conductive member) are formed. The contact patterns 2f+ and 2f2 to which are connected, respectively, are
Further, on the upper surface of the other extending portion 2e, a contact plate 12, which will be described later, is provided.
A reset switch contact portion 2g forming the reset switch A is formed between the reset contact piece 12b and the reset contact piece 12b. Note that this wiring board 2 is equipped with an equipment case l.
A positioning pin hole 2h is formed at a position facing each positioning pin hole ih.
また、上述せる接続端子２ａ、２ｂ、可動接点パターン
２Ｃ１接点パターン２ｆ１．２ｆ２は１例えば、銅、ア
ルミニウム、ニッケル等の金属箔上にカーボンインクを
印刷し、このカーボンインクをエツチングレジストとし
て前記金属箔をエツチングするような、公知のエツチン
グ技術により形成されるものである。In addition, the above-mentioned connection terminals 2a, 2b, movable contact pattern 2C1, contact pattern 2f1, 2f2 are 1.For example, carbon ink is printed on a metal foil such as copper, aluminum, nickel, etc., and this carbon ink is used as an etching resist to etch the metal foil. It is formed by a known etching technique such as etching.
一方、ａｔ器ケースｌの上面を多う上面板４は、例えば
塩化ビニール樹脂やポリエステル樹脂などの透明で柔軟
なシートから形成されていて、液晶表示パネル３の液晶
表示部と対面する各窓状の表示部４ｂを除く全面に不透
明なインクによる印刷が施されて内部が透視できないよ
うになっていると共に、上記配線基板２の可動接点パタ
ーン２ｃと対応する位置には、キーボード４ａの各表示
キーが印刷されている。On the other hand, the upper surface plate 4 covering the upper surface of the AT device case l is formed from a transparent and flexible sheet such as vinyl chloride resin or polyester resin, and has the shape of each window facing the liquid crystal display section of the liquid crystal display panel 3. The entire surface of the keyboard 4a except for the display section 4b is printed with opaque ink so that the inside cannot be seen through, and each display key of the keyboard 4a is placed at a position corresponding to the movable contact pattern 2c of the wiring board 2. is printed.
このキーボード４ａは、テンキー４ｃ、四則演算用キー
４ｄ、データ用キー４８、クリヤー用キー４ｆ、オール
クリヤキー兼用の電源オンキー４ｇ及び電源オフキー４
ｈなどから構成されている。This keyboard 4a includes a numeric keypad 4c, four arithmetic operation keys 4d, a data key 48, a clear key 4f, a power on key 4g that also serves as an all clear key, and a power off key 4.
It consists of h, etc.
また底面板５は、アルミニウム等の金属板から形成され
ていて、機器ケースｌの底面を覆うようになっている。The bottom plate 5 is made of a metal plate such as aluminum, and covers the bottom of the device case l.
一方の電池端子部材７１は、第２図に示すように、基部
７ａに２本の接片７ｂ、７Ｃを一体に突設した形状で、
基部７ａに穿設された小孔７ｄを機器ケースｌの収納部
１ｄ＋に突設された突起１ｉ＋ に嵌着させることによ
り機器ケースｌに取付けられる。この取付は状態で、一
方の接片７ｂは電池収納部Ｉｆに下方より収納された電
池８の上面電極（陰極）８ａと接するようになっている
と共に、他方の接片７Ｃは配線基板２の延出部２ａ下面
に形成された接点パターン２ｆｌ に下方より接するよ
うになっている（第５図）。As shown in FIG. 2, one battery terminal member 71 has a shape in which two contact pieces 7b and 7C are integrally protruded from a base 7a.
The device is attached to the device case l by fitting a small hole 7d formed in the base portion 7a into a protrusion 1i+ protruding from the housing portion 1d+ of the device case l. In this installation, one contact piece 7b is in contact with the upper surface electrode (cathode) 8a of the battery 8 stored from below in the battery storage part If, and the other contact piece 7C is in contact with the upper surface electrode (cathode) 8a of the battery 8 stored in the battery storage part If from below. It comes into contact with a contact pattern 2fl formed on the lower surface of the extending portion 2a from below (FIG. 5).
さらに他方の電池端子部材７２は、第２図に示すように
、基部７０に３木の接片７ｆ、７ｇ、７ｈを一体に突設
した形状とされ、基部７ｅに穿設された小孔７１を機器
ケースｌの収納部１ｄ２に突設された突起ｌｉ２に嵌着
させることにより１機器ケースｌに取付けられる。Furthermore, as shown in FIG. 2, the other battery terminal member 72 has a shape in which three wooden contact pieces 7f, 7g, and 7h are integrally protruded from the base 70, and a small hole 71 bored in the base 7e. It is attached to one equipment case l by fitting it into a protrusion li2 protruding from the housing part 1d2 of the equipment case l.
