【発明の詳細な説明】〔概要〕電子部品のピンを半田槽に浸漬して半田付けする予備半
田ディップ方法に関し、電子部品の予備半田の量を一定化にすることを目的とし
、電子部品を位置決め枠で包囲し、半田槽に浸漬させて電
子部品のピンに予備半田を行なう予備半田ディップ方法
において、ボードが有すピン配置と同配置のピン挿入穴
に半田を充填しておき、後に充填された半田を加熱して
電子部品のピンに予備半田を行なうものである。[Detailed Description of the Invention] [Summary] Regarding the pre-soldering dipping method in which the pins of electronic components are immersed in a solder bath and soldered, the purpose is to keep the amount of pre-solder constant for electronic components. In the pre-solder dipping method, which pre-solders the pins of electronic components by enclosing them in a positioning frame and immersing them in a solder bath, the pin insertion holes in the same layout as the pins of the board are filled with solder, and the pins are then filled with solder. The solder is heated to pre-solder the pins of electronic components.
本発明は予備半田ディップ方法に係り、特に電子部品の
ピンを半田槽に浸漬して半田付けする予備半田ディップ
方法に関するものである。The present invention relates to a preliminary solder dipping method, and more particularly to a preliminary solder dipping method in which pins of electronic components are immersed in a solder bath and soldered.
近年、半導体部門の発展に伴い、高密度実装化のため第
３図（ａ）に示す様に、フラット・リード・パッケージ
から第３図（ト））に示す様に、リード端子の形態が真
直ぐなものになり、且つパンケージの裏面に隙間なく整
列された所謂シングル・マイクロ・パッケージ（以下、
ＳＭＰと呼ぶ）に移り変わりつつある。In recent years, with the development of the semiconductor sector, the form of lead terminals has changed from flat lead packages, as shown in Figure 3 (a), to straight lead terminals, as shown in Figure 3 (g), in order to achieve higher density packaging. So-called single micro packages (hereinafter referred to as
(called SMP).
以下、従来の予備半田ディップ方法を第４図を用いて説
明する。The conventional preliminary solder dipping method will be explained below with reference to FIG.
従来の予備半田ディップ方法は、まず位置決め枠２に取
付られたガイド２ａでＳＭＰ １が所望の位置に来るよ
うに誘導する。ここでＳＭＰ １が所望の位置にきたと
き、予め位置決め枠２に係合されている半田昇り防止板
６がＳＭＰ １のピン３に被せられる。この後、半田槽
７にＳＭＰ １のピン３の先端を浸漬し、ピン３の先端
に予備半田ディップを行っていた。In the conventional preliminary solder dipping method, first, the SMP 1 is guided to a desired position using a guide 2a attached to a positioning frame 2. Here, when the SMP 1 is at the desired position, the solder rise prevention plate 6, which has been engaged with the positioning frame 2 in advance, is placed over the pin 3 of the SMP 1. Thereafter, the tips of the pins 3 of the SMP 1 were immersed in the solder bath 7, and the tips of the pins 3 were pre-dipped with solder.
しかしながら従来の予備半田ディップ方法では、半田槽
へのピンの浸漬の量によって予備半田の量がバラツキ易
く、又ピンに被せた予備半田昇り防止板に予備半田が付
着すると、抜けにくくなくなるという欠点があった。However, with the conventional pre-solder dipping method, the amount of pre-solder tends to vary depending on the amount of the pin immersed in the solder bath, and if the pre-solder adheres to the pre-solder prevention plate placed over the pin, it becomes difficult to remove. there were.
従って本発明はかかる問題点を解決すると共に、電子部
品の予備半田の量を一定化にすることを目的とするもの
である。Therefore, it is an object of the present invention to solve these problems and to make the amount of preliminary solder for electronic components constant.
このために本発明では、電子部品１を位置決め枠２で包
囲し、半田槽７に浸漬させて電子部品１のピン３に予備
半田を行なう予備半田ディップ方法において、ボード５
が有すピン配置と同配置のピン挿入穴４に半田を充填し
ておき、後に充填された半田を加熱して電子部品１のピ
ン３に予備半田を行なうことにより目的を達成できる。For this reason, in the present invention, in a pre-solder dipping method in which the electronic component 1 is surrounded by the positioning frame 2 and immersed in the solder bath 7 to pre-solder the pins 3 of the electronic component 1, the board 5 is
The purpose can be achieved by filling the pin insertion holes 4 with solder in the same arrangement as the pin arrangement of the electronic component 1, and later heating the filled solder to pre-solder the pins 3 of the electronic component 1.
以上の如く本発明によれば、予めボード５を半田槽７に
浸漬しておくことにより、半田をボード５の厚みだけピ
ン挿入穴４に充填できるため常に半田を一定化できる。As described above, according to the present invention, by immersing the board 5 in the solder tank 7 in advance, the solder can be filled into the pin insertion holes 4 by the thickness of the board 5, so that the solder can always be kept constant.
