【発明の詳細な説明】〔産業上の利用分野〕本発明はジグザグ型ＩＣ１特に、電子機器に使用される
ジグザグ型ＩＣに関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a zigzag type IC 1, particularly to a zigzag type IC used in electronic equipment.
従来のジグザグ型ＩＣは第２図に示すようにプリント基
板に接続するものにも半田付用リードで接続していた。Conventional zigzag type ICs are also connected to the printed circuit board using soldering leads, as shown in FIG.
しかしながらこのような上述した従来のジグザグ型ＩＣ
は半田付用リードのため、実装パターンが引きすらいと
いう欠点がある。However, the above-mentioned conventional zigzag type IC
Because it is a lead for soldering, it has the disadvantage that the mounting pattern is uneven.
本発明のジグザグ型ＩＣは表面実装技術用リードを含ん
で構成される。The zigzag type IC of the present invention includes leads for surface mounting technology.
次に、本発明の実施例について図面を参照して説明する
。Next, embodiments of the present invention will be described with reference to the drawings.
第１図は本発明の一実施例を示す斜視図である。FIG. 1 is a perspective view showing an embodiment of the present invention.
第１図に示すジグザグ型ＩＣは、ＩＣ本体１０両端のリ
ードが半田付用リード２となり、ＩＣの転倒を防いでい
る。In the zigzag type IC shown in FIG. 1, the leads at both ends of the IC body 10 serve as soldering leads 2 to prevent the IC from falling over.
他のリードは表面実装技術用リード３，４であり、これ
らは互いに千鳥状となるように配置されている。The other leads are surface mount technology leads 3 and 4, which are arranged in a staggered manner.
プリント基板にジグザグ型ＩＣを実装する時は、スルー
ホールに半田付用リード２を挿入し、ＩＣの転倒を防ぎ
、他のリードはプリント基板上につくられたパッド上に
クリーム半田により半田接続される。When mounting a zigzag IC on a printed circuit board, insert the soldering lead 2 into the through hole to prevent the IC from falling over, and connect the other leads to the pads made on the printed circuit board using cream solder. Ru.
本発明のジグザグ型ＩＣは表面実装技術に対応したリー
ドの構造にすることによりプリント基板上でのパターン
を作成しやすいという効果がある。The zigzag type IC of the present invention has the effect of making it easy to create a pattern on a printed circuit board by having a lead structure compatible with surface mounting technology.
第１図は本発明の一実施例を示す斜視図、第２図は従来
の一例を示す斜視図である。１・・・・・・ＩＣ本体、２，２′・・・・・・半田付
用リード、３．４・・・・・・表面実装技術用リード。代理人 弁理士 内 原 音、１ｆ５１ ＠３５２図FIG. 1 is a perspective view showing an embodiment of the present invention, and FIG. 2 is a perspective view showing a conventional example. 1...IC body, 2,2'...lead for soldering, 3.4...lead for surface mounting technology. Agent Patent attorney Oto Uchihara, 1f51 @352 drawing
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32618387AJPH01166545A (en) | 1987-12-22 | 1987-12-22 | Zigzag type ic |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32618387AJPH01166545A (en) | 1987-12-22 | 1987-12-22 | Zigzag type ic |
| Publication Number | Publication Date |
|---|---|
| JPH01166545Atrue JPH01166545A (en) | 1989-06-30 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32618387APendingJPH01166545A (en) | 1987-12-22 | 1987-12-22 | Zigzag type ic |
| Country | Link |
|---|---|
| JP (1) | JPH01166545A (en) |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5319755A (en)* | 1990-04-18 | 1994-06-07 | Rambus, Inc. | Integrated circuit I/O using high performance bus interface |
| US5446317A (en)* | 1992-03-09 | 1995-08-29 | Fujitsu Limited | Single in-line package for surface mounting |
| US5574310A (en)* | 1991-05-17 | 1996-11-12 | Fujitsu Limited | Semiconductor package for surface mounting with reinforcing members on support legs |
| US5831332A (en)* | 1991-05-17 | 1998-11-03 | Fujitsu Limited | Semiconductor package for surface mounting |