また、上記接片７ｆ、７ｇ、７ｈの内、接片７ｆは電池
８の周側面電極（陽極）８ｈに、他の接片７ｇは延出部
２ｄの下面に形成された接点パターン２ｆ２にそれぞれ
接触する（第５図）ようになっていると共に、接片７ｈ
はリセット用スイッチ接点部２ｇを上面に形成した配線
基板２の延出部２ｅ直下に延設され、後述するリセット
孔１ｆＬから差し込まれたリセット操作用ピン１３（第
５図）によって配線基板２偏に弾性変形されて外配線基
板２の延出部２Ｃ下面を押圧するようになっている。
゛一方、接点板１２は、導電性金属で形成されていて、第
２図に示すように、基部１２ａとこの基部１２ａから突
設されたリセット用接片１２ｂ及びフック１２ｃよりな
り、フック１２ｃｔ−機器ケースｌに形成された係合凹
部１ｊに係合させた状態（第５図）で、基部１２ａに穿
接された小孔１２ｄを、機器ケースｌの収納部１ｄ２に
穿接されたねじ孔１ｋにビスにて固定することにより、
機器ケースｌに取付けられる。Among the contact pieces 7f, 7g, and 7h, the contact piece 7f is connected to the peripheral side electrode (anode) 8h of the battery 8, and the other contact piece 7g is connected to the contact pattern 2f2 formed on the lower surface of the extension portion 2d. (Fig. 5), and the contact piece 7h
The circuit board 2 is extended directly below the extension 2e of the wiring board 2 on which the reset switch contact part 2g is formed, and the wiring board 2 is biased by a reset operation pin 13 (FIG. 5) inserted from the reset hole 1fL, which will be described later. It is elastically deformed to press the lower surface of the extending portion 2C of the external wiring board 2.
On the other hand, the contact plate 12 is made of a conductive metal, and as shown in FIG. In the state in which the device is engaged with the engagement recess 1j formed in the device case l (FIG. 5), the small hole 12d drilled in the base 12a is connected to the screw hole drilled in the housing portion 1d2 of the device case L. By fixing to 1k with screws,
Attached to equipment case l.
この取付けられた接点板１２の基部１２ａ下面には、配
線基板２の延出部２ａ上面に該延出部２ａ下面の接点パ
ターン２ｆ２ と対応して形成されたリセット用接点２
１が接触するようになっていると共に、リセット用接点
１２ｂは、配線基板２の延出部２ｅを挾んで、前記電池
端子部材７２の接片７ｈ直上に配設されている。On the lower surface of the base 12a of the attached contact plate 12, a reset contact 2 is formed on the upper surface of the extending portion 2a of the wiring board 2 in correspondence with the contact pattern 2f2 on the lower surface of the extending portion 2a.
1 are in contact with each other, and the reset contact 12b is disposed directly above the contact piece 7h of the battery terminal member 72, sandwiching the extension 2e of the wiring board 2.
そして、このリセット用接片１２ｂの周縁部には、リセ
ット用スイッチ接点部２ｇと対向しない位ｌに該リセッ
ト用スイッチ接点部２ｇを囲繞するように配置された複
数の突起部１２ｅが上記配線基板２の延出部２ｅに向け
て突出形成されている。これら突起部１２ｅは１通常は
配線基板２の延出部２ｅ上面のリセット用スイッチ接点
部２ｇと接点板１２のリセット用接片１２ｂとを所定の
間隔に保ち、該スイッチ接点部２ｇと接片１２ｂとの接
触を防止するものである。そして、機器ケースｌの収納
部ｌｄ２底面部及び底面板５にかけて穿設されたリセッ
ト孔１ｊｌからピン１３を第５図及び第７図に示すよう
に差し込んで、電池端子部材７２の接片７ｈを介して配
線基板２のリセット用スイッチ接点部２ｇ裏面、すなわ
ち延出部２ｅ下面を上記接点板１２に向けて押圧操作し
、該配線基板２の延出部２ｅを上記接点板１２のリセッ
ト用接片１２ｂの突起部１２ｅから該接点板１２のリセ
ット用按片１２ｂ側に湾曲変形させることにより、上記
配線基板２のリセット用スイッチ接点部２ｇが上記接点
板１２のリセット用接片１２ｂに接触されるようになっ
ている。この結果、リセット用スイッチ接点部２ ｇ、
が接点板１２を介して配線基板２の延出部２ｄ上面のリ
セット用接点２Ｉに接続され、リセットスイッチＡがオ
ンされてリセット信号が入力されるようになっている。A plurality of protrusions 12e are arranged on the peripheral edge of the reset contact piece 12b so as to surround the reset switch contact part 2g so as not to face the reset switch contact part 2g. It is formed to protrude toward the extending portion 2e of No. 2. These protrusions 12e normally maintain a predetermined distance between the reset switch contact part 2g on the upper surface of the extension part 2e of the wiring board 2 and the reset contact piece 12b of the contact plate 12. 