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JPH01165968U - - Google Patents

Info

Publication number
JPH01165968U
JPH01165968UJP6063888UJP6063888UJPH01165968UJP H01165968 UJPH01165968 UJP H01165968UJP 6063888 UJP6063888 UJP 6063888UJP 6063888 UJP6063888 UJP 6063888UJP H01165968 UJPH01165968 UJP H01165968U
Authority
JP
Japan
Prior art keywords
optical disk
protrusion
hole
storage case
protrusions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6063888U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filedfiledCritical
Priority to JP6063888UpriorityCriticalpatent/JPH01165968U/ja
Publication of JPH01165968UpublicationCriticalpatent/JPH01165968U/ja
Pendinglegal-statusCriticalCurrent

Links

Description

Translated fromJapanese
【図面の簡単な説明】[Brief explanation of the drawing]

第1図は第1実施例による要部斜視図、第2図
は第7図のB―B断面矢視図に相当する説明図、
第3図はデイスク駆動装置の一部切欠を含む概略
側面図、第4図はチヤツキング時とチヤツキング
解除時との説明図、第5図は第2実施例による要
部斜視図、第6図は第3実施例による要部斜視図
、第7図は光デイスクカートリツジの概略平面図
、第8図は第7図のA―A断面矢視図、第9図は
チヤツキング時とチヤツキング解除時との説明図
である。 1,30……光デイスクカートリツジ、2……
光デイスク、3……デイスク、4,5……ハブ、
6,31……ケース、7,32……上ケース、8
,33……下ケース、11……貫通穴、14a,
15a,36a……突起部、16……デイスク駆
動装置、32a,33a,34a……第1突起部
、32b,33b,34b……第2突起部、33
c,34c,36c……基底面。
FIG. 1 is a perspective view of essential parts according to the first embodiment, FIG. 2 is an explanatory diagram corresponding to the BB cross-sectional view in FIG. 7,
Fig. 3 is a schematic side view including a partial cutout of the disk drive device, Fig. 4 is an explanatory view of the disk drive device during chucking and when chucking is released, Fig. 5 is a perspective view of the main part according to the second embodiment, and Fig. 6 is FIG. 7 is a schematic plan view of the optical disk cartridge; FIG. 8 is a cross-sectional view taken along the line AA in FIG. 7; and FIG. FIG. 1,30...Optical disk cartridge, 2...
Optical disk, 3... disk, 4, 5... hub,
6, 31... Case, 7, 32... Upper case, 8
, 33...Lower case, 11...Through hole, 14a,
15a, 36a... protrusion, 16... disk drive device, 32a, 33a, 34a... first protrusion, 32b, 33b, 34b... second protrusion, 33
c, 34c, 36c...basal surface.

Claims (1)

Translated fromJapanese
【実用新案登録請求の範囲】1 箱形のケースで中央部に円形の貫通穴を有し
、それぞれ貫通穴の周囲に突起部を設け、その突
起部の頂部の間の所定の間隙に光デイスクを収納
し、前記突起部で前記光デイスクを支持する光デ
イスクカートリツジの収納ケースにおいて、少な
くとも一方の前記突起部の頂部に前記光デイスク
を支持させると、前記光デイスクが前記突起部の
基底面と離隔して傾斜する光デイスクカートリツ
ジの収納ケース。2 前記突起部は前記貫通穴の円周に沿つて設け
られた円筒であり、その頂部は2段になつている
請求項1記載の光デイスクカートリツジの収納ケ
ース。3 前記突起部は前記貫通穴の円周に沿つて設け
られた円筒であり、その頂部は傾斜した平面であ
る請求項1記載の光デイスクカートリツジの収納
ケース。
[Claims for Utility Model Registration] 1. A box-shaped case with a circular through hole in the center, protrusions around each through hole, and an optical disk inserted in a predetermined gap between the tops of the protrusions. In the storage case for an optical disk cartridge which accommodates an optical disk and supports the optical disk on the protrusion, when the optical disk is supported on the top of at least one of the protrusions, the optical disk is attached to the base surface of the protrusion. A storage case for optical disk cartridges that tilts away from the camera. 2. The storage case for an optical disk cartridge according to claim 1, wherein the protrusion is a cylinder provided along the circumference of the through hole, and the top thereof has two stages. 3. The storage case for an optical disk cartridge according to claim 1, wherein the protrusion is a cylinder provided along the circumference of the through hole, and the top thereof is an inclined plane.
JP6063888U1988-05-101988-05-10PendingJPH01165968U (en)

Priority Applications (1)

Application NumberPriority DateFiling DateTitle
JP6063888UJPH01165968U (en)1988-05-101988-05-10

Applications Claiming Priority (1)

Application NumberPriority DateFiling DateTitle
JP6063888UJPH01165968U (en)1988-05-101988-05-10

Publications (1)

Publication NumberPublication Date
JPH01165968Utrue JPH01165968U (en)1989-11-21

Family

ID=31286342

Family Applications (1)

Application NumberTitlePriority DateFiling Date
JP6063888UPendingJPH01165968U (en)1988-05-101988-05-10

Country Status (1)

CountryLink
JP (1)JPH01165968U (en)