以下、本発明の一実施例を第１図及び第２図を参照しつ
つ詳細に説明する。Hereinafter, one embodiment of the present invention will be described in detail with reference to FIGS. 1 and 2.
第１図は本発明の構造を示す図である。FIG. 1 is a diagram showing the structure of the present invention.
位置決め枠２に接着剤、ネジ止め等で固定したボード５
に形成されたピン挿入穴４はＳＭＰ １のピン配置と同
配置であり、且つピン３よりは多少径が大きく、更にピ
ン挿入穴の内径は半田が付着し易いように金メンキされ
ている。又、位置決め枠２にはピン３とピン挿入穴４の
位置合わせ用のガイド２ａが設けられている。Board 5 fixed to positioning frame 2 with adhesive, screws, etc.
The pin insertion holes 4 formed in the SMP 1 have the same arrangement as the pins of the SMP 1, and have a somewhat larger diameter than the pins 3, and the inner diameter of the pin insertion holes is gold-plated to facilitate the adhesion of solder. Further, the positioning frame 2 is provided with a guide 2a for positioning the pin 3 and the pin insertion hole 4.
尚、ボード５本体は半田が付着しないように、ステンレ
ス製等で構成されたものであることも記しておく。It should also be noted that the main body of the board 5 is made of stainless steel or the like to prevent solder from adhering to it.
次に第２図（ａｌ〜（ｄｌを用いて本発明の作業手順を
説明する。Next, the working procedure of the present invention will be explained using FIGS. 2(al to dl).
（ａ） 半田槽７の中の溶融半田にボード５全体を浸
漬する。(a) The entire board 5 is immersed in molten solder in the solder bath 7.
（ｂｌ 半田槽７からボード５を引き上げる。この時
、ガイド２ａ内の余分な半田は位置決め枠２に形成され
た窓８から外部に放出される。これにより、ボード５の
ピン挿入穴４に半田が充填される。(bl) Pull up the board 5 from the solder tank 7. At this time, excess solder in the guide 2a is discharged to the outside from the window 8 formed in the positioning frame 2. is filled.
（Ｃ） ボード５を加熱板９に実装後、位置決め枠２
に形成されたガイド２ａに従って、ＳＭＰＩを位置合わ
せする。(C) After mounting the board 5 on the heating plate 9, positioning frame 2
The SMPI is aligned according to the guide 2a formed in the guide 2a.
（ｄｌ この加熱板９を図示しない発熱器等で加熱さ
せることにより、ピン挿入穴４に充填された半田が溶解
してピン３に予備半田付けされる。(dl) By heating the heating plate 9 with a heater (not shown), the solder filled in the pin insertion holes 4 is melted and the pins 3 are preliminarily soldered.
以上説明したように本発明によって、半田上がり等によ
るブリッジ等の不良がなくなり、又ピンの予備半田量も
安定して得られるので、信頼性が向上する。As explained above, according to the present invention, defects such as bridges due to solder build-up are eliminated, and the amount of preliminary solder on the pins can be stably obtained, so that reliability is improved.
第１図は本発明の構造を示す図である。第２図は本発明の予備半田ディップ装置による作業手順
を示す図である。第３図（ａｌはフラット・リード・パッケージ、同図（
ｂｌはシングル・リード・パッケージの側面図及び裏面
図をそれぞれ示す。第４図は従来の予備半田ディップ方法を示す図である。図において、１・−・電子部品（ＳＭＰ １） 、２−
位置決め枠、２ａ−ガイド、３−・−ピン、４−ビン挿
入穴、５・−ボード、６−半田昇り防止板、７−半田槽
、８−窓、９−加熱板裏面図（ｂ）不発明［檎遣図等１ 図FIG. 1 is a diagram showing the structure of the present invention. FIG. 2 is a diagram showing a working procedure using the preliminary solder dipping device of the present invention. Figure 3 (al is a flat lead package, the figure (
bl shows a side view and a back view of a single lead package, respectively. FIG. 4 is a diagram showing a conventional preliminary solder dipping method. In the figure, 1--Electronic component (SMP 1), 2-
Positioning frame, 2a-guide, 3--pin, 4-bin insertion hole, 5-board, 6-solder rise prevention plate, 7-solder tank, 8-window, 9-heating plate back view (b) Invention [Explanatory diagram etc. 1 Figure
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27632687AJPH01118364A (en) | 1987-10-30 | 1987-10-30 | Preliminary solder dipping method |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27632687AJPH01118364A (en) | 1987-10-30 | 1987-10-30 | Preliminary solder dipping method |
| Publication Number | Publication Date |
|---|---|
| JPH01118364Atrue JPH01118364A (en) | 1989-05-10 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27632687APendingJPH01118364A (en) | 1987-10-30 | 1987-10-30 | Preliminary solder dipping method |
| Country | Link |
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| JP (1) | JPH01118364A (en) |
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