12b. Then, as shown in FIGS. 5 and 7, insert the pin 13 through the reset hole 1jl drilled across the bottom of the housing part ld2 and the bottom plate 5 of the equipment case l, and then connect the contact piece 7h of the battery terminal member 72. The rear surface of the reset switch contact portion 2g of the wiring board 2, that is, the lower surface of the extension portion 2e, is pressed toward the contact plate 12 through By bending and deforming the protruding portion 12e of the piece 12b toward the reset arming piece 12b side of the contact plate 12, the reset switch contact portion 2g of the wiring board 2 is brought into contact with the reset contact piece 12b of the contact plate 12. It has become so. As a result, the reset switch contact part 2g,
is connected to the reset contact 2I on the upper surface of the extension 2d of the wiring board 2 via the contact plate 12, and the reset switch A is turned on to input a reset signal.
なお、第２図中の符号１４は機器ケースｌの電池収納部
１ｆを下方より閉塞する電池蓋で、内面に電池８を収容
する環状突条１４ａが、また一端側に機器ケースｌに係
合するフック１４ｂが、そして他端側に電池Ｍ１４をａ
Ｉ！ケースｌにビスにて固定する小孔１４ｃがそれぞれ
形成されている。The reference numeral 14 in FIG. 2 is a battery lid that closes off the battery storage section 1f of the equipment case l from below, and has an annular protrusion 14a that accommodates the battery 8 on its inner surface, and also engages with the equipment case l on one end side. The hook 14b that connects the battery M14 to the other end
I! Small holes 14c are formed in each of the cases l to be fixed with screws.
次に上記の如く構成された小型電子機器の組立工程を説
明する。Next, the assembly process of the small electronic device configured as described above will be explained.
まず、上記配線基板２の下面２ｊには、第１図に示すよ
うに、上記液晶表示パネル３の電極３ａとＩＣチップ９
の電極９ａが電気的に接続される接続端子２ａ、２ｂ上
の位置に電子部品接続用のホットメルト型異方導電性接
着剤１５ａ、１５ｂを、また可動接点パターン２Ｃと重
ならない位置に適当な間隔を置いてＩａ３！ケース接着
用のホットメルト型異方導電性接着剤１５ｃを、ｌ工程
で印刷形成しておく。First, on the lower surface 2j of the wiring board 2, as shown in FIG.
Hot-melt type anisotropic conductive adhesives 15a and 15b for connecting electronic components are applied to the positions on the connection terminals 2a and 2b to which the electrodes 9a are electrically connected, and an appropriate hot-melt type anisotropic conductive adhesive 15a and 15b is applied to the positions that do not overlap with the movable contact pattern 2C. Ia3 at intervals! A hot melt type anisotropically conductive adhesive 15c for bonding the case is printed and formed in step 1.
そして、この配線基板２の接続端子２ａ、２ｂには、液
晶表示パネル３の電極３ａ及びＩＣチップ９の電極９ａ
を、それぞれの異方導電性接着剤１５ａ及び１５ｂによ
り接着一体化させる。なお、この接着操作は、例えば１
図示しない加熱圧着治具により、配線基板２の上面側か
ら加熱圧着することにより行われる。The connection terminals 2a and 2b of the wiring board 2 are connected to an electrode 3a of the liquid crystal display panel 3 and an electrode 9a of the IC chip 9.
are bonded and integrated using respective anisotropic conductive adhesives 15a and 15b. Note that this adhesion operation is performed, for example, in 1
This is carried out by heat-pressing the wiring board 2 from the upper surface side using a heat-pressing jig (not shown).
このように液晶表示パネル３及びＩＣチ、プ９を接続し
た配線基板２は、第８図に示すように、位置決め治具ｌ
Ｏ上に載置した機器ケースｌ上に位置決めして載置する
。なお、機器ケース１及び配線基板２は、その各ピン孔
１ｈ及び２ｈに位置決め治具１０の各ピンｌＯａを挿入
して位置決めされる。As shown in FIG.