Cited By (21)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US7321233B2 (en)1995-04-142008-01-22Cascade Microtech, Inc.System for evaluating probing networks
US7330041B2 (en)2004-06-142008-02-12Cascade Microtech, Inc.Localizing a temperature of a device for testing
US7330023B2 (en)1992-06-112008-02-12Cascade Microtech, Inc.Wafer probe station having a skirting component
US7348787B2 (en)1992-06-112008-03-25Cascade Microtech, Inc.Wafer probe station having environment control enclosure
US7352168B2 (en)2000-09-052008-04-01Cascade Microtech, Inc.Chuck for holding a device under test
US7368925B2 (en)2002-01-252008-05-06Cascade Microtech, Inc.Probe station with two platens
US7368927B2 (en)2004-07-072008-05-06Cascade Microtech, Inc.Probe head having a membrane suspended probe
US7403025B2 (en)2000-02-252008-07-22Cascade Microtech, Inc.Membrane probing system
US7436170B2 (en)1997-06-062008-10-14Cascade Microtech, Inc.Probe station having multiple enclosures
US7468609B2 (en)2003-05-062008-12-23Cascade Microtech, Inc.Switched suspended conductor and connection
US7492175B2 (en)2001-08-212009-02-17Cascade Microtech, Inc.Membrane probing system
US7492172B2 (en)2003-05-232009-02-17Cascade Microtech, Inc.Chuck for holding a device under test
US7498828B2 (en)2002-11-252009-03-03Cascade Microtech, Inc.Probe station with low inductance path
US7504823B2 (en)2004-06-072009-03-17Cascade Microtech, Inc.Thermal optical chuck
US7533462B2 (en)1999-06-042009-05-19Cascade Microtech, Inc.Method of constructing a membrane probe
US7541821B2 (en)1996-08-082009-06-02Cascade Microtech, Inc.Membrane probing system with local contact scrub
US7550984B2 (en)2002-11-082009-06-23Cascade Microtech, Inc.Probe station with low noise characteristics
US7554322B2 (en)2000-09-052009-06-30Cascade Microtech, Inc.Probe station
US7616017B2 (en)1999-06-302009-11-10Cascade Microtech, Inc.Probe station thermal chuck with shielding for capacitive current
US7639003B2 (en)2002-12-132009-12-29Cascade Microtech, Inc.Guarded tub enclosure
US9429638B2 (en)2008-11-212016-08-30Cascade Microtech, Inc.Method of replacing an existing contact of a wafer probing assembly

Cited By (31)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US7492147B2 (en)1992-06-112009-02-17Cascade Microtech, Inc.Wafer probe station having a skirting component
US7330023B2 (en)1992-06-112008-02-12Cascade Microtech, Inc.Wafer probe station having a skirting component
US7348787B2 (en)1992-06-112008-03-25Cascade Microtech, Inc.Wafer probe station having environment control enclosure
US7595632B2 (en)1992-06-112009-09-29Cascade Microtech, Inc.Wafer probe station having environment control enclosure
US7589518B2 (en)1992-06-112009-09-15Cascade Microtech, Inc.Wafer probe station having a skirting component
US7321233B2 (en)1995-04-142008-01-22Cascade Microtech, Inc.System for evaluating probing networks
US7541821B2 (en)1996-08-082009-06-02Cascade Microtech, Inc.Membrane probing system with local contact scrub
US7626379B2 (en)1997-06-062009-12-01Cascade Microtech, Inc.Probe station having multiple enclosures
US7436170B2 (en)1997-06-062008-10-14Cascade Microtech, Inc.Probe station having multiple enclosures
US7533462B2 (en)1999-06-042009-05-19Cascade Microtech, Inc.Method of constructing a membrane probe
US7616017B2 (en)1999-06-302009-11-10Cascade Microtech, Inc.Probe station thermal chuck with shielding for capacitive current
US7403025B2 (en)2000-02-252008-07-22Cascade Microtech, Inc.Membrane probing system
US7423419B2 (en)2000-09-052008-09-09Cascade Microtech, Inc.Chuck for holding a device under test
US7352168B2 (en)2000-09-052008-04-01Cascade Microtech, Inc.Chuck for holding a device under test
US7501810B2 (en)2000-09-052009-03-10Cascade Microtech, Inc.Chuck for holding a device under test
US7514915B2 (en)2000-09-052009-04-07Cascade Microtech, Inc.Chuck for holding a device under test
US7518358B2 (en)2000-09-052009-04-14Cascade Microtech, Inc.Chuck for holding a device under test
US7554322B2 (en)2000-09-052009-06-30Cascade Microtech, Inc.Probe station
US7492175B2 (en)2001-08-212009-02-17Cascade Microtech, Inc.Membrane probing system
US7368925B2 (en)2002-01-252008-05-06Cascade Microtech, Inc.Probe station with two platens
US7550984B2 (en)2002-11-082009-06-23Cascade Microtech, Inc.Probe station with low noise characteristics
US7498828B2 (en)2002-11-252009-03-03Cascade Microtech, Inc.Probe station with low inductance path
US7639003B2 (en)2002-12-132009-12-29Cascade Microtech, Inc.Guarded tub enclosure
US7468609B2 (en)2003-05-062008-12-23Cascade Microtech, Inc.Switched suspended conductor and connection
US7492172B2 (en)2003-05-232009-02-17Cascade Microtech, Inc.Chuck for holding a device under test
US7876115B2 (en)2003-05-232011-01-25Cascade Microtech, Inc.Chuck for holding a device under test
US7504823B2 (en)2004-06-072009-03-17Cascade Microtech, Inc.Thermal optical chuck
US7330041B2 (en)2004-06-142008-02-12Cascade Microtech, Inc.Localizing a temperature of a device for testing
US7368927B2 (en)2004-07-072008-05-06Cascade Microtech, Inc.Probe head having a membrane suspended probe
US7514944B2 (en)2004-07-072009-04-07Cascade Microtech, Inc.Probe head having a membrane suspended probe
US9429638B2 (en)2008-11-212016-08-30Cascade Microtech, Inc.Method of replacing an existing contact of a wafer probing assembly

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