| US6002589A (en)* | 1997-07-21 | 1999-12-14 | Rambus Inc. | Integrated circuit package for coupling to a printed circuit board |
| US6007357A (en)* | 1995-05-26 | 1999-12-28 | Rambus Inc. | Chip socket assembly and chip file assembly for semiconductor chips |
| US6234820B1 (en) | 1997-07-21 | 2001-05-22 | Rambus Inc. | Method and apparatus for joining printed circuit boards |
| US8096812B2 (en) | 1995-05-26 | 2012-01-17 | Rambus Inc. | Chip socket assembly and chip file assembly for semiconductor chips |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5657481A (en)* | 1990-04-18 | 1997-08-12 | Rambus, Inc. | Memory device with a phase locked loop circuitry |
| US5983320A (en)* | 1990-04-18 | 1999-11-09 | Rambus, Inc. | Method and apparatus for externally configuring and modifying the transaction request response characteristics of a semiconductor device coupled to a bus |
| US5473575A (en)* | 1990-04-18 | 1995-12-05 | Rambus, Inc. | Integrated circuit I/O using a high performance bus interface |
| US5499385A (en)* | 1990-04-18 | 1996-03-12 | Rambus, Inc. | Method for accessing and transmitting data to/from a memory in packets |
| US5513327A (en)* | 1990-04-18 | 1996-04-30 | Rambus, Inc. | Integrated circuit I/O using a high performance bus interface |
| US5319755A (en)* | 1990-04-18 | 1994-06-07 | Rambus, Inc. | Integrated circuit I/O using high performance bus interface |
| US5606717A (en)* | 1990-04-18 | 1997-02-25 | Rambus, Inc. | Memory circuitry having bus interface for receiving information in packets and access time registers |
| US5861669A (en)* | 1991-05-17 | 1999-01-19 | Fujitsu Limited | Semiconductor package for surface mounting |
| US5831332A (en)* | 1991-05-17 | 1998-11-03 | Fujitsu Limited | Semiconductor package for surface mounting |
| US5574310A (en)* | 1991-05-17 | 1996-11-12 | Fujitsu Limited | Semiconductor package for surface mounting with reinforcing members on support legs |
| US5728601A (en)* | 1992-03-09 | 1998-03-17 | Fujitsu Limited | Process for manufacturing a single in-line package for surface mounting |
| US5446317A (en)* | 1992-03-09 | 1995-08-29 | Fujitsu Limited | Single in-line package for surface mounting |
| US6007357A (en)* | 1995-05-26 | 1999-12-28 | Rambus Inc. | Chip socket assembly and chip file assembly for semiconductor chips |
| US6352435B1 (en) | 1995-05-26 | 2002-03-05 | Rambus, Inc. | Chip socket assembly and chip file assembly for semiconductor chips |
| US6589059B2 (en) | 1995-05-26 | 2003-07-08 | Rambus, Inc. | Chip socket assembly and chip file assembly for semiconductor chips |
| US6619973B2 (en) | 1995-05-26 | 2003-09-16 | Rambus, Inc. | Chip socket assembly and chip file assembly for semiconductor chips |
| US8096812B2 (en) | 1995-05-26 | 2012-01-17 | Rambus Inc. | Chip socket assembly and chip file assembly for semiconductor chips |
| US6002589A (en)* | 1997-07-21 | 1999-12-14 | Rambus Inc. | Integrated circuit package for coupling to a printed circuit board |
| US6234820B1 (en) | 1997-07-21 | 2001-05-22 | Rambus Inc. | Method and apparatus for joining printed circuit boards |
| US6447321B1 (en) | 1997-07-21 | 2002-09-10 | Rambus, Inc. | Socket for coupling an integrated circuit package to a printed circuit board |
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|---|---|---|
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