Position and place it on the equipment case l placed on the device case l. Note that the device case 1 and the wiring board 2 are positioned by inserting each pin lOa of the positioning jig 10 into each of the pin holes 1h and 2h.
この状態で、液晶表示パネル３及びＩＣチップ９の機器
ケースｌの収容凹部１ｃ、１ｇ内に収容配置される。な
お、この収容配置時に、液晶表示パネル３の下面及びＩ
Ｃチップ９の下面はそれぞれ機器ケースｌの収容凹部１
ｃ、１ｇの底面に通常の接着剤１日ａ（第４図）、１６
ｂ（第８図）により一体に接着しておいても良い。In this state, the liquid crystal display panel 3 and the IC chip 9 are housed in the housing recesses 1c and 1g of the device case l. Note that when this accommodation arrangement is made, the lower surface of the liquid crystal display panel 3 and the I
The lower surface of the C-chip 9 is located in the accommodation recess 1 of the equipment case l.
c, regular adhesive 1 day a (Fig. 4) on the bottom of 1 g, 16
b (FIG. 8) may be used to bond them together.
次に、例えば第９図に示すように、加熱圧着治具１７の
ヘッド１７ａを、上記配線基板２の上面に、上記異方導
電性接着剤１５ｃと対向させて押付け、該導電性接着剤
１５ｃを機器ケースｌに対し加熱圧着することにより、
配線基板２を機器ケース１に異方導電性接着剤１５ｃで
接着一体化させる。Next, as shown in FIG. 9, for example, the head 17a of the thermocompression bonding jig 17 is pressed against the upper surface of the wiring board 2, facing the anisotropically conductive adhesive 15c. By heat-pressing the to the equipment case l,
The wiring board 2 is bonded and integrated with the device case 1 using an anisotropic conductive adhesive 15c.
上述の如く配線基板２を一体に接着した機器ケースｌは
１位置決め治具ｌＯから取外される。The equipment case l having the wiring board 2 bonded together as described above is removed from the first positioning jig lO.
次に、電池端子部材７Ｉの小孔７ｄｌ−機器ケースｌの
突起１ｉ＋ に嵌着させ、また電池端子部材７２の小孔
７Ｘを機器ケース１の突起１１’２に嵌着させて、各電
池端子部材７．，７２を、配線基板２の各延出部２ｄ、
２ｅの下側に位置させて機器ケアスｌの収納部１ｃｉ＋
、ｌｄ２にそれぞれ収納配置する。この状態で、接点板
１２のフック１２Ｃを機器ケース１の係合凹部１ｊに係
合させると共に、接点板１２の小孔１２ｄを機器ケース
１のねじ孔１ｋにビスにて固定して、該接点板１２を機
器ケースｌに取付ければ、電池端子部材７１の接片７ｃ
が配線基板２の接点パターン２ｆｌ に接触されると共
に、電池端子部材７ｚの接片７ｇが配線基板２の接点パ
ターン２ｆ２に接触され、さらに、配線基板２の延出部
２ａ上面のリセット用接点２１が接点板１２の基部１２
ａ下面に接触される。Next, each battery terminal is fitted into the small hole 7dl of the battery terminal member 7I and the projection 1i+ of the equipment case l, and the small hole 7X of the battery terminal member 72 is fitted into the projection 11'2 of the equipment case 1. Member 7. , 72, each extending portion 2d of the wiring board 2,
Storage area 1ci+ for equipment care l located on the lower side of 2e
, ld2. In this state, the hook 12C of the contact plate 12 is engaged with the engagement recess 1j of the equipment case 1, and the small hole 12d of the contact plate 12 is fixed to the screw hole 1k of the equipment case 1 with a screw, so that the contact When the plate 12 is attached to the equipment case l, the contact piece 7c of the battery terminal member 71
is brought into contact with the contact pattern 2fl of the wiring board 2, and the contact piece 7g of the battery terminal member 7z is brought into contact with the contact pattern 2f2 of the wiring board 2, and furthermore, the reset contact 21 on the upper surface of the extension part 2a of the wiring board 2 is the base 12 of the contact plate 12
a The lower surface is contacted.
最後に、上面板４及び底面板５を、第４図に示すように
、それぞれ通常の接着剤１６ｃ、１６ｄにより機器ケー
スｌの上面凹段部１ａ及び下面凹段部ｔｂに一体に接着
して１組立てが完了する。Finally, as shown in FIG. 4, the top plate 4 and the bottom plate 5 are integrally bonded to the top concave step 1a and bottom concave step tb of the equipment case l using ordinary adhesives 16c and 16d, respectively. 1 assembly is completed.
なお、機器ケース１の電池収納部１ｆには、電池８が収
納され、この収納された電池８は、電池収納部Ｉｆを電
池蓋１４で閉塞することにより該電池収納部Ｉｆ内に固
定される。この状態で、−方の電池端子部材７Ｉは、接
片７ｂを電池８の上面電極８ａに、接片７Ｃを配線基板
２の延出部２ａ下面の接点パターン２ｆ＋に、接片７ｂ
、７ｃのそれぞれのばね力によって接触されると共に、
他方の電池端子部材７２は、接片７ｆを電池８の周側面
電極８ｂに、接片７ｇを配線基板２の延出部２ａ下面の
接点パターン２ｆ２に、接片７ｆ、７ｇのそれぞれのば
ね力によって接触される。そして、配線基板２の延出部
２ａ上面に接点パターン２ｆ２ と対応して形成された
リセット用接点２１は、上記電池端子部材７２の接片７
ｇｅ接点パターン２ｆ２に接触させる該接片７ｇのばね
力を利用して接点板１２の基部１２ａ下面に接触される
。つまり１．電池端子部材７ｚの接片７ｇが。Note that a battery 8 is stored in the battery storage part 1f of the device case 1, and the stored battery 8 is fixed in the battery storage part If by closing the battery storage part If with the battery lid 14. . In this state, the negative battery terminal member 7I connects the contact piece 7b to the upper surface electrode 8a of the battery 8, the contact piece 7C to the contact pattern 2f+ on the lower surface of the extension part 2a of the wiring board 2, and the contact piece 7b
, 7c by their respective spring forces, and
The other battery terminal member 72 has a contact piece 7f attached to the peripheral side electrode 8b of the battery 8, a contact piece 7g attached to the contact pattern 2f2 on the lower surface of the extension portion 2a of the wiring board 2, and a spring force of each of the contact pieces 7f and 7g. be contacted by. The reset contact 21 formed on the upper surface of the extending portion 2a of the wiring board 2 in correspondence with the contact pattern 2f2 is connected to the contact piece 7 of the battery terminal member 72.
The spring force of the contact piece 7g brought into contact with the ge contact pattern 2f2 is used to contact the lower surface of the base 12a of the contact plate 12. In other words, 1. The contact piece 7g of the battery terminal member 7z is.
該接片７ｇを配線基板２の延出部２ａ下面の接点パター
ン２ｆ２に接触させる電源接点ばねとしての機能と、配
線基板２の延出部ｄ上面のリセット用接点２１を接点板
１２の基部１２ａ下面に接触させるリセット用接点ばね
としての機部を、兼有することになる。The function as a power contact spring is to bring the contact piece 7g into contact with the contact pattern 2f2 on the lower surface of the extension part 2a of the wiring board 2, and the reset contact 21 on the upper surface of the extension part d of the wiring board 2 is brought into contact with the base 12a of the contact plate 12. It also serves as a mechanical part as a reset contact spring that is brought into contact with the lower surface.
上述のようにして組立てられた電子式卓上計算機におい
て、データの入力や計算等は、上面板４に表示されてい
るキーボード４ａの各表示キ一部分を押圧操作して行わ
れる。すなわち、上面板４のキーボード４ａの各表示キ
一部分を押圧操作すると、該上面板４の下にある配線基
板２の可動接点パターン２Ｃが機器ケースｌの固定接点
６に接触される。この接触により、電池８から電池端子
部材７２の接片７ｆ、７ｇ及び接点パターン２ｆ２を介
して信号が入力され１種々のデータの入力や計算が行わ
れる。また、この電子式卓上計算機のリセット操作は、
機器ケースｌの裏面に開口されているリセット孔１１か
らピン１３を第５図及び第７図に示すように差し込んで
、電池端子部材７２の接片７ｈを介して配線基板２の延
出部２ｅのリセット用スイッチ接点部２ｇ裏面を上記接
点板１２のリセット用接片１２ｂに向けて押圧操作し、
該配線基板２の延部部２ｅを上記接点板１２のリセット
用接片１２ｂの突起部１２ｅから該接点板１２の接片１
２ｂ側に第７図の如く湾曲変形させればよい、これによ
り、配線基板２のリセット用スイッチ接点部２９が上記
接点板１２のリセット用接片１２ｂに接触される。この
結果。In the electronic desktop calculator assembled as described above, data input, calculation, etc. are performed by pressing a portion of each display key of the keyboard 4a displayed on the top plate 4. That is, when each display key portion of the keyboard 4a of the top plate 4 is pressed, the movable contact pattern 2C of the wiring board 2 under the top plate 4 is brought into contact with the fixed contact 6 of the equipment case l. Due to this contact, signals are input from the battery 8 via the contact pieces 7f, 7g of the battery terminal member 72 and the contact pattern 2f2, and various data input and calculations are performed. In addition, the reset operation of this electronic desk calculator is as follows.
As shown in FIGS. 5 and 7, the pin 13 is inserted into the reset hole 11 opened on the back surface of the device case l, and the extended portion 2e of the wiring board 2 is inserted through the contact piece 7h of the battery terminal member 72. Press the back side of the reset switch contact part 2g toward the reset contact piece 12b of the contact plate 12,
The extending portion 2e of the wiring board 2 is moved from the projection 12e of the reset contact piece 12b of the contact plate 12 to the contact piece 1 of the contact plate 12.
2b side as shown in FIG. 7. As a result, the reset switch contact portion 29 of the wiring board 2 comes into contact with the reset contact piece 12b of the contact plate 12. As a result.
上記配線基板２のリセット用スイッチ接点部２ｇが上記
接点板１２を介して配線基板２の延出部２ａ上面のリセ
ット用接点２１に接ｔｈ！（スイッチオン）されてリセ
ット信号が入力される。The reset switch contact portion 2g of the wiring board 2 contacts the reset contact 21 on the upper surface of the extension portion 2a of the wiring board 2 via the contact plate 12 th! (switch on) and a reset signal is input.
しかして、この発明の小型電子機器は、配線基板２の一
面、すなわち下面２ｊに液晶表示パネル３やＩＣチップ
９などの電子部品の接続用として、また機器ケースｌの
接着用として同一種類の接着剤であるホットメルト型異
方導電性接着剤１５ａ、１５ｂ、１５ｃを印刷形成する
ようにしたから、接着剤１５ａ、１５ｂ、１５ｃの塗布
工程が１工程に簡略化できる上、従来のように同一の配
線基板上で種類の異なる接着剤を使い分ける煩雑さがな
くなり、しかも、上記液晶表示パネル３及びＩＣチップ
９の各電極３ａ、９ａを上記電子部品接続用の異方導電
性接着剤１５ａ、１５ｂにより上記配線基板２の接続端
子２ａ、２ｂに電気的に接続すると共に、上記配線基板
２を上記機器ケース接着用の異方導電性接着剤１５ｃに
より機器ケースｌに接着したから１組立作業が能率化で
きる。また、配線基板２に銅、アルミニウム、ニッケル
等の金属箔を接着し、この金属箔上にエツチングレジス
トを塗布してエツチングにより配線パターンを形成した
基板では、常温型の接着剤を用いると、接着剤に含有さ
れた水分と接着剤の吸湿性により金属箔の側部から酸化
が生じるが、ホットメルト型接着剤を用いることにより
このような問題をなくすことができる。Therefore, the small electronic device of the present invention uses the same type of adhesive on one surface of the wiring board 2, that is, the lower surface 2j, for connecting electronic components such as the liquid crystal display panel 3 and the IC chip 9, and for bonding the device case l. Since the hot-melt anisotropic conductive adhesives 15a, 15b, and 15c are printed, the process of applying the adhesives 15a, 15b, and 15c can be simplified to one process, and the process is the same as the conventional one. The complexity of using different types of adhesives on the wiring board is eliminated, and the electrodes 3a and 9a of the liquid crystal display panel 3 and IC chip 9 are connected to the anisotropically conductive adhesives 15a and 15b for connecting the electronic components. The wiring board 2 is electrically connected to the connecting terminals 2a and 2b of the wiring board 2 by the above-described method, and the wiring board 2 is bonded to the equipment case l using the anisotropic conductive adhesive 15c for adhering the equipment case, making one assembly process more efficient. can be converted into In addition, with a board in which a metal foil of copper, aluminum, nickel, etc. is bonded to the wiring board 2, an etching resist is applied on the metal foil, and a wiring pattern is formed by etching, it is difficult to bond the wiring board 2 with a room-temperature adhesive. Although oxidation occurs from the sides of the metal foil due to the moisture contained in the adhesive and the hygroscopicity of the adhesive, such problems can be eliminated by using a hot melt adhesive.
さらに、上記実施例によれば、リセット孔１１から差し
込まれたピン１３は、電池端子部材７２の接片７ｈを介
して配線基板２の延出部２ａ下面を押圧するようにした
ので、ピン１３を直接配線基板２に当接させなくてすみ
、ピン１３による配線基板２の損傷を防止できる。Further, according to the above embodiment, the pin 13 inserted from the reset hole 11 presses the lower surface of the extending portion 2a of the wiring board 2 via the contact piece 7h of the battery terminal member 72. There is no need to bring the pins into direct contact with the wiring board 2, and damage to the wiring board 2 caused by the pins 13 can be prevented.
なお、上記実施例においては、液晶表示パネル３の電極
３ａとＩＣチップ９の電極９ａが接続される接続端子２
ａ、２ｂ上の位置に電子部品接続用のホットメルト型異
方導電性接着剤１５ａ、１５ｂを形成し、また上記機器
ケース１に接着される、例えば可動接点パターン２Ｃと
重ならない位置に適当な間隔を置いて機器ケース接着用
のホットメルト型異方導電性接着剤１５ｃを形成したが
、この発明はこれに限らない、すなわち、異方導電性接
着剤は上下方向にのみ導電性を有し、横方向には導電し
ないので、配線基板２の下面２Ｊの全面に、ホットメル
ト型異方導電性接着剤を印刷形成してもよい。In the above embodiment, the connection terminal 2 to which the electrode 3a of the liquid crystal display panel 3 and the electrode 9a of the IC chip 9 are connected
Hot-melt anisotropic conductive adhesives 15a and 15b for connecting electronic components are formed at positions above a and 2b, and suitable adhesives are formed at positions that do not overlap with, for example, the movable contact pattern 2C that is adhered to the device case 1. Although the hot melt type anisotropically conductive adhesive 15c for bonding the device case is formed at intervals, the present invention is not limited thereto; in other words, the anisotropically conductive adhesive has conductivity only in the vertical direction. Since it is not conductive in the lateral direction, a hot melt type anisotropic conductive adhesive may be printed on the entire lower surface 2J of the wiring board 2.
また、上記実施例では、液晶表示パネル３とＩＣチップ
９を異方導電性接着剤１５ａ、１５ｂにより配線基板２
に接着一体化した後、この配線基板２を機器ケース１に
接着するようにしたが、この発明はこれに限定されるも
のではない、すなわち、予め電子部品接続用及び機器接
着用のホットメルト型異方導電性接着剤１５ａ、１５ｂ
、１５ｃを印刷形成した配線基板２を機器ケース！上に
搭載した状態で、液晶表示パネル３及びＩＣチップ９を
配線基板２に接続するようにしてもよい、この場合、液
晶表示パネル３はその電極３ａを上に向けて機器ケース
ｌの収容凹部１ｃに収容すると共に、ＩＣチップ９はそ
の電極９ａを上に向けて機器ケースｌの収容四部１ｇに
収容配置しておき、この上に、下面２ｊにホットメルト
型異方導電性接着剤１５ａ、１５ｂ、１５ｃが印刷形成
されている配線基板２を配置し、この配線基板２の下面
に、上記異方導電性接着剤１５ａ、１５ｂ、１５ｃと対
向させて加熱圧着治具のヘッドを押付ければ、それぞれ
の異方導電性接着剤１５ａ、１５ｂ、１５ｃにより、液
晶表示パネル３及びＩＣチップ９の各電極３ａ、９ａと
配線基板２の接続端子２ａ、２ｂ、及び該配線基板２と
機器ケースｌを、同時に接着一体化させることができる
。Further, in the above embodiment, the liquid crystal display panel 3 and the IC chip 9 are bonded to the wiring board 2 with anisotropic conductive adhesives 15a and 15b.
Although the wiring board 2 is bonded to the device case 1 after being bonded and integrated, the present invention is not limited thereto. Anisotropic conductive adhesive 15a, 15b
, 15c is printed on the wiring board 2 as a device case! The liquid crystal display panel 3 and the IC chip 9 may be connected to the wiring board 2 while being mounted on the top of the device. 1c, the IC chip 9 is housed in the housing section 1g of the device case l with its electrode 9a facing upward, and on top of this, a hot melt type anisotropically conductive adhesive 15a is applied to the lower surface 2j. 15b and 15c are printed, and the head of the heat-pressing jig is pressed against the bottom surface of the wiring board 2, facing the anisotropically conductive adhesives 15a, 15b, and 15c. , the connection terminals 2a, 2b between the electrodes 3a, 9a of the liquid crystal display panel 3 and the IC chip 9 and the wiring board 2, and the wiring board 2 and the equipment case l by means of the respective anisotropic conductive adhesives 15a, 15b, 15c. can be bonded and integrated at the same time.
さらに、この発明は、上述の液晶表示パネルやＩＣチッ
プの他に、ソーラー電池及びこれに付属するコンデンサ
等の電子部品を配＆ａ基板に接続する場合にも適用でき
る。Further, the present invention can be applied not only to the above-mentioned liquid crystal display panel and IC chip but also to the case where electronic components such as a solar battery and attached capacitors are connected to the distribution & a board.
［発明の効果］この発明の小型電子機器は、配線基板の一面に、電子部
品接続用及び機器ケース接着用のホットメルト型異方導
電性接着剤を印刷形成したから、電子部品接続用及び機
器ケース接着用の接着材の塗布工程が１工程に簡略化で
きる上で種類の異なる接着剤を使い分ける煩雑さがなく
なり、しかも、上記電子部品の電極を上記電子部品接続
用の異方導電性接着剤により上記配線基板の接続端子に
電気的に接続すると共に、上記配線基板を上記機器ケー
ス接着用の異方導電性接着剤により上記機器ケースに接
着したから、組立作業が能率化できる。さらに、上記ホ
ットメルト型異方導電性接着剤は加熱圧着するだけで容
易に接着一体化でき、作業性がよい。[Effects of the Invention] The small electronic device of the present invention has a hot-melt anisotropic conductive adhesive for connecting electronic components and adhering equipment cases printed on one side of the wiring board. The process of applying the adhesive for bonding the case can be simplified to one step, and the complexity of using different types of adhesives can be eliminated. Moreover, the electrodes of the electronic components can be connected to the anisotropically conductive adhesive for connecting the electronic components. Since the wiring board is electrically connected to the connection terminals of the wiring board and the wiring board is bonded to the device case using an anisotropic conductive adhesive for bonding the device case, assembly work can be streamlined. Furthermore, the hot-melt type anisotropically conductive adhesive can be easily bonded and integrated simply by heat-pressing, and has good workability.
図面はこの発明の一実施例を示し、第１図は分解斜視図
、第２図は配線基板、電池、電池端子部材及びリセット
用接点板部分の分解斜視図、第３図は組立状態の外観斜
視図、第４図は第３図■−■線に沿う断面図、第５図は
第１図ｖ−ｖ線に沿う断面図、第６図はリセットスイッ
チの断面図、第７図は同リセットスイッチの操作状態を
示す断面図、第８図は機器ケース上に配線基板を位置決
めした状態の断面図、第９図は加熱圧着治具により配線
基板を機器ケースに接着一体化させる状態の断面図であ
る。ｌ・・・・・・機器ケース、２・・・・・・配線基板、
３・・・・・・液晶表示パネル、９・・・・・・ＩＣチ
ップ、１５ａ。１５ｂ・・・・・・電子部品接続用の異方導電性接着剤
、１５ｃ・・・・・・機器ケース接着用の異方導電性接
着剤。特許出願人 カシオ計算機株式会社代理人 弁理士 町 １）俊 正 ；寥□−−１第２図第５図第６図第７図The drawings show an embodiment of the present invention; FIG. 1 is an exploded perspective view, FIG. 2 is an exploded perspective view of the wiring board, battery, battery terminal member, and reset contact plate, and FIG. 3 is an external appearance of the assembled state. 4 is a sectional view taken along the line ■-■ in FIG. 3, FIG. 5 is a sectional view taken along the v-v line in FIG. 1, FIG. 6 is a sectional view of the reset switch, and FIG. A cross-sectional view showing the operating state of the reset switch, Figure 8 is a cross-sectional view of the wiring board positioned on the equipment case, and Figure 9 is a cross-sectional view of the wiring board being bonded and integrated with the equipment case using a heat-pressing jig. It is a diagram. l...Equipment case, 2...Wiring board,
3...Liquid crystal display panel, 9...IC chip, 15a. 15b... Anisotropically conductive adhesive for connecting electronic components, 15c... Anisotropically conductive adhesive for bonding equipment cases. Patent Applicant Casio Computer Co., Ltd. Agent Patent Attorney Machi 1) Masa Toshi; Toshi□--1 Figure 2 Figure 5 Figure 6 Figure 7
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|---|---|---|---|
| JP62252361AJPH0195596A (en) | 1987-10-08 | 1987-10-08 | Small-sized electronic equipment |
| KR1019880002234AKR910004797B1 (en) | 1987-04-08 | 1988-03-04 | Small electronic device and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62252361AJPH0195596A (en) | 1987-10-08 | 1987-10-08 | Small-sized electronic equipment |
| Publication Number | Publication Date |
|---|---|
| JPH0195596Atrue JPH0195596A (en) | 1989-04-13 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62252361APendingJPH0195596A (en) | 1987-04-08 | 1987-10-08 | Small-sized electronic equipment |
| Country | Link |
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| JP (1) | JPH0195596A (en) |
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